Compositional characterization of microwave plasma a-Si: H films

1983 ◽  
Vol 61 (4) ◽  
pp. 582-590 ◽  
Author(s):  
J. F. Currie ◽  
P. Depelsenaire ◽  
J. P. Huot ◽  
L. Paquin ◽  
M. R. Wertheimer ◽  
...  

The concentration of hydrogen in amorphous hydrogenated silicon films prepared by microwave glow discharge decomposition of silane has been measured as a function of several fabrication parameters: substrate temperature, deposition rate, and partial pressures of silane and of argon. Hydrogen concentration profiles have been obtained by two techniques: elastic recoil detection (ERD) with a 30 MeV 35Cl beam, and by the resonant nuclear reaction 15N + 1H → 12C + 4He + γ. Both offer very high depth resolution (in the order of 100 Å) and have revealed important inhomogencities in chemical composition, both at the free surface and the substrate – film interface. Using standard infrared absorption measurements between 1950 and 2150 cm−1, the intensities of the lines normally associated with SiH, SiH2, and SiH3 bonds were measured. As has been previously reported for reactively sputtered films for some fabrication conditions the sum of the three intensities is not consistent with the total hydrogen concentration obtained from the nuclear measurements. The average hydrogen concentration decreases with increasing substrate temperature, changes little with deposition rate, and increases as the silane to argon ratio is increased. These observations are related to the chemical reactions which take place in the plasma, and at the plasma–film interface during film growth.

2020 ◽  
Vol 4 (4) ◽  
pp. 40
Author(s):  
Keisuke Yasuda

The time-of-flight elastic recoil detection analysis (TOF-ERDA) method is one of the ion beam analysis methods that is capable of analyzing light elements in a sample with excellent depth resolution. In this method, simultaneous measurements of recoil ion energy and time of flight are performed, and ion mass is evaluated. The energy of recoil ions is calculated from TOF, which gives better energy resolution than conventional Silicon semiconductor detectors (SSDs). TOF-ERDA is expected to be particularly applicable for the analysis of light elements in thin films. In this review, the principle of TOF-ERDA measurement and details of the measurement equipment along with the performance of the instrumentation, including depth resolution and measurement sensitivity, are described. Examples of TOF-ERDA analysis are presented with a focus on the results obtained from the measurement system developed by the author.


2000 ◽  
Vol 609 ◽  
Author(s):  
W.M.M. Kessels ◽  
A.H.M. Smets ◽  
J.P.M. Hoefnagels ◽  
M.G.H. Boogaarts ◽  
D.C. Schram ◽  
...  

ABSTRACTFrom investigations on the SiH3 and SiH radical density and the surface reaction probability in a remote Ar-H2-SiH4 plasma, it is unambiguously demonstrated that the a-Si:H film quality improves significantly with increasing contribution of SiH3 and decreasing contribution of very reactive (poly)silane radicals. Device quality a-Si:H is obtained at deposition rates up to 100 Å/s for conditions where film growth is governed by SiH3 (contribution ∼90%) and where SiH has only a minor contribution (∼2%). Furthermore, for SiH3 dominated film growth the effect of the deposition rate on the a-Si:H film properties with respect to the substrate temperature is discussed.


1986 ◽  
Vol 68 ◽  
Author(s):  
Yves Tessier ◽  
J. E. Klemberg-Sapieha ◽  
S. Poulin-Dandurand ◽  
M. R. Wertheimer

AbstractPlasma silicon nitride (P-SiN) films were prepared from SiH4/NH3 mixtures in a large volume microwave plasma (LMP) apparatus, at substrate temperatures T2 ranging from ambient to 250°C.Under otherwise nominally identical fabrication conditions, deposition rates were 10 to 25 times greater than those reported by others for radio- or audio-frequency plasmas.Based on film compositions, determined by elastic recoil detection (ERD), and measurements of such properties as density, refractive index, etch rate in dilute HF, and moisture permeation coefficient, our best P-SiN films (produced at T2 ≥ 200°C) are very similar to those reported in the literature.


1987 ◽  
Vol 65 (8) ◽  
pp. 859-863 ◽  
Author(s):  
Yves Tessier ◽  
J. E. Klemberg-Sapieha ◽  
S. Poulin-Dandurand ◽  
M. R. Wertheimer ◽  
S. Gujrathi

Plasma silicon nitride (P-SiN) films were prepared from SiH4–NH3 mixtures and from ternary mixtures with Ar or N2 in a large-volume microwave plasma apparatus, at substrate temperatures Ts ranging from ambient to 250 °C. Under otherwise nominally identical fabrication conditions, deposition rates were 10 to 25 times greater than those reported by others for radio-or audio-frequency plasmas. Based on film compositions determined by elastic recoil detection, and measurements of such properties as density, refractive index, etch rate in dilute HF, and the moisture permeation coefficient, our best P-SiN films (produced at Ts ≥ 200 °C) were very similar to those reported in the literature.


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