scholarly journals Material dependence of bulk leakage current in CdZnTe detectors

Author(s):  
Mark Amman ◽  
Paul N. Luke ◽  
Julie S. Lee ◽  
Ernest Orlando
Author(s):  
B.P.F. Dirks ◽  
C. Blondel ◽  
F. Daly ◽  
O. Gevin ◽  
O. Limousin ◽  
...  

1997 ◽  
Vol 487 ◽  
Author(s):  
M-A. Gagliardi ◽  
S. Nenonen ◽  
T. Gagliardi ◽  
L. Aleksejeva ◽  
V. Ivanov ◽  
...  

AbstractOne of the main electronic noise sources of a room temperature spectroscopy system is the leakage current of a detector. It can be reduced with a pn-junction type detector structure such as a M-i-n configuration, and with cooling. In this work eight CdZnTe detectors with a M-i-n structure were fabricated by indium diffusion. The junction was characterized by a currentvoltage technique. Detector electrical, charge collection and spectroscopic properties were compared to the ones received with the traditional electroless Au contacts, before the junction formation. As a result of the indium diffusion an improved detector leakage current performance was achieved. However, a corresponding improvement in the detector energy resolution was not always observed due to the CdZnTe charge collection properties and process variables.


1997 ◽  
Vol 487 ◽  
Author(s):  
R. Sudharsanan ◽  
C. C. Stenstrom ◽  
P. Bennett ◽  
G. D. Vakerlis

AbstractWe present the performance characteristics of CdZnTe radiation detectors with a new P-I-N design and their unique advantages over metal-semiconductor-metal (M-S-M) devices. In M-S-M CdZnTe detectors the bulk resistivity of the substrate largely determines the leakage current. High leakage current is a dominant noise factor for CdZnTe detector arrays, coplanar detectors, and detectors used for low X-ray energy applications. P-I-N devices provide low leakage currents. Early CdZnTe detectors exhibited polarization, were limited to small detection volumes, and some required high deposition temperatures. We have developed a new heterojunction design which can be deposited at low temperatures so that even high-pressure Bridgman CdZnTe can be used. Using the P-I-N design, CdZnTe detectors with high detection volumes (>200 mm3) were fabricated and exhibited low leakage current, good energy resolution, and no polarization. These detectors have significant advantages over M-S-M detectors in three specific areas. First, X-ray fluorescence studies require detectors with low leakage currents to provide less spectral broadening due to electronic noise. Second, less expensive vertical Bridgman CdZnTe material can be used for imaging applications since it normally possesses too low of a bulk resistivity to be useful as a M-S-M detector. Third, leakage currents across the anode grid in large volume coplanar detectors can be significantly reduced


1997 ◽  
Vol 484 ◽  
Author(s):  
R. Sudharsanan ◽  
C. C. Stenstrom ◽  
P. Bennett ◽  
G. D. Vakerlis

AbstractWe present the performance characteristics of CdZnTe radiation detectors with a new P-I-N design and their unique advantages over metal-semiconductor-metal (M-S-M) devices. In M-S-M CdZnTe detectors the bulk resistivity of the substrate largely determines the leakage current. High leakage current is a dominant noise factor for CdZnTe detector arrays, coplanar detectors, and detectors used for low X-ray energy applications. P-I-N devices provide low leakage currents. Early CdZnTe detectors exhibited polarization, were limited to small detection volumes, and some required high deposition temperatures. We have developed a new heterojunction design which can be deposited at low temperatures so that even high-pressure Bridgman CdZnTe can be used. Using the P-I-N design, CdZnTe detectors with high detection volumes (>200 mm3) were fabricated and exhibited low leakage current, good energy resolution, and no polarization. These detectors have significant advantages over M-S-M detectors in three specific areas. First, X-ray fluorescence studies require detectors with low leakage currents to provide less spectral broadening due to electronic noise. Second, less expensive vertical Bridgman CdZnTe material can be used for imaging applications since it normally possesses too low of a bulk resistivity to be useful as a M-S-M detector. Third, leakage currents across the anode grid in large volume coplanar detectors can be significantly reduced.


2017 ◽  
Vol 137 (8) ◽  
pp. 481-486
Author(s):  
Junichi Hayasaka ◽  
Kiwamu Shirakawa ◽  
Nobukiyo Kobayashi ◽  
Kenichi Arai ◽  
Nobuaki Otake ◽  
...  

2010 ◽  
Vol 130 (11) ◽  
pp. 1037-1041 ◽  
Author(s):  
Takuma Miyake ◽  
Yuya Seo ◽  
Tatsuya Sakoda ◽  
Masahisa Otsubo
Keyword(s):  

2002 ◽  
Vol 716 ◽  
Author(s):  
Yi-Mu Lee ◽  
Yider Wu ◽  
Joon Goo Hong ◽  
Gerald Lucovsky

AbstractConstant current stress (CCS) has been used to investigate the Stress-Induced Leakage Current (SILC) to clarify the influence of boron penetration and nitrogen incorporation on the breakdown of p-channel devices with sub-2.0 nm Oxide/Nitride (O/N) and oxynitride dielectrics prepared by remote plasma enhanced CVD (RPECVD). Degradation of MOSFET characteristics correlated with soft breakdown (SBD) and hard breakdown (HBD), and attributed to the increased gate leakage current are studied. Gate voltages were gradually decreased during SBD, and a continuous increase in SILC at low gate voltages between each stress interval, is shown to be due to the generation of positive traps which are enhanced by boron penetration. Compared to thermal oxides, stacked O/N and oxynitride dielectrics with interface nitridation show reduced SILC due to the suppression of boron penetration and associated positive trap generation. Devices stressed under substrate injection show harder breakdown and more severe degradation, implying a greater amount of the stress-induced defects at SiO2/substrate interface. Stacked O/N and oxynitride devices also show less degradation in electrical performance compared to thermal oxide devices due to an improved Si/SiO2 interface, and reduced gate-to-drain overlap region.


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