Photoluminescence Characterization Of Thermally-Induced Defects In Czochralski-Grown Si Wafers

1981 ◽  
Author(s):  
T. Nishino ◽  
H. Nakayama ◽  
J. Katsura ◽  
Y. Hamakawa
2002 ◽  
Vol 237-239 ◽  
pp. 1388-1393
Author(s):  
Petra Feichtinger ◽  
Mark S. Goorsky ◽  
Frank Muemmler ◽  
Steve Rickborn ◽  
Quynh Tran ◽  
...  

1982 ◽  
Vol 21 (Part 1, No. 5) ◽  
pp. 712-715 ◽  
Author(s):  
Johji Katsura ◽  
Hiroshi Nakayama ◽  
Taneo Nishino ◽  
Yoshihiro Hamakawa

Author(s):  
R.T. Blackham ◽  
J.J. Haugh ◽  
C.W. Hughes ◽  
M.G. Burke

Essential to the characterization of materials using analytical electron microscopy (AEM) techniques is the specimen itself. Without suitable samples, detailed microstructural analysis is not possible. Ultramicrotomy, or diamond knife sectioning, is a well-known mechanical specimen preparation technique which has been gaining attention in the materials science area. Malis and co-workers and Glanvill have demonstrated the usefulness and applicability of this technique to the study of a wide variety of materials including Al alloys, composites, and semiconductors. Ultramicrotomed specimens have uniform thickness with relatively large electron-transparent areas which are suitable for AEM anaysis.Interface Analysis in Type 316 Austenitic Stainless Steel: STEM-EDS microanalysis of grain boundaries in austenitic stainless steels provides important information concerning the development of Cr-depleted zones which accompany M23C6 precipitation, and documentation of radiation induced segregation (RIS). Conventional methods of TEM sample preparation are suitable for the evaluation of thermally induced segregation, but neutron irradiated samples present a variety of problems in both the preparation and in the AEM analysis, in addition to the handling hazard.


Author(s):  
P. Schwindenhammer ◽  
H. Murray ◽  
P. Descamps ◽  
P. Poirier

Abstract Decapsulation of complex semiconductor packages for failure analysis is enhanced by laser ablation. If lasers are potentially dangerous for Integrated Circuits (IC) surface they also generate a thermal elevation of the package during the ablation process. During measurement of this temperature it was observed another and unexpected electrical phenomenon in the IC induced by laser. It is demonstrated that this new phenomenon is not thermally induced and occurs under certain ablation conditions.


2015 ◽  
Vol 159 ◽  
pp. 118-121 ◽  
Author(s):  
Ernandes T. Tenório-Neto ◽  
Marcos R. Guilherme ◽  
Manuel E.G. Winkler ◽  
Lucio Cardozo-Filho ◽  
Stéphani C. Beneti ◽  
...  

2009 ◽  
Vol 404 (22) ◽  
pp. 4485-4488 ◽  
Author(s):  
B.N. Masina ◽  
A. Forbes ◽  
O.M. Ndwandwe ◽  
G. Hearne ◽  
B.W. Mwakikunga ◽  
...  

Vacuum ◽  
1995 ◽  
Vol 46 (8-10) ◽  
pp. 1087-1090 ◽  
Author(s):  
F Danie Auret ◽  
SA Goodman ◽  
G Myburg ◽  
WO Barnard

1995 ◽  
Vol 403 ◽  
Author(s):  
R. Venkatasubramanian ◽  
B. O'Quinn ◽  
J. S. Hills ◽  
M. L. Timmons ◽  
D. P. Malta

AbstractThe characterization of MOCVD-grown GaAs-AlGaAs materials and GaAs p+n junctions on poly-Ge substrates is presented. Minority carrier lifetime in GaAs-AIGaAs double-hetero (DH) structures grown on these substrates and the variation of lifetimes across different grainstructures are discussed. Minority-carrier diffusion lengths in polycrystalline GaAs p+-n junctions were evaluated by cross-sectional electron-beam induced current (EBIC) scans. The junctions were also studied by plan-view EBIC imaging. Optimization studies of GaAs solar cell on poly-Ge are discussed briefly. The effect of various polycrystalline substrate-induced defects on performance of GaAs solar cells are presented.


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