High-speed laser cutting of micro structures with submicron details

2006 ◽  
Author(s):  
Karl L. Boehlen ◽  
Phil T. Rumsby ◽  
Neil Sykes ◽  
Céline Lefevre
Keyword(s):  
Laser Cutting ◽  
High Speed ◽  
Micro Structures

Characterization of Sulfur-Cured Styrene-Butadiene Copolymer Rubbers and Their Polybutadiene Blends

1970 ◽  
Vol 43 (6) ◽  
pp. 1332-1339 ◽  
Author(s):  
J. K. Clark ◽  
R. A. Scott
Keyword(s):  
Carbon Disulfide ◽  
High Speed ◽  
Styrene Butadiene Rubber ◽  
Butadiene Rubber ◽  
Absorption Bands ◽  
Rubber Blends ◽  
Cast Films ◽  
Micro Structures ◽  
Styrene Butadiene

Abstract Dissolution of sulfur-cured, carbon black-loaded copolymers and their blends with cis-1,4-polybutadiene (PBD) are brought about by boiling with o-dichlorobenzene which contains a small amount of 2,2′-dibenzamidodiphenyl disulfide. The resulting slurries are subjected to a sequence of separations which include high-speed centrifugation to remove solids, and solvent precipitation followed by filtration to isolate the precipitates. The precipitates are washed with solvent to remove soluble organic materials followed by carbon disulfide washing to dissolve the polymers. Cast films of the polymers are obtained by evaporating the carbon disulfide washings onto sodium chloride discs. The infrared spectra of the cast films of these preparations are very similar to those of their respective polymers prior to loading and curing. Calculations for relative concentrations of bound styrene and PBD micro-structures permit nominal identification of the kinds of styrene-butadiene rubber and the amounts of cis-1,4-PBD used in a cured rubber formulation. Absorption bands used are near 3.35 μ for cis-1,4-PBD, 6.65 μ for bound styrene, 10.35 μ for trans-1,4-PBD; and 11.0 μ for vinyl-1,2-PBD. Efforts are being made to improve the data by using a grating infrared instrument and also to extend the calibrations to include other rubber blends.

Strength of deposited high-speed steel in the process of gas laser cutting

2009 ◽  
Vol 51 (7-8) ◽  
pp. 352-355 ◽  
Author(s):  
L. E. Afanas’eva ◽  
I. A. Barabonova ◽  
N. S. Zubkov ◽  
M. S. Razumov
Keyword(s):  
Laser Cutting ◽  
High Speed ◽  
High Speed Steel ◽  
Gas Laser ◽  
Gas Laser Cutting

scholarly journals On multi-sensor monitoring of fiber laser fusion cutting

2021 ◽  
Vol 1135 (1) ◽  
pp. 012014
Author(s):  
Nikita Levichev ◽  
Joost R. Duflou
Keyword(s):  
Fiber Laser ◽  
Monitoring System ◽  
Laser Cutting ◽  
High Speed ◽  
Process Zone ◽  
Industrial Process ◽  
Industrial Applications ◽  
Laser Fusion ◽  
Thick Plates ◽  
Sensor Monitoring

Abstract Laser cutting is a well-established industrial process for sheet metal applications. However, cutting thick plates is still accompanied by problems because of the characteristic limited process parameter window. Since cutting by means of fiber lasers has become dominant, tailored solutions are required in such systems for industrial applications. The development of a robust real-time monitoring system, which adapts the process parameters according to a specific quality requirement, implies a significant step forward towards automated laser cutting and increases the process robustness and performance. In this work, a coaxial multi-sensor monitoring system is tested for fiber laser cutting of stainless steel thick plates. A high-speed camera and a photodiode sensor have been selected for this investigation. Experiments at different cutting speeds, representing primary cut quality cases, have been conducted and various features of the obtained process zone signals have been examined. Finally, the feasibility of industrial application of the developed setup for high-power fiber laser cutting is discussed, followed by several implementation recommendations.

