Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

2005 ◽  
Vol 49 (4.5) ◽  
pp. 725-753 ◽  
Author(s):  
J. U. Knickerbocker ◽  
P. S. Andry ◽  
L. P. Buchwalter ◽  
A. Deutsch ◽  
R. R. Horton ◽  
...  
Keyword(s):  
Next Generation ◽  
Generation System ◽  
Fine Pitch

scholarly journals Development of stable Grid service at the next generation system of KEKCC

2017 ◽  
Vol 898 ◽  
pp. 052042
Author(s):  
T. Nakamura ◽  
G. Iwai ◽  
H. Matsunaga ◽  
K. Murakami ◽  
T. Sasaki ◽  
...  
Keyword(s):  
Grid Service ◽  
Next Generation ◽  
Generation System

Issues in Assembly Process of Next-Generation Fine-Pitch Chip-On-Flex Packages for LCD Applications

2007 ◽  
Vol 30 (1) ◽  
pp. 2-10 ◽  
Author(s):  
Changsoo Jang ◽  
Seongyoung Han ◽  
Jaychul Ryu ◽  
Seungmin Cho ◽  
Hangyu Kim
Keyword(s):  
Assembly Process ◽  
Next Generation ◽  
Fine Pitch

scholarly journals Next generation system and software architectures

2006 ◽  
Vol 61 (1) ◽  
pp. 48-57 ◽  
Author(s):  
Roy Sterritt ◽  
Christopher A. Rouff ◽  
Michael G. Hinchey ◽  
James L. Rash ◽  
Walt Truszkowski
Keyword(s):  
Software Architectures ◽  
Next Generation ◽  
Generation System

scholarly journals Next Generation System-Wide Liquidity Stress Testing

2012 ◽  
Vol 12 (3) ◽  
pp. 1 ◽  
Author(s):  
Claus Puhr ◽  
Andre Santos ◽  
Christian Schmieder ◽  
Salih N. Neftci ◽  
Benjamin Neudorfer ◽  
...  
Keyword(s):  
Stress Testing ◽  
Next Generation ◽  
Generation System
Sign in / Sign up

Export Citation Format

Share Document