Some properties of flash-evaporated Ga1−xAsx films

1991 ◽  
Vol 69 (6) ◽  
pp. 738-742
Author(s):  
M. R. Harwood ◽  
D. E. Brodie

a-Ga1−xAsx films containing small GaAs crystallites were prepared by flash evaporation onto low-temperature glass substrates. The As content in the films was varied from 41 to 69 at.%. Thermoelectric power measurements indicate that Ga-rich films are n-type and As-rich films are p-type, but the Seebeck coefficients for samples near the stoichiometric ratio were too small to measure. The optical gaps vary with As content in a way that is consistent with the suggestion that the material appears to be an alloy of a-GaAs and the excess component. High-temperature activation energies place the Fermi level near midgap in all samples and this is in line with the suggestion that this class of materials tend to self compensate as the film grows.

2006 ◽  
Vol 514-516 ◽  
pp. 156-160 ◽  
Author(s):  
Luís M. Gonçalves ◽  
Carlos Couto ◽  
Pedro Alpuim ◽  
D. Michael Rowe ◽  
J. Higino Correia

The deposition and characterization of n-type Bi2Te3 and p-type Sb2Te3 semiconductor films are reported. The films were deposited by thermal co-evaporation on a 25 µm thick polyimide (kapton) substrate. The co-evaporation method is inexpensive, simple, and reliable, when compared to other techniques that need longer time periods to prepare the starting material or require more complicated and expensive deposition equipment. Seebeck coefficients of -189 µVK-1 and +140 µVK-1 and electrical resistivities of 7.7 µ0m and 15.1 µ0m were measured at room temperature on n-type and p-type films, respectively. These values are better than those reported for films deposited by co-sputtering or electrochemical deposition, and are close to those reported for films deposited by metal-organic chemical vapour deposition or flash evaporation. Because of their high figures of merit, these films will be used for the fabrication of a micro-Peltier element, useful in temperature control and laser-cooling for telecommunications.


1984 ◽  
Vol 35 ◽  
Author(s):  
Anthony E Adams ◽  
L A Hing

ABSTRACTThe conventional method for fabricating silicon IMPATT diode structures involves the epitaxial growth of successive n- and p-type layers onto a n+ substrate followed by a boron diffusion to form the final p+ layer. The high temperature time cycles experienced by the structure during these processes cause junction interfaces to become degraded through dopant diffusion. In this paper we examine the application of laser processing techniques to the epitaxial regrowth of low temperature deposited layers and report on the nature of the recrystallised material.


Author(s):  
Zhiqiang Wang ◽  
Ming Liu ◽  
Xingxing Cheng ◽  
Yusheng He ◽  
Yingjie Hu ◽  
...  

Abstract Although heavy oil is an abundant and promising energy source, its processing and utilization are complicated due to its high density, low hydrogen/carbon ratio, and high asphaltene content. Fortunately, these problems can be mitigated by the application of oxy-fuel combustion. To gain deeper insights into the above technology, the characteristics of heavy oil combustion in an O2/CO2 atmosphere was investigated using non-isothermal thermogravimetric analysis. We demonstrate that the combustion process consisted of four stages. Low-molecular-weight hydrocarbons reacted at low temperature, whereas heavy ones required a higher temperature. Increasing the concentration of oxygen resulted in increased TGA and DSC peak intensities and decreased peak widths, and these peaks were shifted to lower temperatures. Coat-Redfern and Flynn-Wall-Ozzawa methods were used to evaluate the kinetic parameters (E, A) of the oxidation process, showing that the high-temperature activation energy was much higher than the low-temperature one due to the different molecular weights of the oxidized substrates in each region. The reaction was demonstrated to be diffusion-controlled, as reflected by the lower activation energy at high oxygen concentration and high temperature, with the influence of oxygen concentration on QO processes being much more obvious than that on SO ones.


2001 ◽  
Vol 15 (17n19) ◽  
pp. 716-721
Author(s):  
YASUHIRO MATSUMOTO ◽  
MASAO TAMURA ◽  
RENE ASOMOZA ◽  
ZHENRUI YU

P-type poly-Si thin films prepared by low temperature Aluminum-induced crystallization and doping are reported. The starting material was boron-doped a-Si:H prepared by PECVD on glass substrates. Aluminum layers with different thicknessess were evaporated on a-Si:H surface and conventional thermal annealing was performed at temperatures ranging from 300 to 550°C. XRD, SIMS, TEM and Hall effect measurements were carried out to characterize the annealed films. Results show that a-Si:H contacted with adequate Al could be crystallized at temperature as low as 300°C after annealing for 60 minutes. This material has high carrier concentration as well as high Hall mobility can be used as a p-layer or seed layer for thin film poly-Si solar cells. The technique reported here is compatible with PECVD process.


