The Role of SPS, MPSA, and Chloride in Additive Systems for Copper Electrodeposition

2007 ◽  
Vol 154 (2) ◽  
pp. D78 ◽  
Author(s):  
Min Tan ◽  
Clint Guymon ◽  
Dean R. Wheeler ◽  
John N. Harb
Keyword(s):  
Copper Electrodeposition

scholarly journals Role of Copper Electrodeposition Additives for Via-Filling.

2000 ◽  
Vol 3 (7) ◽  
pp. 607-612 ◽  
Author(s):  
Kazuo KONDO ◽  
Katsuhiko HAYASHI ◽  
Zennosuke TANAKA ◽  
Norihiro YAMAKAWA
Keyword(s):  
Copper Electrodeposition

Role of Cuprous Ion in Copper Electrodeposition Acceleration - a Rotating Ring Disk Study

2015 ◽  
Vol 64 (40) ◽  
pp. 35-40
Author(s):  
K. Nishimura ◽  
S. Matsuura ◽  
T. Hayashi ◽  
K. Kondo ◽  
M. Yokoi ◽  
...  
Keyword(s):  
Copper Electrodeposition ◽  
Cuprous Ion

Role of Cuprous Ion in Copper Electrodeposition Acceleration

2015 ◽  
Vol 162 (6) ◽  
pp. D199-D203 ◽  
Author(s):  
Taro Hayashi ◽  
Shogo Matsuura ◽  
Kazuo Kondo ◽  
Kentaro Kataoka ◽  
Kohei Nishimura ◽  
...  
Keyword(s):  
Copper Electrodeposition ◽  
Cuprous Ion

The Role of Surface Active States in Copper Electrodeposition in Acid Solution.

2019 ◽  
Vol 2 (6) ◽  
pp. 197-207 ◽  
Author(s):  
Laurence D. Burke ◽  
Claire Buckley ◽  
Rezwana Sharna
Keyword(s):  
Acid Solution ◽  
Copper Electrodeposition ◽  
Surface Active

Interface dynamics for copper electrodeposition: The role of organic additives in the growth mode

2002 ◽  
Vol 66 (4) ◽  
Author(s):  
Pablo F. J. de Leon ◽  
Ezequiel V. Albano ◽  
R. C. Salvarezza ◽  
H. G. Solari
Keyword(s):  
Growth Mode ◽  
Copper Electrodeposition ◽  
Organic Additives ◽  
Interface Dynamics

scholarly journals Copper Electrodeposition Kinetics Measured by Alternating Current Voltammetry and the Role of Ferrous Species

2015 ◽  
Vol 163 (2) ◽  
pp. D17-D23 ◽  
Author(s):  
Mary-Elizabeth Wagner ◽  
Rodrigo Valenzuela ◽  
Tomás Vargas ◽  
Melanie Colet-Lagrille ◽  
Antoine Allanore
Keyword(s):  
Alternating Current ◽  
Copper Electrodeposition ◽  
Alternating Current Voltammetry
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