Effect of Temperature/Humidity Treatment Conditions on Interfacial Adhesion Energy between Inkjet-Printed Ag and Polyimide

2009 ◽  
Vol 48 (8) ◽  
pp. 08HL02 ◽  
Author(s):  
Sung-Cheol Park ◽  
Young-Bae Park
Keyword(s):  
Interfacial Adhesion ◽  
Adhesion Energy ◽  
Effect Of Temperature ◽  
Treatment Conditions ◽  
Interfacial Adhesion Energy

Effect of Temperature/Humidity Treatment on Interfacial Reliability on Screen-Printed Ag / Polyimide for Advanced Embedded Packaging Technologies

2016 ◽  
Vol 2016 (1) ◽  
pp. 000545-000550
Author(s):  
Kyu Hawn Lee ◽  
Byung-Hyun Bae ◽  
Min-Su Jeong ◽  
Jeong-Kyu Kim ◽  
Young-Bae Park
Keyword(s):  
Photoelectron Spectroscopy ◽  
Interfacial Adhesion ◽  
Peel Test ◽  
Peel Strength ◽  
Adhesion Energy ◽  
Effect Of Temperature ◽  
Treatment Conditions ◽  
Interfacial Reliability ◽  
Interfacial Adhesion Energy ◽  
Screen Printed

Abstract The effect of temperature/humidity treatment conditions on the interfacial adhesion energy between a screen printed Ag film and a polyimide substrate was evaluated by using a 90° peel test. The measured peel strength values decrease from 254.7 N/m to 59.3 N/m after the temperature/humidity treatment at 85°CC/85% relative humidity for 500 h. X-ray photoelectron spectroscopy analysis of the peeled surfaces indicates that peeling occurs cohesively inside of the polyimide, which is closely related to both the decrease in the interfacial adhesion energy and the polyimide degradation due to weak boundary layer formation.

Effect of Annealing Treatment Conditions on the Interfacial Adhesion Energy of Electroless-plated Ni on Polyimide

2008 ◽  
Vol 18 (9) ◽  
pp. 486-491 ◽  
Author(s):  
Sung-Cheol Park ◽  
Kyoung-Jin Min ◽  
Kyu-Hwan Lee ◽  
Yong-Soo Jeong ◽  
Young-Bae Park
Keyword(s):  
Interfacial Adhesion ◽  
Annealing Treatment ◽  
Adhesion Energy ◽  
Treatment Conditions ◽  
Interfacial Adhesion Energy

Effect of surface treatments on interfacial adhesion energy between UV-curable resist and glass wafer

2009 ◽  
Vol 29 (6) ◽  
pp. 662-669 ◽  
Author(s):  
Eun-Jung Jang ◽  
Young-Bae Park ◽  
Hak-Joo Lee ◽  
Dae-Geun Choi ◽  
Jun-Ho Jeong ◽  
...  
Keyword(s):  
Interfacial Adhesion ◽  
Adhesion Energy ◽  
Surface Treatments ◽  
Glass Wafer ◽  
Uv Curable ◽  
Interfacial Adhesion Energy ◽  
Effect Of Surface

scholarly journals Molecular Dynamics Simulation on the Influences of Nanostructure Shape, Interfacial Adhesion Energy, and Mold Insert Material on the Demolding Process of Micro-Injection Molding

Polymers ◽  
2019 ◽  
Vol 11 (10) ◽  
pp. 1573 ◽  
Author(s):  
Jin Yang ◽  
Can Weng ◽  
Jun Lai ◽  
Tao Ding ◽  
Hao Wang
Keyword(s):  
Molecular Dynamics ◽  
Molecular Dynamics Simulation ◽  
Injection Molding ◽  
Interfacial Adhesion ◽  
Mold Insert ◽  
Adhesion Energy ◽  
Dynamics Simulation ◽  
Micro Injection Molding ◽  
Interfacial Adhesion Energy

In micro-injection molding, the interaction between the polymer and the mold insert has an important effect on demolding quality of nanostructure. An all-atom molecular dynamics simulation method was performed to study the effect of nanostructure shape, interfacial adhesion energy, and mold insert material on demolding quality of nanostructures. The deformation behaviors of nanostructures were analyzed by calculating the non-bonded interaction energies, the density distributions, the radii of gyration, the potential energies, and the snapshots of the demolding stage. The nanostructure shape had a direct impact on demolding quality. When the contact areas were the same, the nanostructure shape did not affect the non-bonded interaction energy at PP-Ni interface. During the demolding process, the radii of gyration of molecular chains were greatly increased, and the overall density was decreased significantly. After assuming that the mold insert surface was coated with an anti-stick coating, the surface burrs, the necking, and the stretching of nanostructures were significantly reduced after demolding. The deformation of nanostructures in the Ni and Cu mold inserts were more serious than that of the Al2O3 and Si mold inserts. In general, this study would provide theoretical guidance for the design of nanostructure shape and the selection of mold insert material.

Interfacial adhesion energy of lithium-ion battery electrodes

2016 ◽  
Vol 9 ◽  
pp. 226-236 ◽  
Author(s):  
Yan Wang ◽  
Yujie Pu ◽  
Zengsheng Ma ◽  
Yong Pan ◽  
Chang Q. Sun
Keyword(s):  
Lithium Ion Battery ◽  
Interfacial Adhesion ◽  
Lithium Ion ◽  
Adhesion Energy ◽  
Interfacial Adhesion Energy
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