Numerical time-domain simulation of wave propagation and scattering in acoustic microscopy for subsurface defect characterization

2005 ◽  
Author(s):  
Frank Schubert ◽  
Bernd Koehler ◽  
Pavel Zinin
Keyword(s):  
Wave Propagation ◽  
Time Domain ◽  
Acoustic Microscopy ◽  
Defect Characterization ◽  
Time Domain Simulation ◽  
Subsurface Defect

scholarly journals Time-domain simulation of wave propagation across resonant meta-interfaces

2020 ◽  
Vol 414 ◽  
pp. 109474 ◽  
Author(s):  
Marie Touboul ◽  
Bruno Lombard ◽  
Cédric Bellis
Keyword(s):  
Wave Propagation ◽  
Time Domain ◽  
Time Domain Simulation

Failure Analysis of Broken Stitch Bonds in TSSOP Packages Using Scanning Acoustic Microscopy (SAM) and Time Domain Reflectometry (TDR)

2004 ◽  
Author(s):  
Bilal Abd-AlRahman ◽  
Corey Lewis ◽  
Todd Simons
Keyword(s):  
Failure Analysis ◽  
Mechanical Stress ◽  
Time Domain ◽  
Open Circuit ◽  
Time Domain Reflectometry ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Root Cause ◽  
Analysis Application

Abstract A failure analysis application utilizing scanning acoustic microscopy (SAM) and time domain reflectometry (TDR) for failure analysis has been developed to isolate broken stitch bonds in thin shrink small outline package (TSSOP) devices. Open circuit failures have occurred in this package due to excessive bending of the leads during assembly. The tools and their specific application to this technique as well as the limitations of C-SAM, TDR and radiographic analyses are discussed. By coupling C-SAM and TDR, a failure analyst can confidently determine whether the cause of an open circuit in a TSSOP package is located at the stitch bond. The root cause of the failure was determined to be abnormal mechanical stress placed on the pins during the lead forming operation. While C-SAM and TDR had proven useful in the analysis of TSSOP packages, it can potentially be expanded to other wire-bonded packages.

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