Wafer-level micro-optics: trends in manufacturing, testing, packaging, and applications

2012 ◽  
Author(s):  
Reinhard Voelkel ◽  
Li Gong ◽  
Juergen Rieck ◽  
Alan Zheng
Keyword(s):  
Wafer Level ◽  
Manufacturing Testing ◽  
Micro Optics

Wafer-level micro-optics: trends in manufacturing, testing, and packaging

2011 ◽  
Author(s):  
Reinhard Voelkel ◽  
Kenneth J. Weible ◽  
Martin Eisner
Keyword(s):  
Wafer Level ◽  
Manufacturing Testing ◽  
Micro Optics

Wafer-Level Integration of Replicated Polymer Micro-Optics With Micromechanical Systems

2018 ◽  
Vol 30 (23) ◽  
pp. 2017-2020
Author(s):  
Sanathanan S. Muttikulangara ◽  
Maciej Baranski ◽  
George Barbastathis ◽  
Jianmin Miao
Keyword(s):  
Wafer Level ◽  
Micro Optics ◽  
Micromechanical Systems

Ultra-thin wafer-level camera with 720p resolution using micro-optics

2014 ◽  
Author(s):  
Andreas Brückner ◽  
Alexander Oberdörster ◽  
Jens Dunkel ◽  
Andreas Reimann ◽  
Martin Müller ◽  
...  
Keyword(s):  
Wafer Level ◽  
Micro Optics

scholarly journals Collective Micro-Optics Technologies for VCSEL Photonic Integration

2011 ◽  
Vol 2011 ◽  
pp. 1-11 ◽  
Author(s):  
V. Bardinal ◽  
T. Camps ◽  
B. Reig ◽  
D. Barat ◽  
E. Daran ◽  
...  
Keyword(s):  
Photonic Integration ◽  
Hybrid Assembly ◽  
Wafer Level ◽  
Output Beam ◽  
Optical Elements ◽  
Beam Focusing ◽  
Integration Techniques ◽  
Micro Optics ◽  
Alignment Errors ◽  
Beam Collimation

We describe the main recent technological approaches that associate micro-optical elements to VCSELs in order to control their output beam and to improve their photonic integration. These approaches imply either a hybrid assembly or a direct integration technique. They are compared with regards to their tolerance to alignment errors and to their ease of implementation onto arrays of devices at a wafer level. In particular, we detail the integration techniques we have developed for self-aligned polymer microlens fabrication for beam collimation and short distance beam focusing. Finally, designs to achieve active micro-optics or to exploit novel nanophotonic effects are discussed.

MEMS Wafer-level Packaging Technology Using LTCC Wafer

2012 ◽  
Vol 132 (8) ◽  
pp. 246-253 ◽  
Author(s):  
Mamoru Mohri ◽  
Masayoshi Esashi ◽  
Shuji Tanaka
Keyword(s):  
Wafer Level ◽  
Packaging Technology ◽  
Wafer Level Packaging

Silicon Migration Seal Wafer-Level Vacuum Encapsulation

2020 ◽  
Vol 140 (7) ◽  
pp. 165-169
Author(s):  
Yukio Suzuki ◽  
Dupuit Victor ◽  
Toshiya Kojima ◽  
Yoshiaki Kanamori ◽  
Shuji Tanaka
Keyword(s):  
Wafer Level

Development of Wafer Level Chip Size Packaging Process and its Application to the CMOS Image Sensor Module for Medical Device

2017 ◽  
Vol 137 (2) ◽  
pp. 48-58
Author(s):  
Noriyuki Fujimori ◽  
Takatoshi Igarashi ◽  
Takahiro Shimohata ◽  
Takuro Suyama ◽  
Kazuhiro Yoshida ◽  
...  
Keyword(s):  
Medical Device ◽  
Cmos Image Sensor ◽  
Image Sensor ◽  
Wafer Level ◽  
Packaging Process ◽  
Sensor Module ◽  
Chip Size

Low Temperature Al-Al Thermo-compression Bonding with Sn Oxidation Protect Layer for Wafer-level Hermetic Sealing

2016 ◽  
Vol 136 (6) ◽  
pp. 237-243 ◽  
Author(s):  
Shiro Satoh ◽  
Hideyuki Fukushi ◽  
Masayoshi Esashi ◽  
Shuji Tanaka
Keyword(s):  
Low Temperature ◽  
Wafer Level ◽  
Hermetic Sealing
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