Ion-acoustic microscopy

1986 ◽  
Vol 64 (9) ◽  
pp. 1284-1286 ◽  
Author(s):  
D. N. Rose ◽  
H. Turner ◽  
K. O. Legg
Keyword(s):  
Acoustic Microscopy ◽  
Cubic Zirconia ◽  
Ion Acoustic ◽  
Nitrogen Ions

This paper details the modifications to an existing ion implanter that were made to adapt it for ion-acoustic microscopy. Results of tests of the technique on samples of cubic zirconia and alumina implanted with nitrogen ions are described. The utility of the technique for monitoring the progress of implantation in metals and ceramics is discussed.

Ion Acoustic Microscopy

1985 ◽  
Author(s):  
Keith O. Legg ◽  
Douglas N. Rose
Keyword(s):  
Acoustic Microscopy ◽  
Ion Acoustic

Ion acoustic microscopy for imaging of buried structures based on a focused ion beam system

2001 ◽  
Vol 57-58 ◽  
pp. 659-664 ◽  
Author(s):  
Ch. Akhmadaliev ◽  
L. Bischoff ◽  
J. Teichert ◽  
K. Kazbekov
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Acoustic Microscopy ◽  
Buried Structures ◽  
Beam System ◽  
Ion Acoustic

Acoustic microscopy techniques for the inspection of integrated circuit devices and packages

1992 ◽  
Vol 50 (2) ◽  
pp. 966-967
Author(s):  
Thomas M. Moore
Keyword(s):  
Integrated Circuit ◽  
Acoustic Microscopy ◽  
Hybrid Technique ◽  
Frequency Scanning ◽  
Ic Packaging ◽  
Ic Package ◽  
Microscopy Techniques ◽  
Ic Package Inspection ◽  
Pulse Echo ◽  
Scanning Acoustic Microscope

In the last decade, a variety of characterization techniques based on acoustic phenomena have come into widespread use. Characteristics of matter waves such as their ability to penetrate optically opaque solids and produce image contrast based on acoustic impedance differences have made these techniques attractive to semiconductor and integrated circuit (IC) packaging researchers.These techniques can be divided into two groups. The first group includes techniques primarily applied to IC package inspection which take advantage of the ability of ultrasound to penetrate deeply and nondestructively through optically opaque solids. C-mode Acoustic Microscopy (C-AM) is a recently developed hybrid technique which combines the narrow-band pulse-echo piezotransducers of conventional C-scan recording with the precision scanning and sophisticated signal analysis capabilities normally associated with the high frequency Scanning Acoustic Microscope (SAM). A single piezotransducer is scanned over the sample and both transmits acoustic pulses into the sample and receives acoustic echo signals from the sample.

Focusing PVDF Transducers for Acoustic Microscopy

1995 ◽  
Vol 7 (1) ◽  
pp. 195-201 ◽  
Author(s):  
S. Smolorz ◽  
W. Grill
Keyword(s):  
Acoustic Microscopy

‘Versatility of Genius’ Cubic Zirconia

2020 ◽  
Vol 37 (3) ◽  
pp. 260-261
Author(s):  
Victor Tuzlukov
Keyword(s):  
Cubic Zirconia

Effect of Additives on High Temperature Deformation in Cubic Zirconia (Y-CSZ)

2008 ◽  
Vol 57 (6) ◽  
pp. 543-547
Author(s):  
Takuma WADA ◽  
Takahiro KAKEI ◽  
Hiroyuki HORII ◽  
Takeshi SHIONO ◽  
Yasunori OKAMOTO
Keyword(s):  
High Temperature ◽  
High Temperature Deformation ◽  
Temperature Deformation ◽  
Cubic Zirconia ◽  
Effect Of Additives

Counterfeit Parts Recognition and Detection for Failure Analysts

2010 ◽  
Author(s):  
Katherine V. Whittington
Keyword(s):  
Thermal Cycle ◽  
Visual Inspection ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
3D Measurement ◽  
X Ray ◽  
Wide Range ◽  
Electronic Parts ◽  
Testing Awareness

Abstract The electronics supply chain is being increasingly infiltrated by non-authentic, counterfeit electronic parts, whose use poses a great risk to the integrity and quality of critical hardware. There is a wide range of counterfeit parts such as leads and body molds. The failure analyst has many tools that can be used to investigate counterfeit parts. The key is to follow an investigative path that makes sense for each scenario. External visual inspection is called for whenever the source of supply is questionable. Other methods include use of solvents, 3D measurement, X-ray fluorescence, C-mode scanning acoustic microscopy, thermal cycle testing, burn-in technique, and electrical testing. Awareness, vigilance, and effective investigations are the best defense against the threat of counterfeit parts.

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