Fully integrated system-on-chip for pixel-based 3D depth and scene mapping

Author(s):  
Martin Popp ◽  
Beat De Coi ◽  
Markus Thalmann ◽  
Radoslav Gancarz ◽  
Pascal Ferrat ◽  
...  
Author(s):  
C. Gamauf ◽  
M. Siegele ◽  
A. Nemecek ◽  
G. C. Mutinati ◽  
S. Steinhauer ◽  
...  

2019 ◽  
Vol 29 (07) ◽  
pp. 2030007
Author(s):  
Selvakumar Mariappan ◽  
Jagadheswaran Rajendran ◽  
Harikrishnan Ramiah ◽  
Norlaili Mohd Noh ◽  
Asrulnizam Abd Manaf

Wireless communication standard continues to evolve in order to fulfill the demand for high data rate operation. This leads to the exertion on the design of radio frequency power amplifier (RFPA) which consumes high DC power in order to support linear transmission of high data rate signal. Hence, operating the PA with low DC power consumption without trading-off the linearity is vital in order to achieve the goal of achieving fully integrated system-on-chip (SoC) solution for 4G and 5G transceivers. In this paper, the evolution of CMOS PA toward achieving a fully integrated transceiver solution is discussed through the review of multifarious CMOS PA design. This is categorized into the review of efficiency enhancement designs followed by linearity enhancement designs of the CMOS PA.


Sensors ◽  
2012 ◽  
Vol 12 (9) ◽  
pp. 11592-11600 ◽  
Author(s):  
Che-Wei Huang ◽  
Yu-Jie Huang ◽  
Shey-Shi Lu ◽  
Chih-Ting Lin

2021 ◽  
Vol 56 (1) ◽  
pp. 123-135
Author(s):  
Yi-Chung Wu ◽  
Yen-Lung Chen ◽  
Chung-Hsuan Yang ◽  
Chao-Hsi Lee ◽  
Chao-Yang Yu ◽  
...  

Author(s):  
Krzysztof Siwiec ◽  
Krzysztof Marcinek ◽  
Piotr Boguszewicz ◽  
Tomasz Borejko ◽  
Aleh Halauko ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document