Copper, lead, and silver isotopes solve a major economic conundrum of Tudor and early Stuart Europe

Geology ◽  
2013 ◽  
Vol 41 (2) ◽  
pp. 135-138 ◽  
Author(s):  
Anne-Marie Desaulty ◽  
Francis Albarede
Keyword(s):  
Silver Isotopes ◽  
Copper Lead

NEUTRON DIFFRACTION BY LIQUID SEGREGATED COPPER-LEAD ALLOYS

1980 ◽  
Vol 41 (C8) ◽  
pp. C8-156-C8-159
Author(s):  
M. Favre Bonte ◽  
J. Bletry ◽  
P. Hicter ◽  
P. J. DESRE
Keyword(s):  
Neutron Diffraction ◽  
Lead Alloys ◽  
Copper Lead

Backside Mechanical Preparation Methodology for Effective Failure Analysis on Small and Non-Exposed Die Paddle Package

2018 ◽  
Author(s):  
Ong Pei Hoon ◽  
Ng Kiong Kay ◽  
Gwee Hoon Yen
Keyword(s):  
Failure Analysis ◽  
Chemical Etching ◽  
Chemical Resistance ◽  
Etching Time ◽  
Lead Frame ◽  
Front Side ◽  
Electrical Measurements ◽  
Mechanical Preparation ◽  
Die Surface ◽  
Copper Lead

Abstract Chemical etching is commonly used in exposing the die surface from die front-side and die backside because of its quick etching time, burr-free and stress-free. However, this technique is risky when performing copper lead frame etching during backside preparation on small and non-exposed die paddle package. The drawback of this technique is that the copper leads will be over etched by 65% Acid Nitric Fuming even though the device’s leads are protected by chemical resistance tape. Consequently, the device is not able to proceed to any other further electrical measurements. Therefore, we introduced mechanical preparation as an alternative solution to replace the existing procedure. With the new method, we are able to ensure the copper leads are intact for the electrical measurements to improve the effectiveness and accuracy of physical failure analysis.

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