The Microstructure of Sintered Silver Electrodes

1969 ◽  
Vol 116 (12) ◽  
pp. 1633
Author(s):  
Charles P. Wales
Keyword(s):  
Silver Electrodes ◽  
Sintered Silver

scholarly journals Fabrication of Porous Silicon Based Humidity Sensing Elements on Paper

2015 ◽  
Vol 2015 ◽  
pp. 1-10 ◽  
Author(s):  
Tero Jalkanen ◽  
Anni Määttänen ◽  
Ermei Mäkilä ◽  
Jaani Tuura ◽  
Martti Kaasalainen ◽  
...  
Keyword(s):  
Porous Silicon ◽  
Smart Cities ◽  
Low Cost ◽  
Electrical Characterization ◽  
Fabrication Process ◽  
Sensing Element ◽  
Paper Substrate ◽  
Roll To Roll ◽  
Silver Electrodes ◽  
Silicon Based

A roll-to-roll compatible fabrication process of porous silicon (pSi) based sensing elements for a real-time humidity monitoring is described. The sensing elements, consisting of printed interdigitated silver electrodes and a spray-coated pSi layer, were fabricated on a coated paper substrate by a two-step process. Capacitive and resistive responses of the sensing elements were examined under different concentrations of humidity. More than a three orders of magnitude reproducible decrease in resistance was measured when the relative humidity (RH) was increased from 0% to 90%. A relatively fast recovery without the need of any refreshing methods was observed with a change in RH. Humidity background signal and hysteresis arising from the paper substrate were dependent on the thickness of sensing pSi layer. Hysteresis in most optimal sensing element setup (a thick pSi layer) was still noticeable but not detrimental for the sensing. In addition to electrical characterization of sensing elements, thermal degradation and moisture adsorption properties of the paper substrate were examined in connection to the fabrication process of the silver electrodes and the moisture sensitivity of the paper. The results pave the way towards the development of low-cost humidity sensors which could be utilized, for example, in smart packaging applications or in smart cities to monitor the environment.

scholarly journals Antibacterial Effects of Silver Electrodes with Weak Direct Current

1974 ◽  
Vol 6 (5) ◽  
pp. 637-642 ◽  
Author(s):  
J. A. Spadaro ◽  
T. J. Berger ◽  
S. D. Barranco ◽  
S. E. Chapin ◽  
R. O. Becker
Keyword(s):  
Direct Current ◽  
Antibacterial Effects ◽  
Silver Electrodes

Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling

2021 ◽  
Author(s):  
Fei Qin ◽  
Shuai Zhao ◽  
Yanwei Dai ◽  
Lingyun Liu ◽  
Tong An ◽  
...  
Keyword(s):  
Thermal Cycling ◽  
Young’S Modulus ◽  
Mechanical Performance ◽  
Young's Modulus ◽  
Silver Layer ◽  
Thermal Cycles ◽  
Nano Indentation ◽  
Die Attach ◽  
Indentation Tests ◽  
Sintered Silver

Abstract Thermo-mechanical reliability assessment for sintered silver is a crucial issue as sintered silver is a promising candidate of die-attachment materials for power devices. In this paper, the nano-indentation tests are performed for sintered silver in typical die-attach interconnection under different thermal cycles. Based on thermal cycling test, the Young's modulus and hardness of sintered silver layer have been presented. It is found that the Young's modulus and hardness of sintered silver layer changes slightly although the microstructure of sintered silver also presents some variations. The stress and strain curves for different thermal cycling tests for sintered silver based on reverse analysis of nano-indentation are also given. The results show that the elastoplastic constitutive equations change significantly after thermal cycling tests, and the yielding stress decreases remarkably after 70 thermal cycles. The experimental investigation also show that the cracking behaviors of sintered silver depends on its geometry characteristics, which implies that the possible optimization of sintered silver layer could enhance its thermo-mechanical performance.

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