scholarly journals Study of high Speed Laser Cutting of LED Module

2017 ◽  
Vol 24 (1) ◽  
pp. 91-101
Author(s):  
Won Yong Choi ◽  
Sung-Hoon Choa
Keyword(s):  
Laser Cutting ◽  
High Speed

Fundamental study of CO2- and fiber laser cutting of steel plates with high speed visualization technique

2014 ◽  
Vol 26 (4) ◽  
pp. 042004 ◽  
Author(s):  
Grigory V. Ermolaev ◽  
Petr V. Yudin ◽  
Francis Briand ◽  
Alexandr V. Zaitsev ◽  
Oleg B. Kovalev
Keyword(s):  
Fiber Laser ◽  
Laser Cutting ◽  
High Speed ◽  
Steel Plates ◽  
Visualization Technique ◽  
Fundamental Study

Light-Gas Eccentrically High Speed Laser Cutting of Silicon Steel on Cold Rolling Production Line

2014 ◽  
Vol 881-883 ◽  
pp. 1469-1474 ◽  
Author(s):  
Li Jun Xin ◽  
Zhi Yong Wang
Keyword(s):  
Laser Cutting ◽  
High Speed ◽  
Cutting Speed ◽  
Silicon Steel ◽  
Gas Jet ◽  
Offset Distance ◽  
Cutting Surface ◽  
Allowable Range ◽  
Rolling Production ◽  
Better Than

In view of the cutting speed reduced and cutting quality became poor because cutting front changes to flat and amount of lag changes to large, light-gas eccentrically cutting method was proposed. Through the experiment and analysis of the results, the conclusion can be obtained that when laser beam is before gas jet, cutting speed can be improved. While offset distance have impacts to cutting result. If the offset distance is too small, it has no difference with light - gas coaxial cutting; if the offset distance is too large, it weakens the gas jet at the cutting surface, which is not conducive to cutting. It can achieve the best results when the offset distance is 0.3mm.The cutting quality with 1.5mm diameter nozzle is better than that of 2mm. Therefore within the allowable range in the offset distance the nozzle aperture should be reduced.

Electrical Characteristics Analysis of Bonded Cells for Shingled Modules

2020 ◽  
Vol 20 (11) ◽  
pp. 6653-6658
Author(s):  
Jeong Eun Park ◽  
So Mang Park ◽  
Won Seok Choi ◽  
Jae Joon Jang ◽  
Donggun Lim
Keyword(s):  
Laser Cutting ◽  
High Speed ◽  
Green Laser ◽  
Curing Temperature ◽  
Process Conditions ◽  
Laser Process ◽  
Cut Cell ◽  
Electrically Conductive Adhesive ◽  
Characteristics Analysis ◽  
A Cell

A shingled module fabricated using electrically conductive adhesive (ECA) can increase the light-receiving area and provide greater power than a conventional module fabricated using solder-coated copper ribbons. However, several issues such as damage from laser cutting and poor contact by the conductive paste may arise. In this study, a 15.675 × 3.1 cm2 c-Si cut cell was fabricated using a nanosecond green laser, and cell bonding was performed using ECA to fabricate shingled modules. If the laser process was performed with high speed and low power, there was insufficient depth for cut cell fabrication. This was because the laser only had a thermal effect on the surface. The cell was processed to a depth of approximately 46 μm by the laser, and it could be seen that the laser cutting proceeded smoothly when the laser process affected more than 25% of the wafer thickness. The cut cell was bonded by ECA, and the process conditions were changed. The highest efficiency of 20.27% was obtained for a cell bonded under the conditions of a curing time of 60 s and curing temperature of 150°C. As a result, the efficiency of the bonded cell was increased by approximately 2.67% compared to the efficiency of the conventional cut cell. This was because the shadow loss due to the busbar was reduced, increasing the active area of the module by eliminating the busbar from the illuminated area.

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