Near field analysis of CSG and BSG combined element under high power laser condition

2006 ◽  
Author(s):  
Xin Yao ◽  
Fuhua Gao ◽  
Yixiao Zhang ◽  
Lei Wang ◽  
Yongkang Guo ◽  
...  
2005 ◽  
Author(s):  
Fuhua Gao ◽  
Xionggui Tang ◽  
Shenglin Wen ◽  
Jinglei Du ◽  
Yongkang Guo ◽  
...  

2017 ◽  
Vol 44 (1) ◽  
pp. 0103001
Author(s):  
白忠臣 Bai Zhongchen ◽  
黄兆岭 Huang Zhaoling ◽  
郝礼才 Hao Licai ◽  
陆安江 Lu Anjiang ◽  
秦水介 Qin Shuijie

2011 ◽  
Vol 23 (4) ◽  
pp. 959-962
Author(s):  
谢娜 Xie Na ◽  
黄晚晴 Huang Wanqing ◽  
郭仪 Guo Yi ◽  
王晓东 Wang Xiaodong ◽  
方香云 Fang Xiangyun ◽  
...  

2012 ◽  
Vol 134 (4) ◽  
Author(s):  
Yi Yan ◽  
Xu Chen ◽  
Xingsheng Liu ◽  
Yunhui Mei ◽  
Guo-Quan Lu

Conduction-cooled high power laser diodes have a variety of significant commercial, industrial, and military applications. For these devices to perform effectively, an appropriate die-attached material meeting specific requirements must be selected. In this study, nanosilver paste, a novel die-attached material, was used in packaging the 60 W 808 nm high power laser diodes. The properties of the laser diodes operating in the continuous wave (CW) mode, including the characteristics of power–current–voltage (LIV), spectrum, near field, far field, near field linearity, spatial spectrum, and thermal impedance, were determined. In addition, destructive tests, including the die shear test, scanning acoustic microscopy, and the thermal rollover test, were conducted to evaluate the reliability of the die bonding of the 60 W 808 nm high power semiconductor laser with nanosilver paste. Thermal analyses of the laser diodes operating at CW mode with different die-attached materials, indium solder, gold–tin solder and nanosilver paste, were conducted by finite element analysis (FEA). According to the result of the FEA, the nanosilver paste resulted in the lowest temperature in the laser diodes. The test results showed that the nanosilver paste was a very promising die-attached material in packaging high power semiconductor laser.


2008 ◽  
Vol 35 (4) ◽  
pp. 544-548 ◽  
Author(s):  
孙志红 Sun Zhihong ◽  
彭志涛 Peng Zhitao ◽  
刘华 Liu Hua ◽  
徐隆波 Xu Longbo ◽  
赵军普 Zhao Junpu ◽  
...  

2016 ◽  
Vol 43 (3) ◽  
pp. 0302002 ◽  
Author(s):  
尤科伟 You Kewei ◽  
张艳丽 Zhang Yanli ◽  
张雪洁 Zhang Xuejie ◽  
张军勇 Zhang Junyong ◽  
朱健强 Zhu Jianqiang

Optik ◽  
2013 ◽  
Vol 124 (1) ◽  
pp. 60-63 ◽  
Author(s):  
Na Xie ◽  
Yi Guo ◽  
Wanqing Huang ◽  
Xiaodong Wang ◽  
Runchang Zhao ◽  
...  

2019 ◽  
Vol 7 ◽  
Author(s):  
Ping Li ◽  
Wei Wang ◽  
Jingqin Su ◽  
Xiaofeng Wei

FM-to-AM (frequency modulation-to-amplitude modulation) conversion caused by nonuniform spectral transmission of broadband beam is harmful to high-power laser facility. Smoothing by spectral dispersion (SSD) beam is a special broadband beam for its monochromatic feature at the given time and space on the near field. The traditional method which uses the optical spectral transfer function as filters cannot accurately describe its AM characteristics. This paper presents the theoretical analysis of the etalon effect for SSD beam. With a low-order approximation, the analytic model of the temporal shape of SSD beam is obtained for the first time, which gives the detailed AM characteristics at local and integral aspects, such as the variation of ripples width and amplitude in general situation. We also analyze the FM-to-AM conversion on the focal plane; in the focusing process, the lens simply acts as an integrator to smooth the AM of SSD beam. Because AM control is necessary for the near field to avoid optics damage and for the far field to ensure an optimal interaction of laser–target, our investigations could provide some important phenomena and rules for pulse shape control.


2015 ◽  
Vol 23 (2) ◽  
pp. 681 ◽  
Author(s):  
Sensen Li ◽  
Yulei Wang ◽  
Zhiwei Lu ◽  
Lei Ding ◽  
Pengyuan Du ◽  
...  

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