Frequency domain calculations of pulse-echo ultrasound signals with the fast nearfield method

2011 ◽  
Vol 130 (4) ◽  
pp. 2462-2462
Author(s):  
Robert J. McGough
Author(s):  
Marko Jakovljevic ◽  
Roger Michaelides ◽  
Ettore Biondi ◽  
Carl Herickhoff ◽  
Dongwoon Hyun ◽  
...  

2008 ◽  
Vol 56 ◽  
pp. 70-75 ◽  
Author(s):  
Shin Sung Kim ◽  
A. Erman Uzgur ◽  
Mel Strachan ◽  
Jean François Saillant ◽  
Katherine Kirk

Ultrasonic techniques have been proposed to determine the extension of piezoelectric multilayer actuators which can be used to construct deformable mirrors for adaptive optics. In the time domain approach, pulse-echo measurements were carried out using an ultrasonic transducer integrated with the actuator. In the frequency domain approach, the frequency shift of the integrated transducer was used to estimate the extension by analysis of the resonant spectrum for impedance magnitude. Time and frequency domain measurements were carried out on large actuators (7×7×28 mm3). Frequency domain measurements were carried out on smaller actuators (2×2×2 mm3) which are more suitable for a miniaturised deformable mirror. Monolithic integration of the ultrasonic extension sensing transducer and the actuator was demonstrated using layers in the multilayer actuators. Strong correlation was observed between the travel time of the ultrasonic pulse through the actuator and the simultaneously-measured actuator extension. It was noted, contrary to common prediction, that the travel time of the signal was earlier when the actuator was extended. Results are presented on the development of the device design, the characteristics of the prototype device and the accuracy of the sensing techniques.


2019 ◽  
Vol 146 (4) ◽  
pp. 2862-2862
Author(s):  
Marko Jakovljevic ◽  
Roger Michaelides ◽  
Ettore Biondi ◽  
Howard Zebker ◽  
Jeremy J. Dahl

Author(s):  
Thomas M. Moore

In the last decade, a variety of characterization techniques based on acoustic phenomena have come into widespread use. Characteristics of matter waves such as their ability to penetrate optically opaque solids and produce image contrast based on acoustic impedance differences have made these techniques attractive to semiconductor and integrated circuit (IC) packaging researchers.These techniques can be divided into two groups. The first group includes techniques primarily applied to IC package inspection which take advantage of the ability of ultrasound to penetrate deeply and nondestructively through optically opaque solids. C-mode Acoustic Microscopy (C-AM) is a recently developed hybrid technique which combines the narrow-band pulse-echo piezotransducers of conventional C-scan recording with the precision scanning and sophisticated signal analysis capabilities normally associated with the high frequency Scanning Acoustic Microscope (SAM). A single piezotransducer is scanned over the sample and both transmits acoustic pulses into the sample and receives acoustic echo signals from the sample.


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