GaN LED on Quartz Substrate through Wafer Bonding and Layer Transfer Processes

2018 ◽  
Vol 86 (5) ◽  
pp. 31-36
Author(s):  
Kwang Hong Lee ◽  
Yue Wang ◽  
Li Zhang ◽  
Soo Jin Chua ◽  
Eugene A. Fitzgerald ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Quartz Substrate ◽  
Layer Transfer ◽  
Transfer Processes ◽  
Gan Led

scholarly journals Horizontal versus vertical charge and energy transfer in hybrid assemblies of semiconductor nanoparticles

2012 ◽  
Vol 3 ◽  
pp. 629-636 ◽  
Author(s):  
Gilad Gotesman ◽  
Rahamim Guliamov ◽  
Ron Naaman
Keyword(s):  
Energy Transfer ◽  
Charge Transfer ◽  
Horizontal Plane ◽  
Quartz Substrate ◽  
Vertical Direction ◽  
Time Resolved ◽  
Transfer Processes ◽  
Donor And Acceptor ◽  
Hybrid Assemblies ◽  
Time Resolved Photoluminescence

We studied the photoluminescence and time-resolved photoluminescence from self-assembled bilayers of donor and acceptor nanoparticles (NPs) adsorbed on a quartz substrate through organic linkers. Charge and energy transfer processes within the assemblies were investigated as a function of the length of the dithiolated linker (DT) between the donors and acceptors. We found an unusual linker-length-dependency in the emission of the donors. This dependency may be explained by charge and energy transfer processes in the vertical direction (from the donors to the acceptors) that depend strongly on charge transfer processes occurring in the horizontal plane (within the monolayer of the acceptor), namely, parallel to the substrate.

Porous Silicon Films for Thin Film Layer Transfer Applications and Wafer Bonding

2019 ◽  
Vol 33 (4) ◽  
pp. 195-206 ◽  
Author(s):  
Monali Joshi ◽  
Song Jun Hu ◽  
Mark S. Goorsky
Keyword(s):  
Thin Film ◽  
Porous Silicon ◽  
Wafer Bonding ◽  
Silicon Films ◽  
Layer Transfer ◽  
Thin Film Layer ◽  
Film Layer
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