Automatic Visual Inspection Of Solder Joints On Printed Circuit Boards

1982 ◽  
Author(s):  
Yasuo Nakagawa
Keyword(s):  
Visual Inspection ◽  
Printed Circuit Boards ◽  
Solder Joints ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Automatic Visual Inspection

The Automatic Visual Inspection of Printed Circuit Boards

Circuit World ◽  
1982 ◽  
Vol 8 (2) ◽  
pp. 50-56 ◽  
Author(s):  
G.A.W. West ◽  
L. Norton‐Wayne ◽  
W.J. Hill
Keyword(s):  
Visual Inspection ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Automatic Visual Inspection

Intelligent detection of solder joints on printed circuit boards

2011 ◽  
Vol 19 (9) ◽  
pp. 2154-2162 ◽  
Author(s):  
谢宏威 XIE Hong-wei ◽  
张宪民 ZHANG Xian-min ◽  
邝泳聪 KUANG Yong-cong ◽  
欧阳高飞 OUYANG Gao-fei
Keyword(s):  
Printed Circuit Boards ◽  
Solder Joints ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Intelligent Detection

scholarly journals Solder Paste Scooping Detection by Multilevel Visual Inspection of Printed Circuit Boards

2013 ◽  
Vol 60 (6) ◽  
pp. 2318-2331 ◽  
Author(s):  
Csaba Benedek ◽  
Olivér Krammer ◽  
Mihály Janoczki ◽  
László Jakab
Keyword(s):  
Visual Inspection ◽  
Printed Circuit Boards ◽  
Solder Paste ◽  
Circuit Boards ◽  
Printed Circuit

Stress Analysis of Printed Circuit Boards With Highly Populated Solder Joints and Components: A Micromechanics Approach

1996 ◽  
Vol 118 (2) ◽  
pp. 87-93
Author(s):  
K. X. Hu ◽  
Y. Huang ◽  
C. P. Yeh ◽  
K. W. Wyatt
Keyword(s):  
Stress Analysis ◽  
Printed Circuit Boards ◽  
Solder Joints ◽  
Effective Properties ◽  
Mechanical Analysis ◽  
Computational Effort ◽  
Circuit Boards ◽  
Element Analysis ◽  
Printed Circuit ◽  
Board Level

The single most difficult aspect for thermo-mechanical analysis at the board level lies in to an accurate accounting for interactions among boards and small features such as solder joints and secondary components. It is the large number of small features populated in a close neighborhood that proliferates the computational intensity. This paper presents an approach to stress analysis for boards with highly populated small features (solder joints, for example). To this end, a generalized self-consistent method, utilizing an energy balance framework and a three-phase composite model, is developed to obtain the effective properties at board level. The stress distribution inside joints and components are obtained through a back substitution. The solutions presented are mostly in the closed-form and require a minimum computational effort. The results obtained by present approach are compared with those by finite element analysis. The numerical calculations show that the proposed micromechanics approach can provide reasonably accurate solutions for highly populated printed circuit boards.

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