Thermal-contact-conductance measurement for high-heat-load optics components at SPring-8

2011 ◽  
Author(s):  
T. Takeuchi ◽  
M. Tanaka ◽  
Y. Senba ◽  
H. Ohashi ◽  
S. Goto
Keyword(s):  
Heat Load ◽  
Thermal Contact ◽  
High Heat ◽  
Thermal Contact Conductance ◽  
Conductance Measurement ◽  
Contact Conductance ◽  
High Heat Load

Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement

2000 ◽  
Vol 123 (3) ◽  
pp. 309-311 ◽  
Author(s):  
Xiangcheng Luo, ◽  
Yunsheng Xu, and ◽  
D. D. L. Chung
Keyword(s):  
Sodium Silicate ◽  
Thermal Contact ◽  
The Other ◽  
Thermal Contact Conductance ◽  
Conductance Measurement ◽  
Thermal Interface ◽  
Contact Conductance ◽  
Before And After ◽  
Heating Up ◽  
Thermal Stability Of

Thermal interface pastes based on silicone, lithium doped polyethylene glycol (PEG), and sodium silicate were evaluated in their performance before and after heating up to 120°C. The thermal contact conductance of any of the pastes between copper disks decreased after heating, such that the fractional decrease was less for the silicone-based paste than the PEG-based and sodium-silicate-based pastes. Nevertheless, the conductance was lower for the silicone-based paste than the other pastes both before and after heating up to 100 cycles.

Review of models for thermal contact conductance of metals

10.2514/3.870 ◽  
1997 ◽  
Vol 11 ◽  
pp. 129-140
Author(s):  
B. Merci ◽  
J. Steelant ◽  
J. Vierendeels ◽  
K. Riemslagh ◽  
E. Dick ◽  
...  
Keyword(s):  
Thermal Contact ◽  
Thermal Contact Conductance ◽  
Contact Conductance

Thermal contact conductance of adhesives for microelectronic systems

10.2514/3.871 ◽  
1997 ◽  
Vol 11 ◽  
pp. 141-145
Author(s):  
Andreas Haselbacher ◽  
Jiri Blazek ◽  
S. R. Mirmira ◽  
E. Marotta ◽  
L. S. Fletcher
Keyword(s):  
Thermal Contact ◽  
Thermal Contact Conductance ◽  
Contact Conductance
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