Standardization Activities For Optical Digital Data Disk In Japan

Scanning tunneling microscopy (STM) has recently been introduced as a promising tool for analyzing surface atomic structure. We have used STM for its extremely high resolution (especially the direction normal to surfaces) and its ability for imaging in ambient atmosphere. We have examined surfaces of metals, semiconductors, and molecules deposited on these materials to achieve atomic resolution in favorable cases.When the high resolution capability is coupled with digital data acquisition, it is simple to get quantitative information on surface texture. This is illustrated for the measurement of surface roughness of evaporated gold films as a function of deposition temperature and annealing time in Figure 1. These results show a clear trend for which the roughness, as well as the experimental deviance of the roughness is found to be minimal for evaporation at 300°C. It is also possible to contrast different measures of roughness.

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Convergent-beam thickness determination: The advantages of digital imaging

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100169833 ◽

1994 ◽

Vol 52 ◽

pp. 420-421

Author(s):

Stuart McKernan ◽

C. Barry Carter

Keyword(s):

Intensity Variation ◽

Convergent Beam Electron Diffraction ◽

Digital Data ◽

Thickness Determination ◽

Frequent Use ◽

Automated Processing ◽

Beam Thickness ◽

Convergent Beam ◽

Remarkable Agreement

Convergent-beam electron diffraction (CBED) patterns contain an immense amount of information relating to the structure of the material from which they are obtained. The analysis of these patterns has progressed to the point that under appropriate, well specified conditions, the intensity variation within the CBED discs may be understood in a quantitative sense. Rossouw et al for example, have produced numerical simulations of zone-axis CBED patterns which show remarkable agreement with experimental patterns. Spence and co-workers have obtained the structure factor parameters for lowindex reflections using the intensity variation in 2-beam CBED patterns. Both of these examples involve the use of digital data. Perhaps the most frequent use for quantitative CBED analysis is the thickness determination described by Kelly et al. This analysis has been implemented in a variety of different ways; from real-time, in-situ analysis using the microscope controls, to measurements of photographic prints with a ruler, to automated processing of digitally acquired images. The potential advantages of this latter process will be presented.

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Slow-scan CCD cameras and low-dose High-Resolution Electron Microscopy: Direct and quantitative

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100169791 ◽

1994 ◽

Vol 52 ◽

pp. 412-413

Author(s):

M. Pan

Keyword(s):

Electron Microscopy ◽

High Resolution ◽

Structural Damage ◽

Low Dose ◽

Dynamic Range ◽

High Resolution Electron Microscopy ◽

Operating Conditions ◽

Digital Data ◽

Ccd Cameras ◽

Resolution Electron

It has been known for many years that materials such as zeolites, polymers, and biological specimens have crystalline structures that are vulnerable to electron beam irradiation. This radiation damage severely restrains the use of high resolution electron microscopy (HREM). As a result, structural characterization of these materials using HREM techniques becomes difficult and challenging. The emergence of slow-scan CCD cameras in recent years has made it possible to record high resolution (∽2Å) structural images with low beam intensity before any apparent structural damage occurs. Among the many ideal properties of slow-scan CCD cameras, the low readout noise and digital recording allow for low-dose HREM to be carried out in an efficient and quantitative way. For example, the image quality (or resolution) can be readily evaluated on-line at the microscope and this information can then be used to optimize the operating conditions, thus ensuring that high quality images are recorded. Since slow-scan CCD cameras output (undistorted) digital data within the large dynamic range (103-104), they are ideal for quantitative electron diffraction and microscopy.

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Quantitative Electron Microscope with imaging plate

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100169778 ◽

1994 ◽

Vol 52 ◽

pp. 408-409

Author(s):

D. Shindo

Keyword(s):

Electron Microscope ◽

Dynamic Range ◽

Processing System ◽

Digital Data ◽

Imaging Plate ◽

Crystal Thickness ◽

X Ray Diffraction ◽

Resolution Electron ◽

Electron Intensity ◽

Diffraction Patterns

Imaging plate has good properties, i.e., a wide dynamic range and good linearity for the electron intensity. Thus the digital data (2048x1536 pixels, 4096 gray levels in log scale) obtained with the imaging plate can be used for quantification in electron microscopy. By using the image processing system (PIXsysTEM) combined with a main frame (ACOS3900), quantitative analysis of electron diffraction patterns and high-resolution electron microscope (HREM) images has been successfully carried out.In the analysis of HREM images observed with the imaging plate, quantitative comparison between observed intensity and calculated intensity can be carried out by taking into account the experimental parameters such as crystal thickness and defocus value. An example of HREM images of quenched Tl2Ba2Cu1Oy (Tc = 70K) observed with the imaging plate is shown in Figs. 1(b) - (d) comparing with a structure model proposed by x-ray diffraction study of Fig. 1 (a). The image was observed with a JEM-4000EX electron microscope (Cs =1.0 mm).

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MATERIAL HANDLING MACHINES AND SYSTEMS – UMI-TWINN PROJECT CONTRIBUTION

Advanced Logistic Systems - Theory and Practice ◽

10.32971/als.2019.001 ◽

2019 ◽

Vol 12 (1) ◽

pp. 7-20

Author(s):

Péter Telek ◽

Béla Illés ◽

Christian Landschützer ◽

Fabian Schenk ◽

Flavien Massi

Keyword(s):

Material Handling ◽

Digital Data ◽

Flow Process ◽

Research Directions ◽

Scientific Excellence ◽

Research Activities ◽

New Research ◽

Eu Project ◽

The University

Nowadays, the Industry 4.0 concept affects every area of the industrial, economic, social and personal sectors. The most significant changings are the automation and the digitalization. This is also true for the material handling processes, where the handling systems use more and more automated machines; planning, operation and optimization of different logistic processes are based on many digital data collected from the material flow process. However, new methods and devices require new solutions which define new research directions. In this paper we describe the state of the art of the material handling researches and draw the role of the UMi-TWINN partner institutes in these fields. As a result of this H2020 EU project, scientific excellence of the University of Miskolc can be increased and new research activities will be started.

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