Aspect ratios, sizes, and etch rates in photostructurable glass-ceramic

2008 ◽  
Author(s):  
J. Stillman ◽  
J. Judy ◽  
H. Helvajian
Keyword(s):  
Glass Ceramic ◽  
Aspect Ratios ◽  
Etch Rates ◽  
Photostructurable Glass

Cost Effective Production of Glass Interposers for 3D ICs Using APEX(TM) Glass Ceramic

2011 ◽  
Vol 2011 (DPC) ◽  
pp. 001269-001290
Author(s):  
Jeb H. Flemming ◽  
Kevin Dunn ◽  
James Gouker ◽  
Carrie Schmidt
Keyword(s):  
Glass Ceramic ◽  
Cost Effective ◽  
Electrical Performance ◽  
Sensitive Material ◽  
Aspect Ratios ◽  
3D Ics ◽  
Simple Processing ◽  
Micron Diameter ◽  
On Chip ◽  
Processing Steps

The most singular focus of the electronics industry during the last 50 years has been to miniaturize ICs by miniaturization of transistors and on-chip interconnections. Two major problems are foreseen with this approach; electrical leakage and lack of improved electrical performance beyond 16nm. As a result, industry is transitioning from the current SOC-based approach to a through-silicon-via (TSV) based 3D IC-stacked approach. However, a major challenge remains; these 3D ICs need to be interconnected to other ICs with a much higher number of I/Os than are available with current ceramic or organic interposers. While silicon interposers currently in development can provide these high I/Os, they cannot do so at low enough cost. In this talk, we will present on our efforts in glass interposers fabrication. Glass interposers possess many advantages over silicon interposers including: cost, production time, and scale. Life MicroFab's APEX™ Glass ceramic is a photo-sensitive material used to create high density arrays of through glass vias (TGVs) using three simple processing steps: exposure, baking, and etching. To date, we have been successful in producing large arrays of 12 micron diameter TGVs, with 14 micron center-to-center pitchs, in 125 micron thick APEX™ Glass ceramic. We will present (1) on our efforts producing high aspect ratio TGVs in thin (500-250 micron) and ultra thin (250-75 micron) APEX™ Glass ceramic wafers, (2) maximum TGV aspect ratios, and (3) TGV fidelity and limits of manufacturing.

DRY ETCHING OF SnO2 AND ZnO FILMS IN HALOGEN-BASED INDUCTIVELY COUPLED PLASMAS

2011 ◽  
Vol 25 (31) ◽  
pp. 4237-4240 ◽  
Author(s):  
JONG CHEON PARK ◽  
JIN KON KIM ◽  
TAE GYU KIM ◽  
DEUG WOO LEE ◽  
HYUN CHO ◽  
...  
Keyword(s):  
Process Window ◽  
Zno Films ◽  
Inductively Coupled Plasmas ◽  
Oxide Nanowires ◽  
Inductively Coupled ◽  
Aspect Ratios ◽  
High Anisotropy ◽  
Mask Material ◽  
Etch Rates ◽  
Coupled Plasmas

High density plasma etching of SnO 2 and ZnO films was performed in chlorine- ( Cl 2/ Ar and BCl 3/ Ar ) and fluorine-based ( CF 4/ Ar and SF 6/ Ar ) inductively coupled plasmas. The etch process window for fabricating metal oxide nanowires with high aspect ratios including high and controllable etch rates, high etch selectivities to mask material and high anisotropy was established. Maximum etch rates of ~2050 Å/minute ( BCl 3/ Ar ) and ~1950 Å/minute ( SF 6/ Ar ) for ZnO , and ~1950 Å/minute ( Cl 2/ Ar ) and ~2000 Å/minute ( SF 6/ Ar ) for SnO 2 were obtained. Ni was found to provide very high etch selectivities with maximum values of ~67 to SnO 2 and ~17 to ZnO , respectively.

Development of an Inspector Satellite Using Photostructurable Glass/Ceramic Materials

Space 2005 ◽  
2005 ◽  
Author(s):  
Siegfried Janson ◽  
Po-Hao Huang ◽  
William Hansen ◽  
Lee Steffeney ◽  
Henry Helvajian
Keyword(s):  
Glass Ceramic ◽  
Ceramic Materials ◽  
Glass Ceramic Materials ◽  
Photostructurable Glass

scholarly journals 3D features of modified photostructurable glass–ceramic with infrared femtosecond laser pulses

2011 ◽  
Vol 257 (12) ◽  
pp. 5219-5222 ◽  
Author(s):  
J.M. Fernández-Pradas ◽  
D. Serrano ◽  
S. Bosch ◽  
J.L. Morenza ◽  
P. Serra
Keyword(s):  
Femtosecond Laser ◽  
Glass Ceramic ◽  
Laser Pulses ◽  
Femtosecond Laser Pulses ◽  
Photostructurable Glass

Cost effective Precision 3D Glass Microfabrication for Electronic Packaging

2011 ◽  
Vol 2011 (1) ◽  
pp. 000199-000201
Author(s):  
Jeb H. Flemming ◽  
Kevin Dunn ◽  
James Gouker ◽  
Carrie Schmidt ◽  
Colin Buckley
Keyword(s):  
Glass Ceramic ◽  
Cost Effective ◽  
Electrical Performance ◽  
Sensitive Material ◽  
Aspect Ratios ◽  
3D Ics ◽  
Simple Processing ◽  
Micron Diameter ◽  
On Chip ◽  
Processing Steps

The most singular focus of the electronics industry during the last 50 years has been to miniaturize ICs by miniaturization of transistors and on-chip interconnections. Two major problems are foreseen with this approach; (1) electrical leakage and (2) the lack of improved electrical performance beyond 16nm. As a result, the industry is transitioning from the current SOC-based approach to a through-silicon-via (TSV) based 3D IC-stacked approach. However, a major challenge remains; these 3D ICs need to be interconnected to other ICs with a much higher number of I/Os than are available with current ceramic or organic interposers. While silicon interposers currently in development can provide these high I/Os, they cannot do so at low enough cost. In this extended abstract, 3D Glass Solutions, a division of Life BioScience, Inc., presents our efforts in glass interposer microfabrication. Glass interposers possess many advantages over silicon interposers including: cost, production time, and scale. 3D Glass Solution’s APEX™ Glass ceramic is a photo-sensitive material used to create high density arrays of through glass vias (TGVs) using three simple processing steps: exposure, baking, and etching. To date, we have been successful in producing large arrays of 12 micron diameter TGVs, with 14 micron center-to-center pitch, in 125 micron thick APEX™ Glass ceramic. This extended abstract covers (1) on our efforts producing high aspect ratio TGVs in ultra thin (75–250 micron) APEX™ Glass ceramic wafers, (2) maximum TGV aspect ratios, and (3) TGV fidelity and limits of manufacturing.

Laser fabricated microchannels inside photostructurable glass-ceramic

2009 ◽  
Vol 255 (10) ◽  
pp. 5499-5502 ◽  
Author(s):  
J.M. Fernández-Pradas ◽  
D. Serrano ◽  
P. Serra ◽  
J.L. Morenza
Keyword(s):  
Glass Ceramic ◽  
Photostructurable Glass
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