2021 ◽  
Vol 82 (3) ◽  
pp. 5-11
Author(s):  
Volodymyr Krayovskyy ◽  
◽  
Volodymyr Pashkevych ◽  
Andriy Horpenuk ◽  
Volodymyr Romaka ◽  
...  

The results of a comprehensive study of the crystal and electronic structures, kinetic and energetic performances of the semiconductor thermometric material Er1-xScxNiSb, (x=0–0.1) are presented. Microprobe analysis of the concentration of atoms on the surface of Er1-xScxNiSb samples established their correspondence to the initial compositions of the charge, and the diffractograms of the samples are indexed in the structural type of MgAgAs. Because the atomic radius Sc (rSc=0.164 nm) is smaller than that of Er (rEr=0.176 nm), it is logical to reduce the values of the unit cell's period a(x) Er1-xScxNiSb, which correlate with the results of mathematical modeling. The temperature dependences of the resistivity ln(ρ(1/T)) contain high- and low-temperature activation regions, which are specific for semiconductors and indicate the location of the Fermi level in the bandgap, and positive values of the thermopower coefficient a(x, T) specify its position – near the valence band . This result does not agree with the results of modeling the electronic structure for its ordered version. The presence of a low-temperature activation region on the ln(ρ(1/T)) p-ErNiSb dependence with an activation energy =0.4 meV indicates the compensation of the sample provided by acceptors and donors of unknown origin. A decrease in the values of the resistivity ρ(x, T) and the thermopower coefficient a(x, T) points to an increase in the concentration of holes in p-Er1- xScxNiSb in the area of concentrations x=0–0.03. This is possible in a p-type semiconductor only by increasing the concentration of the main current carriers, which are holes. The fact of increasing the concentration of acceptors in Er1-xScxNiSb at insignificant concentrations of impurity atoms is also indicated by the nature of the change in the values of the activation energy of holes from the Fermi level to the valence band . Consequently, if in p-ErNiSb the Fermi level was at a distance of 45.4 meV from the level of the valence band , then at the concentration Er1-xScxNiSb, x=0.01, the Fermi level shifted towards the valence band and was located at a distance of 13.6. Since the Fermi level reflects the ratio of ionized acceptors and donors in the semiconductor, its movement by x=0.01 to the valence band is possible either with an increase in the number of acceptors or a rapid decrease in the concentration of ionized donors. At even higher concentrations of Sc impurity in p-Er1-xScxNiSb, x≥0.03, low-temperature activation sites appear on the ln(ρ(1/T)) dependences, which is a sign of compensation and evidence of the simultaneous generation of acceptor and donor structural defects in the crystal nature. This is also indicated by the change in the position of the Fermi level in the bandgap of the semiconductor Er1-xScxNiSb, which is almost linearly removed from the level of the valence band : (x=0.05)=58.6 meV and (x=0.10)=88.1 meV. Such a movement of the Fermi level during doping of a p-type semiconductor is possible only if donors of unknown origin are generated. For a p-type semiconductor, this is possible only if the concentration of the main current carriers, which are free holes, is reduced, and donors are generated that compensate for the acceptor states. This conclusion is also confirmed by the behavior of the thermopower coefficient a(x, T) at concentrations x≥0.03. The results of structural, kinetic, and energy studies of the thermometric material Er1-xScxNiSb allow us to speak about a complex mechanism of simultaneous generation of structural defects of acceptor and donor nature. However, the obtained array of experimental information does not allow us to unambiguously prove the existence of a mechanism for generating donors and acceptors. The research article offers a solution to this problem. Having the experimental results of the drift rate of the Fermi level as the activation energy (x) from the Fermi level to the valence band by calculating the distribution of the density of electronic states (DOS) sought the degree of compensation, which sets the direction and velocity of the Fermi level as close as possible to the experimental results. DOS calculations are performed for all variants of the location of atoms in the nodes of the unit cell, and the degree of occupancy of all positions by their own and/or foreign atoms. It turned out that for ErNiSb the most acceptable option is one that assumes the presence of vacancies in positions 4a and 4c of the Er and Ni atoms, respectively. Moreover, the number of vacancies in the position Er (4a) is twice less than the number of vacancies in the position Ni (4c). This proportion is maintained for Er1-xScxNiSb. Vacancies in the positions of Er (4a) and Ni (4c) atoms Er1-xScxNiSb are structural defects of acceptor nature, which generate two acceptor zones and in the semiconductor. The introduction of impurity Sc atoms into the ErNiSb structure by substituting Er atoms in position 4a is also accompanied by the occupation of vacancies by Sc atoms and a reduction in their number. Occupying a vacancy, the Sc atom participates in the formation of the valence band and the conduction band of the semiconductor Er1-xScxNiSb, acting as a source of free electrons. We can also assume that the introduction of Sc atoms into the structure of the compound ErNiSb is accompanied by a process of ordering the structure of Er1-xScxNiSb and Ni atoms occupy vacancies in position 4c. This process also, however, 2 times slower, leads to a decrease in the concentration of structural defects of acceptor nature. In this case, Ni, giving valence electrons, now act as donors.


