High-performance and low-thermal time constant amorphous silicon-based 320 x 240 uncooled microbolometer IRFPA

Author(s):  
Jean-Luc Tissot ◽  
Jean-Pierre Chatard ◽  
Bruno Fieque ◽  
Olivier Legras
2012 ◽  
Vol 602-604 ◽  
pp. 2259-2262
Author(s):  
Hong Xi Zhou ◽  
Chao Chen ◽  
Tao Wang

In this paper a high-performance single level uncooled microbolometer detectors with a unit cell size of 25um×25um is introduced. An efficient detectors requires low Noise Equivalent Temperature Difference(NETD) (<80mK,f/1,60Hz)and low thermal time constant (<8.3ms). The trade-offs between physical parameters are studied to attain the optimum design parameters including the thermal conductance, the thermal time constant and the active area, consequently, optimum design parameters such as the width and the length of the support arms, which can satisfy the demand of an efficient detectors is achieved.


RSC Advances ◽  
2016 ◽  
Vol 6 (41) ◽  
pp. 35118-35123 ◽  
Author(s):  
Long Chen ◽  
Junhua Wang ◽  
Cuiping Huang ◽  
Qinan Zhang ◽  
Shannan Chang ◽  
...  

The effect of two step sintering process on the microstructure and electrical properties of inkjet printing high performance Ni0.9Mn1.8Mg0.3O4 ceramic microbead materials with lower thermal time constant and higher material constant is investigated.


2012 ◽  
Vol 531-532 ◽  
pp. 477-480
Author(s):  
Chao Chen ◽  
Ya Dong Jiang ◽  
Hong Xi Zhou

Thermal conductance of microbolometer has a directly impact on Noise Equivalent Temperature Difference (NETD) and thermal time constant which are the key indicators of uncooled IR detector. It is of great significance to calculate and evaluate thermal conductance. A calculate approach of thermal conductance for uncooled microbolometer detectors is introduced in this paper. Accurate three-dimensional modeling of microbolometer is found by using MEMS analysis software Intellisuite. Dynamic thermal analysis of this model is solved and then thermal time constant can be read from thermal time curve of the analysis mentioned above. Combined with the calculation of thermal capacitance, more precisely thermal conductance value can be reached which is more accurate than theoretical calculations result and meaningful for design and fabrication of the device.


2004 ◽  
Author(s):  
Jean Luc Tissot ◽  
Michel Vilain ◽  
Arnaud Crastes ◽  
Sebastien Tinnes ◽  
Annick Larre ◽  
...  

2019 ◽  
Vol 48 (12) ◽  
pp. 1204003
Author(s):  
刘子骥 Liu Ziji ◽  
赵晟晨 Zhao Shengchen ◽  
赵征庭 Zhao Zhengting ◽  
李聿达 Li Yuda ◽  
郑 兴 Zheng Xing ◽  
...  

2008 ◽  
Vol 48 (8-9) ◽  
pp. 1279-1284
Author(s):  
A. Reverdy ◽  
P. Perdu ◽  
H. Murray ◽  
M. de la Bardonnie ◽  
P. Poirier

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