THE COEFFICIENT OF THERMAL EXPANSION OF VARIOUS CUBIC METALS BELOW 100 °K

1965 ◽  
Vol 43 (2) ◽  
pp. 193-219 ◽  
Author(s):  
D. B. Fraser ◽  
A. C. Hollis Hallett
Keyword(s):  
Thermal Expansion ◽  
Noble Metals ◽  
Coefficient Of Thermal Expansion ◽  
Linear Thermal Expansion ◽  
Electronic Contribution ◽  
Electronic Effects ◽  
Interferometric Method ◽  
Lattice Contribution ◽  
Cubic Metals ◽  
Fabry Perot

Measurements have been made of the coefficient of linear thermal expansion, α, of Cu, Ag, Au, Al, α-Fe, and Ni at temperatures below 100 °K using an interferometric method in which the spacer between the optical flats of a Fabry–Perot-type interferometer was made of the material studied. The lowest temperatures at which values of α are given are about 20 °K (Cu, Ag), 11 °K (Au), 25 °K (Al, Fe), and 32 °K (Ni). The results are discussed in terms of the Gruneisen parameter γ which, for Cu, Ag, and Au, is approximately constant at high temperatures, but tends to rise slightly as the temperature is reduced towards the lowest temperatures of measurement. For Al, a correction for the electronic contribution is applied below 40 °K to deduce the lattice contribution γL, which rises more spectacularly at low temperatures than the results for the noble metals. For Fe, separation of α into two contributions, one from the lattice and one from the combined magnetic and electronic effects, may be made, giving γL = 1.45; the combined magnetic and electronic contribution is very small.

Tangguh LNG Project Statistical Young’s Modulus and Thermal Expansion Coefficient Testing of Clad Pipe Specimens

2011 ◽  
Author(s):  
Terry Griffiths ◽  
Isabel Hadley ◽  
Richard Johnson ◽  
Fabio Micari
Keyword(s):  
Thermal Expansion ◽  
Young’S Modulus ◽  
Room Temperature ◽  
Structural Reliability ◽  
Coefficient Of Thermal Expansion ◽  
Young's Modulus ◽  
Linear Thermal Expansion ◽  
Upheaval Buckling ◽  
Analysis Of Results ◽  
Mean And Variance

Material testing was undertaken on samples taken from clad pipe manufactured by JSW for the Tangguh LNG project. The test programme involved testing Young’s Modulus (E) and Coefficient of Linear Thermal Expansion (α) from room temperature to above 110° on each layer. This paper summarises testing and analysis of results which enabled mean and variance on each material property to be found. Checks were also undertaken for any correlations in properties between clad and parent layers, and between Young’s Modulus and Coefficient of Thermal Expansion. Analysis results are compared to existing industry norms and their implications for the Tangguh project UHB (Upheaval Buckling) SRA (Structural Reliability Analysis) are summarised.

Calculation of Defect Formation Energy from the Thermal Expansion Data for Lead Fluoride

1994 ◽  
Vol 369 ◽  
Author(s):  
Brenda J. Schuler ◽  
T. S. Aurora ◽  
D. O. Pederson ◽  
S. M. Day
Keyword(s):  
Thermal Expansion ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Formation Energy ◽  
Defect Formation ◽  
Coefficient Of Thermal Expansion ◽  
Linear Thermal Expansion ◽  
Lead Fluoride ◽  
Defect Formation Energy ◽  
Thermal Expansion Data

AbstractLead fluoride is a superionic conductor with the fluorite structure. Results of the measurement of linear thermal expansion of lead fluoride (reported earlier in literature) showed a large increase in the thermal expansion coefficient near 700 K where the ionic conductivity has been shown to exhibit a sharp increase. It is believed that thermally-generated defects in a crystal lattice affect the thermal expansion coefficient. This idea was applied in the present analysis to calculate the defect formation energy (Ef) by using the literature values of the coefficient of thermal expansion. It was assumed that the thermal expansion in excess of that produced due to the lattice anharmonicity (δ∝) is proportional to the concentration of defects (n). With this assumption, one may write: δ∝ = c nº exp(-Ef/kT), where c is a constant. For lead fluoride, a plot of ln(δ∝) versus (l/T) yielded Ef = 0.56 eV which is lower than the literature values. The assumptions in this analysis and the discrepancy in the result are discussed.

scholarly journals Thermal analysis of metal-ceramic bonding using finite element method

2014 ◽  
Vol 3 (2) ◽  
pp. 216 ◽  
Author(s):  
S. Gopinath ◽  
R Sabarish ◽  
R. Sasidharan
Keyword(s):  
Finite Element ◽  
Thermal Expansion ◽  
Thermal Stress ◽  
Bonding Strength ◽  
Coefficient Of Thermal Expansion ◽  
Linear Thermal Expansion ◽  
Processing Temperature ◽  
Element Analysis ◽  
Metal Ceramic ◽  
The Difference

This paper reports a finite element study of effect of bonding strength between metal and ceramic. The bonding strength is evaluated with different processing temperature and holding time. The difference between the coefficients of linear thermal expansion (CTEs) of the metal and ceramic induces thermal stress at the interface. The mismatch thermal stress at the interface region plays an important role in improving bonding strength. Hence, it is essential to evaluate the interface bonding in metal-ceramics joints. The Al/SiC bonding was modeled and analyzed using finite element analysis in ANSYS (v.10). Keywords: Bonding Strength, Coefficient of Thermal Expansion, Thermal Stress, Interface, Al/Sic, FEA.

Sign in / Sign up

Export Citation Format

Share Document