2007 ◽  
Vol 1044 ◽  
Author(s):  
Alan Thompson ◽  
Jeff Sharp ◽  
C.J Rawn ◽  
B.C. Chackoumakos

AbstractGeTe, a small bandgap semiconductor that has native p-type defects due to Ge vacancies, is an important constituent in the thermoelectric material known as “TAGS” [1]. TAGS is an acronym for alloys of GeTe with AgSbTe2, and compositions are normally designated as TAGS-x, where x is the fraction of GeTe. TAGS-85 is the most important with regard to applications, and there also is commercial interest in TAGS-80. The crystal structure of GeTe1+δ has a composition-dependent phase transformation at a temperature ranging from 430°C (δ = 0) to ∼ 400°C (δ = 0.02) [2]. The high temperature form is cubic. The low temperature form is rhombohedral for δ < 0.01, as is the case for good thermoelectric performance. Addition of AgSbTe2 shifts the phase transformation to lower temperatures, and one of the goals of this work is a systematic study of the dependence of transformation temperature on the parameter x. We present results on phase transformations and associated instabilities in TAGS compositions in the range of 70-85 at.% GeTe.


2008 ◽  
Vol 1066 ◽  
Author(s):  
Sung-Hwan Choi ◽  
Sang-Geun Park ◽  
Won-Kyu Lee ◽  
Tae-Jun Ha ◽  
Min-Koo Han

ABSTRACTWe have investigated temperature dependence on the hysteresis phenomenon of SLS poly-Si TFT on a glass substrate, extremely at low temperature (213K). The p-type sequential lataral solidification (SLS) polycrystalline Silicon (poly-Si) TFT was fabricated on glass substrate. As the temperature was reduced, it was observed that hysteresis phenomenon was increased, whereas the hysteresis was suppressed at high temperature. This could be explained by a difference of initially electron and hole trapped charges into gate insulator is much larger in low temperature than in high temperature. And we have verified that drain current was changed with a different previous gate starting voltage even at same bias condition by experimental results due to the hysteresis phenomenon of SLS poly-Si TFT. Hysteresis of SLS poly-Si TFT should be improved for a pixel element of high quality AMOLED display.


2013 ◽  
Vol 825 ◽  
pp. 326-330
Author(s):  
Xun Zhang ◽  
Guo Hua Gu ◽  
Ke Ting Hu ◽  
Guan Zhou Qiu

In this paper, the bioleaching behavior of three pyrites from different geological origins (high-temperature hydrothermal, low-temperature hydrothermal and coal sedimentary) by L. ferriphilum was studied. The internal structure of three pyrite samples were investigated using optical microscope. The results show that the physical characteristics and internal structures of pyrites from different geological origins are different, and this causes the divergences of their bioleaching behavior. High-temperature hydrothermal pyrite (n-type semiconductor tested) is not almost dissolved and the leaching rate is only 0.58%, while the leaching rate of low-temperature hydrothermal pyrite and coal sedimentary pyrite (both of p-type semiconductor tested) are 15.25% and 27.50% respectively. The Leica optical microscope test of p-type semiconductor pyrites indicates that coarse particle of low-temperature hydrothermal pyrite is crystallized well and sedimentary pyrite consists of fine-grained crystal with poor crystallinity. This was suggested to cause the divergences of the bioleaching rate of both p-type semiconductor pyrites. In view of mineralogy, the semiconductive type of pyrite is the primary factor affecting its bioleaching. Furthermore, the different internal structure of pyrites will further have an influence on bioleaching for the same semiconductive type.Key words: pyrite; bioleaching; L. ferriphilum; geo-genetic


Author(s):  
P.P.K. Smith

Grains of pigeonite, a calcium-poor silicate mineral of the pyroxene group, from the Whin Sill dolerite have been ion-thinned and examined by TEM. The pigeonite is strongly zoned chemically from the composition Wo8En64FS28 in the core to Wo13En34FS53 at the rim. Two phase transformations have occurred during the cooling of this pigeonite:- exsolution of augite, a more calcic pyroxene, and inversion of the pigeonite from the high- temperature C face-centred form to the low-temperature primitive form, with the formation of antiphase boundaries (APB's). Different sequences of these exsolution and inversion reactions, together with different nucleation mechanisms of the augite, have created three distinct microstructures depending on the position in the grain.In the core of the grains small platelets of augite about 0.02μm thick have farmed parallel to the (001) plane (Fig. 1). These are thought to have exsolved by homogeneous nucleation. Subsequently the inversion of the pigeonite has led to the creation of APB's.


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