A Mathematical Model for Chemical Vapor Deposition Processes Influenced by Surface Reaction Kinetics: Application to Low‐Pressure Deposition of Tungsten

Rikhit Arora; Richard Pollard

doi:10.1149/1.2085820

A Mathematical Model for Chemical Vapor Deposition Processes Influenced by Surface Reaction Kinetics: Application to Low‐Pressure Deposition of Tungsten

Journal of The Electrochemical Society ◽

10.1149/1.2085820 ◽

1991 ◽

Vol 138 (5) ◽

pp. 1523-1537 ◽

Cited By ~ 50

Author(s):

Rikhit Arora ◽

Richard Pollard

Keyword(s):

Mathematical Model ◽

Chemical Vapor Deposition ◽

Reaction Kinetics ◽

Vapor Deposition ◽

Surface Reaction ◽

Chemical Vapor ◽

Low Pressure ◽

Deposition Processes ◽

Surface Reaction Kinetics

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An Approach for Modeling Surface Reaction Kinetics in Chemical Vapor Deposition Processes

Journal of The Electrochemical Society ◽

10.1149/1.2048645 ◽

1995 ◽

Vol 142 (5) ◽

pp. 1712-1725 ◽

Cited By ~ 19

Author(s):

Yong‐Fa Wang ◽

Richard Pollard

Keyword(s):

Chemical Vapor Deposition ◽

Reaction Kinetics ◽

Vapor Deposition ◽

Surface Reaction ◽

Chemical Vapor ◽

Deposition Processes ◽

Surface Reaction Kinetics

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Reactive force-field molecular dynamics simulation for the surface reaction of SiH (x = 2–4) species on Si(1 0 0)-(2 × 1):H surfaces in chemical vapor deposition processes

Computational Materials Science ◽

10.1016/j.commatsci.2022.111193 ◽

2022 ◽

Vol 204 ◽

pp. 111193

Author(s):

Naoya Uene ◽

Takuya Mabuchi ◽

Masaru Zaitsu ◽

Shigeo Yasuhara ◽

Takashi Tokumasu

Keyword(s):

Molecular Dynamics ◽

Chemical Vapor Deposition ◽

Molecular Dynamics Simulation ◽

Force Field ◽

Vapor Deposition ◽

Surface Reaction ◽

Chemical Vapor ◽

Dynamics Simulation ◽

Reactive Force ◽

Deposition Processes

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Comparative Study of the Low Pressure Chemical Vapor Deposition Processes of W and Mo

Journal of The Electrochemical Society ◽

10.1149/1.2096141 ◽

1988 ◽

Vol 135 (7) ◽

pp. 1832-1836 ◽

Cited By ~ 20

Author(s):

N. Lifshitz ◽

M. L. Green

Keyword(s):

Chemical Vapor Deposition ◽

Comparative Study ◽

Vapor Deposition ◽

Chemical Vapor ◽

Low Pressure ◽

Pressure Chemical ◽

Deposition Processes

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LOW-PRESSURE CHEMICAL VAPOR DEPOSITION PROCESSES

Handbook of Quality Integrated Circuit Manufacturing ◽

10.1016/b978-0-12-781870-2.50012-9 ◽

1991 ◽

pp. 302-360

Author(s):

ROBERT ZORICH

Keyword(s):

Chemical Vapor Deposition ◽

Vapor Deposition ◽

Chemical Vapor ◽

Low Pressure ◽

Pressure Chemical ◽

Deposition Processes

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The PROMPT project and its application to the three-dimensional simulation of low-pressure chemical vapor deposition processes

Solid-State Electronics ◽

10.1016/s0038-1101(97)00003-8 ◽

1997 ◽

Vol 41 (7) ◽

pp. 939-943

Author(s):

E Bär ◽

J Lorenz

Keyword(s):

Chemical Vapor Deposition ◽

Vapor Deposition ◽

Three Dimensional ◽

Chemical Vapor ◽

Low Pressure ◽

Pressure Chemical ◽

Deposition Processes ◽

Dimensional Simulation

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Reaction kinetics and transport phenomena underlying the low-pressure metalorganic chemical vapor deposition of GaAs

Journal of Crystal Growth ◽

10.1016/0022-0248(96)00277-1 ◽

1996 ◽

Vol 167 (3-4) ◽

pp. 543-556 ◽

Cited By ~ 30

Author(s):

N.K. Ingle ◽

C. Theodoropoulos ◽

T.J. Mountziaris ◽

R.M. Wexler ◽

F.T.J. Smith

Keyword(s):

Chemical Vapor Deposition ◽

Reaction Kinetics ◽

Vapor Deposition ◽

Metalorganic Chemical Vapor Deposition ◽

Transport Phenomena ◽

Chemical Vapor ◽

Low Pressure ◽

Metalorganic Chemical

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Influence of surface‐activated reaction kinetics on low‐pressure chemical vapor deposition conformality over micro features

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films ◽

10.1116/1.578723 ◽

1993 ◽

Vol 11 (1) ◽

pp. 78-86 ◽

Cited By ~ 16

Author(s):

Julian J. Hsieh

Keyword(s):

Chemical Vapor Deposition ◽

Reaction Kinetics ◽

Vapor Deposition ◽

Chemical Vapor ◽

Low Pressure ◽

Pressure Chemical ◽

Micro Features

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Evaluation of corrosion behaviour of tantalum coating obtained by low pressure chemical vapor deposition using electrochemical polarization

Journal de Physique IV (Proceedings) ◽

10.1051/jp4:20020079 ◽

2002 ◽

Vol 12 (4) ◽

pp. 69-74 ◽

Cited By ~ 2

Author(s):

A. Levesque ◽

A. Bouteville ◽

H. de Baynast ◽

B. Laveissière

Keyword(s):

Chemical Vapor Deposition ◽

Vapor Deposition ◽

Corrosion Behaviour ◽

Chemical Vapor ◽

Low Pressure ◽

Electrochemical Polarization ◽

Pressure Chemical

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ANALYSIS OF HEAT AND MASS TRANSFER DURING MULTI-WAFER LOW PRESSURE CHEMICAL VAPOR DEPOSITION PROCESS

Proceeding of International Heat Transfer Conference 11 ◽

10.1615/ihtc11.240 ◽

1998 ◽

Author(s):

K.S. Park ◽

M. Choi

Keyword(s):

Mass Transfer ◽

Chemical Vapor Deposition ◽

Heat And Mass Transfer ◽

Vapor Deposition ◽

Chemical Vapor ◽

Deposition Process ◽

Low Pressure ◽

Chemical Vapor Deposition Process ◽

Pressure Chemical ◽

Vapor Deposition Process

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Electrical Properties of 10-50 nm TEOS (Tetraethoxysilane) LPCVD (Low Pressure Chemical Vapor Deposition) Films.

10.21236/ada146416 ◽

1984 ◽

Author(s):

R. H. Vogel ◽

S. R. Butler ◽

F. J. Feigl

Keyword(s):

Chemical Vapor Deposition ◽

Electrical Properties ◽

Vapor Deposition ◽

Chemical Vapor ◽

Low Pressure ◽

Pressure Chemical

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