Finite element analysis for Solder Ball Connect (SBC) structural design optimization

1993 ◽  
Vol 37 (5) ◽  
pp. 585-596 ◽  
Author(s):  
J. S. Corbin
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Design Optimization ◽  
Structural Design ◽  
Solder Ball ◽  
Element Analysis ◽  
Structural Design Optimization

Research on Elastic Modulus of Wooden Crates for Simulation

2012 ◽  
Vol 200 ◽  
pp. 528-531
Author(s):  
Zu Ju Shu ◽  
Sheng Quan Liu ◽  
Yan Yuan
Keyword(s):  
Experimental Data ◽  
Finite Element Method ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Elastic Modulus ◽  
Structural Design ◽  
Inverse Method ◽  
Element Analysis ◽  
Structural Design Optimization ◽  
Solid Edge

The manufacturing process sheet can be output by the design of wooden crates based on Solid Edge. According to the process sheet, the sample crate was produced to obtain and process experimental data of stacking test. By applying inverse method combined with finite element method, the CAE model can be reconstructed quickly. Deflections of the wooden crate were computed by finite element analysis. By comparing deflections to experimental data, elastic modulus of the wooden crate can be adjusted to meet the requirements. The research on elastic modulus will lay the foundation for determining CAE model and structural design optimization of wooden crates.

A Non-Through Silicon Via 1000+ IO Package On Package Solution For Wide IO Applications

2013 ◽  
Vol 2013 (1) ◽  
pp. 000094-000099 ◽  
Author(s):  
Laura Mirkarimi ◽  
Rajesh Katkar ◽  
Ron Zhang ◽  
Rey Co ◽  
Zhijun Zhao
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Design Optimization ◽  
High Yield ◽  
Element Analysis ◽  
Package Design ◽  
Simulation Methodology ◽  
Structural Modifications ◽  
Simulation Tools ◽  
Large Bandwidth

We are developing a new solution for wide I/O package on package applications, which is Bond Via Array (BVA) technology. The prototype vehicle built in this study has 1020 I/O's at a pitch of 0.24 mm with a high aspect ratio of approximately 10:1 and is ≤1.4 mm tall. PoP applications require large bandwidth and thinner packages challenging package developers to address warpage control for high yield processes. The design optimization of this package was established through rigorous finite element analysis of materials selection and structural modifications. The simulation methodology was validated by measuring the warpage as a function of temperature for the experimental prototypes. The details for the simulation and verification processes for the wide I/O process will be discussed. The variation between finite element analysis predictions and the experimental builds was ~10%, which allowed us to complete package design optimization with our simulation tools. The prototype build includes a standard and a low CTE substrate.

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