Effect of laser beam size on laser-induced damage performance

2011 ◽  
Author(s):  
Wei Han ◽  
Fang Wang ◽  
Lidan Zhou ◽  
Fuquan Li ◽  
Bin Feng ◽  
...  
Author(s):  
Jérémie Capoulade ◽  
Jean-Yves Natoli ◽  
Anne Hildenbrand ◽  
Laurent Gallais ◽  
Mireille Commandré

2006 ◽  
Author(s):  
J. Capoulade ◽  
J. Y. Natoli ◽  
B. Bertussi ◽  
M. Pommies ◽  
A. Dyan ◽  
...  

2012 ◽  
Vol 21 (7) ◽  
pp. 077901 ◽  
Author(s):  
Wei Han ◽  
Fang Wang ◽  
Li-Dan Zhou ◽  
Bin Feng ◽  
Huai-Ting Jia ◽  
...  

Materials ◽  
2022 ◽  
Vol 15 (2) ◽  
pp. 530
Author(s):  
Zachary A. Young ◽  
Meelap M. Coday ◽  
Qilin Guo ◽  
Minglei Qu ◽  
S. Mohammad H. Hojjatzadeh ◽  
...  

Selective laser melting (SLM) additive manufacturing (AM) exhibits uncertainties, where variations in build quality are present despite utilizing the same optimized processing parameters. In this work, we identify the sources of uncertainty in SLM process by in-situ characterization of SLM dynamics induced by small variations in processing parameters. We show that variations in the laser beam size, laser power, laser scan speed, and powder layer thickness result in significant variations in the depression zone, melt pool, and spatter behavior. On average, a small deviation of only ~5% from the optimized/reference laser processing parameter resulted in a ~10% or greater change in the depression zone and melt pool geometries. For spatter dynamics, small variation (10 μm, 11%) of the laser beam size could lead to over 40% change in the overall volume of the spatter generated. The responses of the SLM dynamics to small variations of processing parameters revealed in this work are useful for understanding the process uncertainties in the SLM process.


1999 ◽  
Vol 35 (21) ◽  
pp. 1875 ◽  
Author(s):  
Y.E. Yenice ◽  
B.G. Evans

1991 ◽  
Vol 236 ◽  
Author(s):  
T. S. Savage ◽  
P. Xu ◽  
R. Ai ◽  
D. Dunn ◽  
L. D. Marks

AbstractThe effects of pulsed laser irradiation on silicon (111) single crystal thin samples were studied in a ultra-high vacuum transmission electron microscope. Samples were found to cleave along (110) planes under the laser beam. The formation of dislocation networks was also observed. The cleaving did not seem to originate from previously observed defect areas, but from random places, and is believed to be caused by thermal shock from laser beam heating. Bulk defects in the specimens, such as stacking fault tetrahedra and dislocations, were not observed to be affected by the laser treatment.


1985 ◽  
Vol 56 (11) ◽  
pp. 2176-2177 ◽  
Author(s):  
D. P. Shelton
Keyword(s):  

2017 ◽  
Vol 139 (5) ◽  
Author(s):  
Jinsung Rho ◽  
Bong Jae Lee

This work describes a novel technique for simultaneously determining local temperature and thickness of a heavily doped Si heater having a submicron width by using two-wavelength thermoreflectance microscopy. The doped silicon line heater, whose thickness and width are, respectively, 480 nm and 900 nm, is fabricated by conventional microfabrication techniques on a fused silica wafer. The full width at half maximum (FWHM) of the focused laser beam is measured to be 2.00 μm and 2.28 μm for green (λ = 516 nm) and red (λ = 640 nm) lasers, respectively. Because the heater width is narrower than the focused laser beam size, the reflected beam contains background information (i.e., reflection from the fused silica substrate) in addition to the thermoreflectance signal from the doped silicon heater. With precise knowledge of the laser beam size, heater width, and exact location of the laser beam spot on the heater, one can quantitatively model the reflectance. In reality, however, due to the difficulty of aligning the laser beam with respect to the submicron-wide Si heater, precise determination of local temperature from thermoreflectance signal is not easily attained. In the present study, instead of aligning the laser beam to the center of the submicron silicon heater, the probe laser horizontally scans over a region of the heater. By taking into account the size of the focused laser beam and the width of the doped silicon heater, it is possible to determine the absolute temperature of a local region of the heater from the measured reflectance during the scanning, even though the width of the heater line is only 39% of the size of the laser beam.


Author(s):  
Wahaizad Bin Safiei ◽  
Mohd Rashdan Bin Ab Rashid

High-quality products and shorten manufacturing lead time are very important factors addressed by many companies. Typically, low-quality products are induced by inconsistent of manufacturing process performance. To get a constant laser power in Infrared (IR) Laser Marking process was a common problem facing by many engineers in the manufacturing industry. This consequences might effect on laser marking characteristics such as the possibility of burn marking or blur marking particularly on the products. Therefore, the objective of this paper is to study the interaction between Infrared (IR) Laser Marking input parameters such as current (amp), frequency (Hz), water flow (l/min) and laser beam size (mm) on laser power (watt) as the main response. Furthermore, the response of laser power from Infra-Red laser process can be predicted when all combinations of parameters are tested. The IR marking machine was deployed and experimental studies were conducted in order to meet this objective. The experiments were based on Design of Experiment (DOE) and Response Surface Methodology (RSM) because second order model or polynomial equation was needed to fit for the response. The relationship between input and output parameters can be visualized by 3D graphs which were developed from Mathematical modeling. Based on the experiment results, the parameters that have significant effects on the laser power are current, laser beam size and water flow. However, frequency does not have a significant factor in this study.


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