More holographic interference fringe patterns by thermal deformation

1980 ◽  
Vol 18 (8) ◽  
pp. 602-602 ◽  
Author(s):  
Y. P. Hwu
2005 ◽  
Vol 2 (2) ◽  
pp. 41-56 ◽  
Author(s):  
V. S. Pisarev ◽  
V. V. Balalov ◽  
A. V. Chernov ◽  
A. N. Vinogradova ◽  
E. V. Avdiushkin ◽  
...  

2021 ◽  
Vol 2127 (1) ◽  
pp. 012019
Author(s):  
A V Kuchmenko ◽  
K M Lapitsky ◽  
I A Lapitskaya ◽  
E B Badamshina

Abstract The purpose of the present work was to investigate partially transparent and high-density two-phase liquids using the laser interference method to establish the limits of applicability of this method. The results of the work include the interference fringe patterns of drops when using various kinds of liquids, the calculated drop sizes. The calculation of inaccuracies was also carried out to further establishing the limits of applicability of this method.


2017 ◽  
Vol 739 ◽  
pp. 164-168
Author(s):  
Li Ming Chu ◽  
Jaw Ren Lin ◽  
Yuh Ping Chang

This paper presents a novel experiment method to investigate the microscopic mechanism of the oil film under the pure squeeze elastohydrodynamic lubrication (EHL) motion. An optical EHL squeeze tester is used to measure the interference fringe patterns of the contact region. In order to show the dimple thickness clearly, the grayscale interferometry method is employed to obtain the film thickness map. In addition, the effects of squeeze speed, load, and lubricant viscosity on the dimple film thickness are explored under a quasi-static condition.


1998 ◽  
Vol 120 (2) ◽  
pp. 160-165 ◽  
Author(s):  
J. Zhu ◽  
D. Zou ◽  
S. Liu

Thermally-induced failure is a major reliability issue for electronic packaging. Due to the highly nonlinear behaviors and thermal mismatch of packaging materials, an electronic package exhibits uneven thermal deformation in the whole temperature range during thermal cycling. This behavior will affect the buildup of thermal strain/stress within the package, which may affect the reliability of the package. Therefore, a real-time method is needed to monitor the thermal deformation of packages during the thermal cycling. In this study, a real-time moire´ interferometry technique coupled with a thermal vacuum chamber is used to monitor the thermal deformation of a plastic package. A grating is transferred onto the cross section of the sample at room temperature. The fringe patterns are recorded by a CCD camera system and are compared with the displacement contours obtained by nonlinear finite element simulation. High temperature moire´ results up to 200°C are reported here. The comparison between the moire´ fringe patterns and finite element results shows a good agreement. The results also show that the real-time moire´ interferometry technique is an effective way to monitor the thermal deformation of electronic packaging and is a powerful validation method for finite element analysis.


2004 ◽  
Vol 43 (30) ◽  
pp. 5600 ◽  
Author(s):  
Hyunhee Choi ◽  
Sung-Kyu Kim ◽  
Jung-Young Son ◽  
Jeong Weon Wu

2021 ◽  
Vol 133 (1029) ◽  
pp. 114502
Author(s):  
Simon Prunet

Abstract In this work, we revisit the problem of interference fringe patterns in CCD chips occurring in near-infrared bands due to multiple light reflections within the chip. We briefly discuss the traditional approaches that were developed to remove these patterns from science images, and mention their limitations. We then introduce a new method to globally estimate the fringe patterns in a collection of science images without additional external data, allowing for some variation of the patterns between images. We demonstrate this new method on near-infrared images taken by the CFHT wide-field imager Megacam.


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