scholarly journals Acoustic microscopy and dispersion of leaky Rayleigh waves on randomly rough surfaces: A theoretical study

1995 ◽  
Vol 97 (5) ◽  
pp. 3394-3394 ◽  
Author(s):  
Claudio Pecorari ◽  
G. A. D. Briggs
Author(s):  
Ingrid De Wolf ◽  
Ahmad Khaled ◽  
Martin Herms ◽  
Matthias Wagner ◽  
Tatjana Djuric ◽  
...  

Abstract This paper discusses the application of two different techniques for failure analysis of Cu through-silicon vias (TSVs), used in 3D stacked-IC technology. The first technique is GHz Scanning Acoustic Microscopy (GHz- SAM), which not only allows detection of defects like voids, cracks and delamination, but also the visualization of Rayleigh waves. GHz-SAM can provide information on voids, delamination and possibly stress near the TSVs. The second is a reflection-based photoelastic technique (SIREX), which is shown to be very sensitive to stress anisotropy in the Si near TSVs and as such also to any defect affecting this stress, such as delamination and large voids.


1969 ◽  
Vol 45 (1) ◽  
pp. 295-295
Author(s):  
K. E. Hawker ◽  
P. J. Welton

1989 ◽  
Vol 22 (6) ◽  
pp. 339-346 ◽  
Author(s):  
P. Jagnoux ◽  
A. Vincent

2021 ◽  
Vol 119 (7) ◽  
pp. 071603
Author(s):  
Hong Hu ◽  
Suo Zhao ◽  
Wenshuo Wang ◽  
Yuqi Zhang ◽  
Yu Fu ◽  
...  

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