Multielement acoustic transducer as well as a method of manufacturing the same and an acoustic imaging instrument

1985 ◽  
Vol 78 (6) ◽  
pp. 2162-2162
Author(s):  
Hiroshi Kanda ◽  
Isao Ishikawa ◽  
Toshio Kondo
Keyword(s):  
Acoustic Imaging ◽  
Acoustic Transducer ◽  
Imaging Instrument

Design of Slotted Transducer Arrays with Matched Backings

1979 ◽  
Vol 1 (3) ◽  
pp. 189-209 ◽  
Author(s):  
Gordon S. Kino ◽  
Charles S. DeSilets
Keyword(s):  
Design Procedure ◽  
Acoustic Imaging ◽  
Experimental Results ◽  
Imaging Systems ◽  
Acoustic Transducer ◽  
Transducer Arrays ◽  
Broadband Matching ◽  
The Individual ◽  
Good Agreement

A design procedure is described for acoustic transducer arrays suitable for focused acoustic imaging systems. The criteria governing the choice of the width of the individual elements of the array and for broadband matching are discussed. Experimental results on 2.5 MHz arrays are given and are in good agreement with theory.

Digital Ultrasound Imaging Techniques Using Vector Sampling and Raster Line Reconstruction

1981 ◽  
Vol 3 (1) ◽  
pp. 83-107 ◽  
Author(s):  
Steve M. Gehlbach ◽  
Robert E. Alvarez
Keyword(s):  
Frequency Conversion ◽  
Imaging System ◽  
Imaging Techniques ◽  
Digital Signal ◽  
Instrument Design ◽  
Acoustic Imaging ◽  
Synthetic Aperture ◽  
Imaging Instrument ◽  
Scan Conversion ◽  
And Storage

The use of digital techniques in acoustic imaging is receiving a great deal of attention due to the power and flexibility of digital signal processing as well as its steadily decreasing cost. In this paper we describe the theory and preliminary experimental results for a digital synthetic aperture imaging system which uses one or more transmit/receive cycles to gather data for reconstructing an entire image. The system uses quadrature frequency conversion prior to digitization to reduce the data rate and storage requirements. Using this approach, an imaging instrument design is presented that has the capability of reconstructing images in real time in TV format without conventional scan conversion. Freeze frame is also possible although no image memory is required.

scholarly journals Real time measurements of air bubble and oil leakage in water using the 3D acoustic imaging instrument

2005 ◽  
Vol 25 (Supplement1) ◽  
pp. 397-400
Author(s):  
Kunihiro HOSHINO ◽  
Naoki NIIDA ◽  
Shoichi HARA ◽  
Kazuo HITOMI ◽  
Michihiro KAMEYAMA ◽  
...  
Keyword(s):  
Real Time ◽  
Acoustic Imaging ◽  
Air Bubble ◽  
Oil Leakage ◽  
Imaging Instrument

C-smithing of Voyager 2 non-imaging instrument pointing information at Uranus

1988 ◽  
Author(s):  
TSENG-CHAN WANG ◽  
CHARLES ACTON ◽  
IAN UNDERWOOD ◽  
STEPHEN SYNNOTT
Keyword(s):  
Voyager 2 ◽  
Imaging Instrument

Dipole Shear Imaging behind casing: Extending the borehole Acoustic Imaging envelope to Brown-fields

2014 ◽  
Author(s):  
Ashok Srivastava ◽  
Hiroaki Yamamoto ◽  
Shabbir Ahmed ◽  
Jonathon Roberts ◽  
Fabrice Cantin ◽  
...  
Keyword(s):  
Acoustic Imaging

Borehole Acoustic Imaging Using 3D STC and Ray Tracing to Determine Far-Field Reflector Dip and Azimuth

2019 ◽  
Vol 60 (2) ◽  
pp. 335-347 ◽  
Author(s):  
Nicholas Bennett ◽  
◽  
Adam Donald ◽  
Sherif Ghadiry ◽  
Mohamed Nassar ◽  
...  
Keyword(s):  
Ray Tracing ◽  
Acoustic Imaging ◽  
Far Field

Electronic Package Failure Analysis Using TDR

2000 ◽  
Author(s):  
Dima A. Smolyansky
Keyword(s):  
Failure Analysis ◽  
Fault Location ◽  
Measurement Accuracy ◽  
Time Domain Reflectometry ◽  
Acoustic Imaging ◽  
X Ray ◽  
Analysis Techniques ◽  
Bga Packages ◽  
Impedance Profile ◽  
Nature Of Time

Abstract The visual nature of Time Domain Reflectometry (TDR) makes it a very natural technology that can assist with fault location in BGA packages, which typically have complex interweaving layouts that make standard failure analysis techniques, such as acoustic imaging and X-ray, less effective and more difficult to utilize. This article discusses the use of TDR for package failure analysis work. It analyzes in detail the TDR impedance deconvolution algorithm as applicable to electronic packaging fault location work, focusing on the opportunities that impedance deconvolution and the resulting true impedance profile opens up for such work. The article examines the TDR measurement accuracy and the comparative package failure analysis, and presents three main considerations for package failure analysis. It also touches upon the goal and the task of the failure analysts and TDR's specific signatures for the open and short connections.

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