In vitro measurements of acoustic properties using a high‐frequency scanning acoustic microscope (SAM)

2004 ◽  
Vol 115 (5) ◽  
pp. 2377-2377
Author(s):  
Caleb H. Farny ◽  
T. L. Szabo ◽  
Ronald A. Roy ◽  
Robin O. Cleveland
Keyword(s):  
High Frequency ◽  
Acoustic Properties ◽  
Acoustic Microscope ◽  
Frequency Scanning ◽  
In Vitro Measurements ◽  
Scanning Acoustic Microscope

High‐frequency characterization of tissue phantoms using a scanning acoustic microscope (SAM)

2003 ◽  
Vol 113 (4) ◽  
pp. 2324-2324
Author(s):  
Caleb H. Farny ◽  
Tara C. Chklovski ◽  
T. L. Szabo ◽  
Ron A. Roy ◽  
Robin O. Cleveland
Keyword(s):  
High Frequency ◽  
Acoustic Microscope ◽  
Tissue Phantoms ◽  
Scanning Acoustic Microscope

scholarly journals Comparison of articular cartilage images assessed by high-frequency ultrasound microscope and scanning acoustic microscope

2011 ◽  
Vol 36 (1) ◽  
pp. 185-190 ◽  
Author(s):  
Yoshihiro Hagiwara ◽  
Yoshifumi Saijo ◽  
Akira Ando ◽  
Yoshito Onoda ◽  
Hideaki Suda ◽  
...  
Keyword(s):  
Articular Cartilage ◽  
High Frequency ◽  
High Frequency Ultrasound ◽  
Acoustic Microscope ◽  
Scanning Acoustic Microscope ◽  
Frequency Ultrasound

Acoustic microscopy techniques for the inspection of integrated circuit devices and packages

1992 ◽  
Vol 50 (2) ◽  
pp. 966-967
Author(s):  
Thomas M. Moore
Keyword(s):  
Integrated Circuit ◽  
Acoustic Microscopy ◽  
Hybrid Technique ◽  
Frequency Scanning ◽  
Ic Packaging ◽  
Ic Package ◽  
Microscopy Techniques ◽  
Ic Package Inspection ◽  
Pulse Echo ◽  
Scanning Acoustic Microscope

In the last decade, a variety of characterization techniques based on acoustic phenomena have come into widespread use. Characteristics of matter waves such as their ability to penetrate optically opaque solids and produce image contrast based on acoustic impedance differences have made these techniques attractive to semiconductor and integrated circuit (IC) packaging researchers.These techniques can be divided into two groups. The first group includes techniques primarily applied to IC package inspection which take advantage of the ability of ultrasound to penetrate deeply and nondestructively through optically opaque solids. C-mode Acoustic Microscopy (C-AM) is a recently developed hybrid technique which combines the narrow-band pulse-echo piezotransducers of conventional C-scan recording with the precision scanning and sophisticated signal analysis capabilities normally associated with the high frequency Scanning Acoustic Microscope (SAM). A single piezotransducer is scanned over the sample and both transmits acoustic pulses into the sample and receives acoustic echo signals from the sample.

Signature Analysis of Package Delamination Using Scanning Acoustic Microscope

1996 ◽  
Author(s):  
S.X. Li ◽  
K. Lee ◽  
J. Hulog ◽  
R. Gannamani ◽  
S. Yin
Keyword(s):  
Failure Analysis ◽  
Early Stage ◽  
Signature Analysis ◽  
Acoustic Microscope ◽  
Reflow Soldering ◽  
Moisture Expansion ◽  
Scanning Acoustic Microscope ◽  
Package Reliability

Abstract Package delaminations are often associated with electrical and package reliability problems in IC devices. Delaminations caused by electrical-over-stress (EOS) and moisture expansion during reflow soldering have shown different delamination patterns. A Scanning Acoustic Microscope (SAM) can be used to detect package delaminations. Understanding these delamination signatures can help us quickly identify the failure cause at an early stage of the failure analysis.

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