Quality Control of Bond Strength in Low-Temperature Bonded Wafers

2013 ◽  
Vol 50 (7) ◽  
pp. 253-262
Author(s):  
J. Siegert ◽  
C. Cassidy ◽  
F. Schrank ◽  
R. Gerbach ◽  
B. Boettge ◽  
...  
Keyword(s):  
Quality Control ◽  
Low Temperature ◽  
Bond Strength

Sol-Gel Coating Facilitating Si-to-Si Wafer Bonding at Low Temperature

2005 ◽  
Author(s):  
J. Wei ◽  
S. S. Deng ◽  
C. M. Tan
Keyword(s):  
Low Temperature ◽  
Bond Strength ◽  
Wafer Bonding ◽  
Intermediate Layer ◽  
Bonding Temperature ◽  
Sol Gel ◽  
Bond Quality ◽  
Bubble Generation ◽  
High Bond ◽  
High Bond Strength

Silicon-to-silicon wafer bonding by sol-gel intermediate layer has been performed using acid-catalyzed tetraethylthosilicate-ethanol-water sol solution. High bond strength near to the fracture strength of bulk silicon is obtained at low temperature, for example 100°C. However, The bond efficiency and bond strength of this intermediate layer bonding sharply decrease when the bonding temperature increases to elevated temperature, such as 300 °C. The degradation of bond quality is found to be related to the decomposition of residual organic species at elevated bonding temperature. The bubble generation and the mechanism of the high bond strength at low temperature are exploited.

scholarly journals Resin Cement–Zirconia Bond Strengthening by Exposure to Low-Temperature Atmospheric Pressure Multi-Gas Plasma

Materials ◽  
2022 ◽  
Vol 15 (2) ◽  
pp. 631
Author(s):  
Nobuhiro Yoda ◽  
Yuri Abe ◽  
Yuma Suenaga ◽  
Yoshiki Matsudate ◽  
Tomohiro Hoshino ◽  
...  
Keyword(s):  
Treatment Group ◽  
Low Temperature ◽  
Bond Strength ◽  
Plasma Treatment ◽  
Atmospheric Pressure ◽  
Untreated Group ◽  
Resin Cement ◽  
Carbon Contamination ◽  
X Ray ◽  
Plasma Irradiation

The purpose of this study was to investigate the effect of gas species used for low-temperature atmospheric pressure plasma surface treatment, using various gas species and different treatment times, on zirconia surface state and the bond strength between zirconia and dental resin cement. Three groups of zirconia specimens with different surface treatments were prepared as follows: untreated group, alumina sandblasting treatment group, and plasma treatment group. Nitrogen (N2), carbon dioxide (CO2), oxygen (O2), argon (Ar), and air were employed for plasma irradiation. The bond strength between each zirconia specimen and resin cement was compared using a tension test. The effect of the gas species for plasma irradiation on the zirconia surface was investigated using a contact angle meter, an optical interferometer, an X-ray diffractometer, and X-ray photoelectric spectroscopy. Plasma irradiation increased the wettability and decreased the carbon contamination on the zirconia surface, whereas it did not affect the surface topography and crystalline phase. The bond strength varied depending on the gas species and irradiation time. Plasma treatment with N2 gas significantly increased bond strength compared to the untreated group and showed a high bond strength equivalent to that of the sandblasting treatment group. The removal of carbon contamination from the zirconia surface and an increase in the percentage of Zr-O2 on the zirconia surface by plasma irradiation might increase bond strength.

scholarly journals Replica of Sink Ability Test with Beeker Test

2020 ◽  
Vol 3 (12) ◽  
pp. 92-94
Author(s):  
Sreenivasa Rao Pagolu
Keyword(s):  
Surface Tension ◽  
Quality Control ◽  
Low Temperature ◽  
Winter Season ◽  
Ability Test ◽  
Control Team ◽  
Break Surface ◽  
New Formulation

The sink-ability test is to be carried out frequently for the pellets made during winter season, since surface tension of water during low temperature is high. Pellets have to break surface tension to sink into the water. This test will be carried out morning hours at around 6:00 Am at ponds. During every startup of production or during new formulation, this test is mandatory. Normally ponds are away from factory, carrying out of this test is became a big issue to the quality control team to confirm the sink ability. This is to be made easy by making replica of pond test.

