Thin film CIGS photovoltaic modules: monolithic integration and advanced packaging for high performance, high reliability and low cost

2011 ◽  
Author(s):  
Louay Eldada
Keyword(s):  
Thin Film ◽  
High Performance ◽  
High Reliability ◽  
Low Cost ◽  
Monolithic Integration ◽  
Photovoltaic Modules ◽  
Advanced Packaging

Electrostatic bellow muscle actuators and energy harvesters that stack up

2021 ◽  
Vol 6 (51) ◽  
pp. eaaz5796
Author(s):  
I. D. Sîrbu ◽  
G. Moretti ◽  
G. Bortolotti ◽  
M. Bolignari ◽  
S. Diré ◽  
...  
Keyword(s):  
High Performance ◽  
High Reliability ◽  
Low Cost ◽  
Artificial Muscle ◽  
Pressure Head ◽  
Robotic Systems ◽  
Maximum Pressure ◽  
Term Operation ◽  
Energy Harvesters ◽  
Out Of Plane

Future robotic systems will be pervasive technologies operating autonomously in unknown spaces that are shared with humans. Such complex interactions make it compulsory for them to be lightweight, soft, and efficient in a way to guarantee safety, robustness, and long-term operation. Such a set of qualities can be achieved using soft multipurpose systems that combine, integrate, and commute between conventional electromechanical and fluidic drives, as well as harvest energy during inactive actuation phases for increased energy efficiency. Here, we present an electrostatic actuator made of thin films and liquid dielectrics combined with rigid polymeric stiffening elements to form a circular electrostatic bellow muscle (EBM) unit capable of out-of-plane contraction. These units are easy to manufacture and can be arranged in arrays and stacks, which can be used as a contractile artificial muscle, as a pump for fluid-driven soft robots, or as an energy harvester. As an artificial muscle, EBMs of 20 to 40 millimeters in diameter can exert forces of up to 6 newtons, lift loads over a hundred times their own weight, and reach contractions of over 40% with strain rates over 1200% per second, with a bandwidth over 10 hertz. As a pump driver, these EBMs produce flow rates of up to 0.63 liters per minute and maximum pressure head of 6 kilopascals, whereas as generator, they reach a conversion efficiency close to 20%. The compact shape, low cost, simple assembling procedure, high reliability, and large contractions make the EBM a promising technology for high-performance robotic systems.

High-performance thin-film composite forward osmosis membrane fabricated on low-cost PVB/PVC substrate

2018 ◽  
Vol 42 (16) ◽  
pp. 13382-13392 ◽  
Author(s):  
Ke Zheng ◽  
Shaoqi Zhou ◽  
Xuan Zhou
Keyword(s):  
Thin Film ◽  
High Performance ◽  
Low Cost ◽  
Forward Osmosis ◽  
Film Composite ◽  
Thin Film Composite

The incorporation of the PVB significantly improved the performance of the PVB/PVC substrates based thin-film composite forward osmosis membrane.

Packaging Materials for 2.5/3D Technology

2013 ◽  
Vol 2013 (1) ◽  
pp. 000276-000284 ◽  
Author(s):  
Brian Schmaltz
Keyword(s):  
High Reliability ◽  
Low Cost ◽  
High Yield ◽  
Wafer Level ◽  
Reflow Process ◽  
Thermal Compression ◽  
Conductive Films ◽  
Cu Pillar ◽  
Advanced Packaging ◽  
Capillary Underfill

The age of advanced mobile devices is on the direct horizon, are we ready for it? Less power consumption, faster processing, high reliability, high yield, low cost are words engineers are all too familiar with. 2.5/3D utilizing interposer technology, Thru Silicon Via (TSV), sub-50μm die thickness are a few of the latest techniques engineers use to solve these issues. As technology progresses to smaller process generations, new packaging applications are being demanded. The standard solder reflow process is being pushed by advancements in Cu pillar bumps, thermal compression bonding (TCB) and wafer level / pre-applied materials. This presentation will centralize around the latest advancements in NAMICS Materials for Advanced Packaging Technology; Capillary Underfill (CUF), Pre-Applied Material, Non-Conductive Paste (NCP), Non-Conductive Films (NCF).

A HIGH THROUGHPUT, LOW COST ASSEMBLY APPROACH FOR LED IMS PACKAGES TO HEAT SINK USING ADVANCED THERMAL INTERFACE MATERIALS

2015 ◽  
Vol 2015 (1) ◽  
pp. 000627-000632 ◽  
Author(s):  
Swapan K. Bhattacharya ◽  
Fei Xie ◽  
Han Wu ◽  
Kelley Hodge ◽  
Keck Pathammavong ◽  
...  
Keyword(s):  
Heat Sink ◽  
High Performance ◽  
High Reliability ◽  
Low Cost ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Cycle Times ◽  
High Adhesion ◽  
Machine Cycle

The objective of this study is to design and fabricate a high reliability LED Insulated Metal Substrate (IMS) package to complex heat sink attachment using an advanced thermal interface material (TIM). The assembly consists of LED IMS parts bonded to a heat spreader/sink using an advanced TIM and a corner bond material to quickly and accurately secure the LEDs in position. The corner bond adhesive is snap cured for fast machine cycle times while the high performance, high adhesion TIM materials cure throughout the rest of the assembly operation. This approach allows high accuracy LED bonding without the need for alignment pins or fasteners to anchor to the IMS. The IMS attached to the heat sink is then electrically interconnected with a thin flex substrate on top of the IMS. This approach is expected to replace the current mechanical fastners and low strength silicone TIM materials and reduce the cycle time and overall placement cost which are key drivers especially for the automotive industry.

scholarly journals High-performance thermoelectric silver selenide thin films cation exchanged from a copper selenide template

2020 ◽  
Vol 2 (1) ◽  
pp. 368-376 ◽  
Author(s):  
Nan Chen ◽  
Michael R. Scimeca ◽  
Shlok J. Paul ◽  
Shihab B. Hafiz ◽  
Ze Yang ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Cation Exchange ◽  
High Performance ◽  
Low Cost ◽  
Copper Selenide ◽  
Silver Selenide ◽  
Solution Processed

A high-performance n-type thermoelectric Ag2Se thin film via cation exchange using a low-cost solution processed Cu2Se template.

Eco-friendly, solution-processed In-W-O thin films and their applications in low-voltage, high-performance transistors

2016 ◽  
Vol 4 (20) ◽  
pp. 4478-4484 ◽  
Author(s):  
Ao Liu ◽  
Guoxia Liu ◽  
Huihui Zhu ◽  
Byoungchul Shin ◽  
Elvira Fortunato ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Thin Film Transistors ◽  
High Performance ◽  
Low Voltage ◽  
Low Cost ◽  
Solution Process ◽  
Solution Processed

Eco-friendly IWO thin films are fabricated via a low-cost solution process and employed as channel layers in thin-film transistors.

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