Effects of Oxygen Reduction on Nickel Deposition from Unbuffered Aqueous Solutions: I . Deposition Process and Deposit Structure

1994 ◽  
Vol 141 (8) ◽  
pp. 2030-2035 ◽  
Author(s):  
C. Q. Cui ◽  
Jim Y. Lee
Keyword(s):  
Aqueous Solutions ◽  
Oxygen Reduction ◽  
Deposition Process ◽  
Nickel Deposition ◽  
Deposit Structure

Experimental and Numerical Analysis of the Nickel Deposition and Diffusion Using Plasma in a Confined Anode-Cathode Configuration

2009 ◽  
Vol 283-286 ◽  
pp. 183-189 ◽  
Author(s):  
Rodrigo Perito Cardoso ◽  
A.M. Maliska ◽  
C.R. Maliska
Keyword(s):  
Deposition Process ◽  
Interstitial Free ◽  
Cathode Voltage ◽  
Nickel Deposition ◽  
Plasma Sintering ◽  
Pulsed Dc ◽  
Proposed Model ◽  
Constant Rate ◽  
Experimental Values ◽  
Volume Method

This work presents a theoretical and experimental study of nickel deposition on iron samples at relatively high pressure using a pulsed DC glow discharge. The deposition process was conducted in conditions similar to that used for plasma sintering, using the confined anode-cathode configuration. The cathode was made from nickel commercially pure and the samples were made from interstitial free steel and sintered pure iron. The samples were characterized by mass weight gain, scanning electron microscopy and energy-dispersive X-ray microanalysis. The deposition process was mathematically modeled and the model was numerically solved using a conservative finite-volume method. The experiments demonstrated that the deposition occurs at a constant rate, with the mass flux changing linearly with the cathode voltage in the range of parameters considered. The results obtained from the diffusion model applied to the sample presented good agreement with the experimental values. Concerning the gas phase, the proposed model helped us to clarify some phenomenological aspects of the process. However, further studies, principally in the area of electrical discharges, are needed to permit a complete comprehension of this process.

Controlled Formation of Quantum Size Metal and Semiconductor Particles from Aqueous Solutions

1990 ◽  
Vol 206 ◽  
Author(s):  
Ramesh C. Patel ◽  
Jovan Nedeljkovic ◽  
Olga Micic
Keyword(s):  
Aqueous Solutions ◽  
Chemical Reduction ◽  
Deposition Process ◽  
Metallic Silver ◽  
Uniform Size ◽  
Quantum Size ◽  
Spherical Silica ◽  
Reduction Methods ◽  
Spherical Silica Particles ◽  
Excimer Laser Irradiation

ABSTRACTPhotochemical and chemical reduction methods are described for the controlled formation of metallic silver in aqueous solutions. The former approach is capable of generally depositing a number of metals. When spherical silver bromide particles are the substrates, the resulting silver coated composite particles exhibit optical absorption spectra which vary with the coat thickness as theoretically predicted. In the case of spherical silica particles of uniform size, it was possible to produce both quantum size silver particles supported on silica, as well as a silver coat of variable thickness, depending on the rate of the deposition process. In addition to silica, substrates such as latex and chromium hydroxide could be used.CdS particles with two different particle diameters (50–200 Å and < 30 Å) were subjected to 308 nm excimer laser irradiation at 77 K, and the subsequent charge carrier processes studied by ESR. Dramatic differences in the ESR signals as a function of decreasing particle size could be observed, consistent with the localization of charge carriers on numerous surface sites.

Effects of the Substitution of Β-Site Ion on Oxygen Reduction Electrode Properties of Pb2Ru2O7- δ in Aqueous Solutions

2007 ◽  
pp. 171-174
Author(s):  
Kenji Yoshihara ◽  
Yoshinobu Saito ◽  
Morihiro Saito ◽  
Jun Kuwano ◽  
Hidenobu Shiroishi
Keyword(s):  
Aqueous Solutions ◽  
Oxygen Reduction

Oxygen reduction catalyzed by a water-soluble binuclear copper(ii) complex from a neutral aqueous solution

2017 ◽  
Vol 53 (22) ◽  
pp. 3189-3192 ◽  
Author(s):  
Chengyu Liu ◽  
Haitao Lei ◽  
Zongyao Zhang ◽  
Fangfang Chen ◽  
Rui Cao
Keyword(s):  
Aqueous Solution ◽  
Aqueous Solutions ◽  
Oxygen Reduction ◽  
Water Soluble ◽  
Binuclear Copper ◽  
Neutral Aqueous Solution

A water-soluble binuclear CuII complex of a polypyridine–polyamide ligand can catalyze oxygen reduction to water from neutral aqueous solutions.

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