Low-temperature Cu-Cu thermocompression bonding for encapsulation of a MEMS mirror

2019 ◽  
Vol 2019 (NOR) ◽  
pp. 000012-000016
Author(s):  
Henri Ailas ◽  
Jaakko Saarilahti ◽  
Tuomas Pensala ◽  
Jyrki Kiihamäki
Keyword(s):  
Low Temperature ◽  
Bond Strength ◽  
Bonding Temperature ◽  
Bonding Process ◽  
Ex Situ ◽  
High Yield ◽  
Maximum Temperature ◽  
Wafer Level ◽  
Cu Films ◽  
Thermocompression Bonding

Abstract In this study, a low temperature wafer-level packaging process aimed for encapsulating MEMS mirrors was developed. The glass cap wafer used in the package has an antireflective (AR) coating that limits the maximum temperature of the bonding process to 250°C. Copper thermocompression was used as copper has a high self-diffusivity and the native oxidation on copper surfaces can be completely removed with combination of ex situ acetic acid wet-etch and in situ forming gas anneal. Making it suitable for a development of a low temperature bonding process. In this work, bonding on of sputtered and electrodeposited copper films was studied on temperatures ranging from 200°C to 300°C as well as the effect of pretreatment on bond strength. The study presents a successful thermocompression bonding process for sputtered Cu films at a low temperature of 200°C with high yield of 97 % after dicing. The bond strength was recorded to be 75 MPa, well above the MIL-STD-883E standard (METHOD 2019.5) rejection limit of 6.08 MPa. The high dicing yield and bond strength suggest that the thermocompression bonding could be possible even at temperatures below 200°C. However, the minimum bonding temperature was not yet determined in this study.

The phases and effects of low temperature exposure on embryonic development in Hermetia illucens (L.) (Diptera: Stratiomyidae)

2021 ◽  
pp. 1-8
Author(s):  
W. Tollenaar ◽  
L. Joosten ◽  
E. Schmitt
Keyword(s):  
Quality Control ◽  
Low Temperature ◽  
Embryo Development ◽  
Window Of Opportunity ◽  
Hermetia Illucens ◽  
Hatch Success ◽  
Temperature Exposure ◽  
Low Temperature Exposure ◽  
Full Day ◽  
Reference Tool

Research on the black soldier fly (Hermetia illucens (L.) Diptera: Stratiomyidae) is steadily increasing, with a focus on its larvae and applications thereof. The egg stage of this species has received less research. This study describes the phases of embryo development for BSF eggs and the potential of delaying embryo development by using a chilling protocol. The study found that when chilling eggs for 24 hours at 10 °C and 80% relative humidity, the development is paused for a full day. This study presents a window of opportunity for embryo ages, approximately 38-58 hours post oviposition, where the hatch success is the least affected (>80% hatching when compared to control). Outside of this window, the hatch success decreases to 70% and lower. The description of embryo development can be used as a reference tool for quality control purposes. The effect of treatments on eggs can be determined by identifying key processes in development. Furthermore, the chilling of embryos and thus pausing of development can be applied in a production setting.

scholarly journals Torsion Testing Of Diffusion Bonded Liga Formed Nickel

1998 ◽  
Vol 546 ◽  
Author(s):  
T. R. Christenson ◽  
T. E. Buchheit ◽  
D. T. Schmale
Keyword(s):  
Low Temperature ◽  
Aspect Ratio ◽  
Bond Strength ◽  
Mechanical Strength ◽  
High Aspect Ratio ◽  
Strength Degradation ◽  
Test Technique ◽  
Torsion Testing

AbstractA test technique has been devised which is suitable for the testing of the bond strength of batch diffusion bonded LIGA or DXRL defined structures. The method uses a torsion tester constructed with the aid of LIGA fabrication and distributed torsion specimens which also make use of the high aspect ratio nature of DXRL based processing. Measurements reveal achieved bond stengths of 130 MPa between electroplated nickel with a bond temperature of 450°C at 7 ksi pressure which is a sufficiently low temperature to avoid mechanical strength degradation.

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