Conical Refraction of Transverse Ultrasonic Waves in Quartz

1966 ◽  
Vol 39 (3) ◽  
pp. 499-505 ◽  
Author(s):  
H. J. McSkimin ◽  
W. L. Bond
Keyword(s):  
Ultrasonic Waves ◽  
Conical Refraction

"Escherichia coli-milk" Biofilm Removal from Stainless Steel Surfaces: Synergism between Ultrasonic Waves and Enzymes

Biofouling ◽  
2003 ◽  
Vol 19 (3) ◽  
pp. 159-168 ◽  
Author(s):  
Nadia Oulahal- Lagsir ◽  
Adele Martial- Gros ◽  
Marc Bonneauc ◽  
Loic Bluma
Keyword(s):  
Escherichia Coli ◽  
Stainless Steel ◽  
Ultrasonic Waves ◽  
Biofilm Removal ◽  
Steel Surfaces

" Escherichia coli -milk" Biofilm Removal from Stainless Steel Surfaces: Synergism between Ultrasonic Waves and Enzymes

Biofouling ◽  
2003 ◽  
Vol 19 (3) ◽  
pp. 159-168 ◽  
Author(s):  
NADIA OULAHAL-LAGSIR ◽  
ADELE MARTIAL-GROS ◽  
MARC BONNEAU ◽  
LOIC BLUM
Keyword(s):  
Escherichia Coli ◽  
Stainless Steel ◽  
Ultrasonic Waves ◽  
Biofilm Removal ◽  
Steel Surfaces

Failure Analysis of Flip-Chip Interconnections Through Acoustic Microscopy

1996 ◽  
Author(s):  
O. Diaz de Leon ◽  
M. Nassirian ◽  
C. Todd ◽  
R. Chowdhury
Keyword(s):  
Failure Analysis ◽  
Large Scale ◽  
Flip Chip ◽  
Ultrasonic Waves ◽  
Acoustic Microscopy ◽  
Acoustic Microscope ◽  
Chip Technology ◽  
Ball Joints ◽  
Non Destructive ◽  
Scanning Acoustic Microscope

Abstract Integration of circuits on semiconductor devices with resulting increase in pin counts is driving the need for improvements in packaging for functionality and reliability. One solution to this demand is the Flip- Chip concept in Ultra Large Scale Integration (ULSI) applications [1]. The flip-chip technology is based on the direct attach principle of die to substrate interconnection.. The absence of bondwires clearly enables packages to become more slim and compact, and also provides higher pin counts and higher-speeds [2]. However, due to its construction, with inherent hidden structures the Flip-Chip technology presents a challenge for non-destructive Failure Analysis (F/A). The scanning acoustic microscope (SAM) has recently emerged as a valuable evaluation tool for this purpose [3]. C-mode scanning acoustic microscope (C-SAM), has the ability to demonstrate non-destructive package analysis while imaging the internal features of this package. Ultrasonic waves are very sensitive, particularly when they encounter density variations at surfaces, e.g. variations such as voids or delaminations similar to air gaps. These two anomalies are common to flip-chips. The primary issue with this package technology is the non-uniformity of the die attach through solder ball joints and epoxy underfill. The ball joints also present defects as open contacts, voids or cracks. In our acoustic microscopy study packages with known defects are considered. It includes C-SCAN analysis giving top views at a particular package interface and a B-SCAN analysis that provides cross-sectional views at a desired point of interest. The cross-section analysis capability gives confidence to the failure analyst in obtaining information from a failing area without physically sectioning the sample and destroying its electrical integrity. Our results presented here prove that appropriate selection of acoustic scanning modes and frequency parameters leads to good reliable correlation between the physical defects in the devices and the information given by the acoustic microscope.

Application of guided ultrasonic waves for inspection of fuel tank floor

2007 ◽  
Author(s):  
Liudas Mažeika ◽  
Rymantas Kažys ◽  
Renaldas Raišutis ◽  
Andriejus Demčenko ◽  
Reimondas Sliteris
Keyword(s):  
Ultrasonic Waves ◽  
Fuel Tank ◽  
Guided Ultrasonic Waves

Physical Ultrasonics of Composites

2011 ◽  
Author(s):  
Dale Chimenti ◽  
Stanislav Rokhlin ◽  
Peter Nagy
Keyword(s):  
Composite Laminates ◽  
Stiffness Matrix ◽  
Composite Plates ◽  
Anisotropic Media ◽  
Anisotropic Materials ◽  
Ultrasonic Waves ◽  
Laminated Plates ◽  
Structure Characteristic ◽  
Major Advance

Physical Ultrasonics of Composites is a rigorous introduction to the characterization of composite materials by means of ultrasonic waves. Composites are treated here not simply as uniform media, but as inhomogeneous layered anisotropic media with internal structure characteristic of composite laminates. The objective here is to concentrate on exposing the singular behavior of ultrasonic waves as they interact with layered, anisotropic materials, materials which incorporate those structural elements typical of composite laminates. This book provides a synergistic description of both modeling and experimental methods in addressing wave propagation phenomena and composite property measurements. After a brief review of basic composite mechanics, a thorough treatment of ultrasonics in anisotropic media is presented, along with composite characterization methods. The interaction of ultrasonic waves at interfaces of anisotropic materials is discussed, as are guided waves in composite plates and rods. Waves in layered media are developed from the standpoint of the "Stiffness Matrix", a major advance over the conventional, potentially unstable Transfer Matrix approach. Laminated plates are treated both with the stiffness matrix and using Floquet analysis. The important influence on the received electronic signals in ultrasonic materials characterization from transducer geometry and placement are carefully exposed in a dedicated chapter. Ultrasonic wave interactions are especially susceptible to such influences because ultrasonic transducers are seldom more than a dozen or so wavelengths in diameter. The book ends with a chapter devoted to the emerging field of air-coupled ultrasonics. This new technology has come of age with the development of purpose-built transducers and electronics and is finding ever wider applications, particularly in the characterization of composite laminates.

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