Planar strain analysis of liver undergoing microwave thermal ablation using x-ray CT

2014 ◽  
Vol 42 (1) ◽  
pp. 372-380 ◽  
Author(s):  
Noam Weiss ◽  
S. Nahum Goldberg ◽  
Yitzhak Nissenbaum ◽  
Jacob Sosna ◽  
Haim Azhari
1999 ◽  
Vol 602 ◽  
Author(s):  
M. Petit ◽  
L. J. Martinez-Miranda ◽  
M. Rajeswari ◽  
A. Biswas ◽  
D. J. Kang ◽  
...  

AbstractWe have performed depth profile analyses of the lattice parameters in epitaxial thin films of La1−xCaxMno3 (LCMO), where x = 0.33 or 0.3, to understand the evolution of strain relaxation processes in these materials. The analyses were done using Grazing Incidence X-ray Scattering (GIXS) on films of different thicnesses on two different substrates, (100) oriented LaAlO3 (LAO), with a lattice mismatch of ∼2% and (110) oriented NGO, with a lattice mismatch of less than 0.1%. Films grown on LAO can exhibit up to three in-plane strained lattice constants, corresponding to a slight orthorhombic distortion of the crystal, as well as near-surface and columnar lattice relaxation. As a function of film thickness, a crossover from a strained film to a mixture of strained and relaxed regions in the film occurs in the range of 700 Å. The structural evolution at this thickness coincides with a change in the resistivity curve near the metalinsulator transition. The in-plane compressive strain has a range of 0.2 – 1.5%, depending on the film thickness for filsm in the range of 400 - 1500 A.


2001 ◽  
Vol 695 ◽  
Author(s):  
M.J. Daniels ◽  
D. King ◽  
J.S. Zabinski ◽  
Z.U. Rek ◽  
J.C. Bilello

ABSTRACTQuasicrystalline films were formed by RF sputtering from a powder composite target onto Inconel substrates, which produces a polymorphic nanoquasicrystalline grain structure, ~2.5 - 10 nm. Subsequent annealing at 500°C for 4 hours, at base pressures of below 5*10-5 Torr, and with Ar flow to 5 - 10 mT, fully develops the quasicrystalline structure with decagonal phase predominating, except near the termination surface. Analysis by XPS indicated extensive oxygen incorporation and limited aluminum enrichment at the termination surface. These results are correlated with structure and strain analysis via synchrotron grazing incidence x-ray scattering (GIXS). By varying the incident angle, hence the x-ray penetration depth, the evolution of an amorphous and crystalline crystalline secondary phases at the surface of the film has been detected. Residual strain analysis shows that this second phase induces a compressive residual strain of 0.10% as measured from the displacement of the major quasicrystalline peaks in the surface layers of the film.


2020 ◽  
Vol 47 (10) ◽  
pp. 4721-4734
Author(s):  
Omri Ziv ◽  
S. Nahum Goldberg ◽  
Yitzhak Nissenbaum ◽  
Jacob Sosna ◽  
Noam Weiss ◽  
...  

Hyomen Kagaku ◽  
2007 ◽  
Vol 28 (12) ◽  
pp. 678-681
Author(s):  
Hiroo OMI ◽  
Tomoaki KAWAMURA ◽  
Yoshihiro KOBAYASHI ◽  
Seiji FUJIKAWA ◽  
Yoshiyuki TSUSAKA ◽  
...  

2004 ◽  
Vol 443-444 ◽  
pp. 91-94 ◽  
Author(s):  
Thomas L. Christiansen ◽  
Marcel A.J. Somers

On evaluating lattice strain-depth or stress-depth profiles with X-ray diffraction, the variation of the information depth while combining various tilt angles, in combination with lattice spacing gradients leads to artefacts, so-called ghost or fictitious stresses. X-ray diffraction lattice-strain analysis was simulated for a model stress-depth profile combined with a composition-depth profile. Two principally different methods were investigated for the reconstruction of the actual stress and composition profiles from the simulated data: - considering the stress/strain determined at a specific depth as a weighted average over the actual stress/strain depth profile - considering the lattice spacing determined at a specific depth, for a specific value for as a weighted average over the actual lattice spacing profile for this direction. On the basis of the results it is possible to propose a preferred method for the evaluation of stress/strain and composition profiles, while minimising the risk for ghost stresses.


1993 ◽  
Vol 308 ◽  
Author(s):  
Richard P. Vinci ◽  
Thomas N. Marieb ◽  
John C. Bravman

ABSTRACTStress induced voiding in passivated Cu lines was investigated by x-ray strain analysis and in-situ high voltage scanning electron microscope (HVSEM) techniques. Cu lines on a Ta underlayer and Cu lines on an Al underlayer were patterned by a trilayer liftoff technique and passivated with Si3N4. For direct observation of stress voiding, specimens were heated to 350ºC in the HVSEM and then cooled and held at 150ºC. Identical samples were subjected to the same thermal cycle for strain state determination using x-ray techniques. The hydrostatic stress state at each temperature was calculated from the measured strains. Few initial voids were observed after passivation in either sample. After heating to 350ºC and cooling to the dwell temperature, no new voiding was seen in the Ta/Cu lines. Measured hydrostatic strains were half those measured in the Al/Cu lines. Heavy voiding was observed in the Al/Cu lines after cooling to the dwell temperature.


1993 ◽  
Vol 308 ◽  
Author(s):  
I. C. Noyan ◽  
G. Sheikh

ABSTRACTThe mechanical response of a specimen incorporating thin films is dictated by a combination of fundamental mechanical parameters such as Young's moduli of the individual layers, and by configurational parameters such as adhesion strength at the interface(s), residual stress distribution and other process dependent factors. In most systems, the overall response will be dominated by the properties of the (much thicker) substrate. Failure within the individual layers, on the other hand, is dependent on the local strain distributions and can not be predicted from the substrate values alone. To better understand the mechanical response of these systems, the strain within the individual layers of the thin film system must be measured and correlated with applied stresses. Phase selectivity of X-ray stress/strain analysis techniques is well suited for this purpose. In this paper, we will review the use of the traditional x-ray stress/strain analysis methods for the determination of the mechanical properties of thin film systems.


2011 ◽  
Vol 96 (4) ◽  
pp. 486-497 ◽  
Author(s):  
N. Vinet ◽  
R. L. Flemming ◽  
M. D. Higgins

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