Laser ablation plasmas for diagnostics of structured electronic and optical materials during or after laser processing

Author(s):  
Richard E. Russo ◽  
Alexander A. Bol'shakov ◽  
Jong H. Yoo ◽  
Jhanis J. González
Author(s):  
Babak Soltani ◽  
Faramarz Hojati ◽  
Amir Daneshi ◽  
Bahman Azarhoushang

AbstractUnderstanding the laser ablation mechanism is highly essential to find the effect of different laser parameters on the quality of the laser ablation. A mathematical model was developed in the current investigation to calculate the material removal rate and ablation depth. Laser cuts were created on the workpiece with different laser scan speeds from 1 to 10 mm s−1 by an ultrashort pulse laser with a wavelength of about 1000 nm. The calculated depths of laser cuts were validated via practical experiments. The variation of the laser power intensity on the workpiece’s surface during laser radiation was also calculated. The mathematical model has determined the laser-material interaction mechanism for different laser intensities. The practical sublimation temperature and ablated material temperature during laser processing are other data that the model calculates. The results show that in laser power intensities (IL) higher than 1.5 × 109 W cm−2, the laser-material interaction is multiphoton ionisation with no effects of thermal reaction, while in lower values of IL, there are effects of thermal damages and HAZ adjacent to the laser cut. The angle of incidence is an essential factor in altering incident IL on the surface of the workpiece during laser processing, which changes with increasing depth of the laser cut.


2021 ◽  
Author(s):  
Ralf Jedamzik ◽  
Antoine Carre ◽  
Volker Hagemann ◽  
Lothar Bartelmess ◽  
Sebastian Leukel ◽  
...  

2007 ◽  
Vol 102 (9) ◽  
pp. 093102 ◽  
Author(s):  
Seung H. Ko ◽  
Heng Pan ◽  
David J. Hwang ◽  
Jaewon Chung ◽  
Sangil Ryu ◽  
...  

2021 ◽  
Vol 1135 (1) ◽  
pp. 012027
Author(s):  
Stefan Rung ◽  
Niklas Häcker ◽  
Ralf Hellmann

Abstract The application of pulsed laser systems with pulse durations in the pico- and femtosecond regime for material processing is commonly associated with a cold ablation. Due to the minimized interaction-time between the ultrashort laser pulses and the material, this statement is almost valid as long as no heat accumulation effect appears. With the increasing demand of high productivity processes, the average power of ultrashort pulsed laser systems increases above 100 W, which leads, however, to increased thermal effects during laser processing. This is especially important for laser processing of technical ceramics like alumina. Large temperatures gradients, which locally occur during laser processing using high average power could lead to thermal modifications and cracks in the material. In this study, we present a process-optimization method for high power laser ablation of alumina based on thermal imaging. The use of a 2D IR camera enables the estimation of the temperature distribution during the laser processing. We investigate the influence of laser power up to 80 W, pulse duration between 900 fs and 10 ps and processing duration on the resulting material temperature. Beside the material temperature we evaluate the material removal rate and the resulting surface quality.


2021 ◽  
Vol 410 ◽  
pp. 748-752
Author(s):  
Ruslan V. Chkalov ◽  
Darya G. Chkalova

The work is devoted to the problem of controlled laser micromachining of materials surface layers. The problem of ablation products reverse deposition near the laser processing region is considered. Laser ablation products, in addition to direct interaction with laser radiation, significantly increase lifetime and temperature of laser-induced plasma torch, which leads to decrease in energy entering processing area, as a result of which not removal, but heating of coating material occurs. Ablated particles can be deposited on the processed samples surface, which causes distortions in recorded structure spatial geometry. The possibility of using an electrostatic filtration system is considered as a method for protecting treated surface.


1995 ◽  
Vol 397 ◽  
Author(s):  
D. Bàuerle ◽  
E. Arenholz ◽  
N. Arnold ◽  
J. Heitz ◽  
P.B. Kargl

ABSTRACTThis paper gives an overview on different types of instabilities and structure formation in various fields of laser processing. Among the examples discussed in detail are non-coherent structures observed in laser-induced chemical vapor deposition (LCVD), in laser-induced surface modifications, and in laser ablation of polymers.


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