The influence of the position accuracy of a laser diode and the influence of the top copper layer thickness on the temperature distribution of the single emitter in connection with an active cooled heat-sink

2004 ◽  
Author(s):  
Ingo Baumeister ◽  
Karsten Schmidt ◽  
Ken Credle, Jr. ◽  
Trevor R. Crum
Keyword(s):  
Temperature Distribution ◽  
Layer Thickness ◽  
Laser Diode ◽  
Heat Sink ◽  
Copper Layer ◽  
Position Accuracy ◽  
Single Emitter

scholarly journals Bypass Heat Sink Analysis for a Laser Diode Bar with a Top Canopy

2017 ◽  
Vol 1 (2) ◽  
pp. 113-117
Author(s):  
Byeong-Gwan Ji ◽  
Seung-Gol Lee ◽  
Se-Geun Park ◽  
Beom-Hoan O
Keyword(s):  
Laser Diode ◽  
Heat Sink

13.4 W single emitter 940 nm semiconductor laser diode with asymmetric large optical cavity

2014 ◽  
Vol 12 (s2) ◽  
pp. S22502-322504
Author(s):  
Jianjun Li Jianjun Li ◽  
Shengjie Lin Shengjie Lin ◽  
Tao Liu Tao Liu ◽  
Jianchun Li Jianchun Li ◽  
Jun Deng Jun Deng ◽  
...  
Keyword(s):  
Semiconductor Laser ◽  
Laser Diode ◽  
Optical Cavity ◽  
Semiconductor Laser Diode ◽  
Single Emitter

Design of micro-channel heat sink for high power laser diode

2011 ◽  
Vol 23 (8) ◽  
pp. 2057-2061 ◽  
Author(s):  
刘刚 Liu Gang ◽  
唐晓军 Tang Xiaojun ◽  
王超 Wang Chao ◽  
刘磊 Liu Lei ◽  
梁兴波 Liang Xingbo ◽  
...  
Keyword(s):  
Laser Diode ◽  
High Power ◽  
Heat Sink ◽  
Micro Channel ◽  
High Power Laser ◽  
Power Laser ◽  
High Power Laser Diode

Copper layer thickness for 325 MHz superconducting cavity input couplers

2014 ◽  
Vol 26 (12) ◽  
pp. 125103
Author(s):  
陈旭 Chen Xu ◽  
谷魁祥 Gu Kuixiang ◽  
彭应华 Peng Yinghua ◽  
马强 Ma Qiang ◽  
黄彤明 Huang Tongming ◽  
...  
Keyword(s):  
Layer Thickness ◽  
Copper Layer ◽  
Superconducting Cavity

High-brightness 808 nm semiconductor laser diode packaged by SiC heat sink

2020 ◽  
Vol 67 (11) ◽  
pp. 1017-1021
Author(s):  
Xingyu Li ◽  
Kai Jiang ◽  
Zhen Zhu ◽  
Jian Su ◽  
Wei Xia ◽  
...  
Keyword(s):  
Semiconductor Laser ◽  
Laser Diode ◽  
Heat Sink ◽  
High Brightness ◽  
Semiconductor Laser Diode

High-power operation of 1cm laser diode bars on funryu heat sink cooled by fluorinated-refrigerant

2009 ◽  
Author(s):  
Satoru Oishi ◽  
Hirofumi Miyajima ◽  
Noriyasu Suzuki ◽  
Tomoyuki Natsume ◽  
Toru Fujita ◽  
...  
Keyword(s):  
Laser Diode ◽  
High Power ◽  
Heat Sink ◽  
High Power Operation ◽  
Power Operation

Infrared Thermal Image on Vapor-Liquid Interface in Capillary Microgrooves Heat Sink

2009 ◽  
Author(s):  
Tao Wang ◽  
Xuegong Hu ◽  
Dawei Tang ◽  
Chaohong Guo
Keyword(s):  
Temperature Distribution ◽  
Heat Sink ◽  
Solid Wall ◽  
Thermal Image ◽  
Liquid Interface ◽  
Liquid Interfaces ◽  
Average Temperature ◽  
Solid Walls ◽  
Working Liquid ◽  
Vapor Liquid

An infrared thermoviewer is utilized to measure the temperature distribution on solid walls and vapor-liquid interfaces of the rectangular capillary microgrooves heat sink, which is made of borosilicate glass. The infrared thermal image clearly shows that the solid wall temperature of microgroove top is lower than the average temperature of vapor-liquid interface. The results indicate that heat source position has a significant influence on the microgrooves surface temperature distribution, besides working liquid, tilt angle (the angle between microgroove surface and gravity direction) and heat flux.

scholarly journals Finite element analysis of heat sink in term of thermal and temperature distribution with different chip power input

2018 ◽  
Vol 7 (2.15) ◽  
pp. 90
Author(s):  
Mazlan Mohamed ◽  
Mohd Nazri Omar ◽  
Mohamad Shaiful Ashrul Ishak ◽  
Rozyanty Rahman ◽  
Muhamad Fahmi Mohd Roslan ◽  
...  
Keyword(s):  
Temperature Distribution ◽  
Heat Sink ◽  
3D Model ◽  
Power Input ◽  
Power Source ◽  
Experimental Setup ◽  
Time Step ◽  
Element Analysis ◽  
Different Types ◽  
Lower Temperature

This paper presents the simulation of heat sink by using Workbench 18.0 Software to simulate the temperature distribution at different chip power input. 3D model of heat sink is generated using Design Modeler using the same dimension with experimental setup. The study was made for a heat sink mounted on the power source (Chip) under different types of chip powers. The results are presented in terms of temperature distribution when chip powers have been increased from 1 W to 10 W. The temperature distribution is been observed and it was found that the temperature distribution of the heat sink has lower temperature when power source at 1 W and increase significantly when the power source rise up to 10 W. The increase the temperature of heat sink is from 30.8ºC up to 96.2ºC estimated to be 212% the increase of temperature. The simulation also been verify by using different time step use during the simulation and using grid independency test to ensure the simulation result is accurate. 

Investigation of photoelectric performance of laser diode by regulation of p-waveguide layer thickness

Optik ◽  
2020 ◽  
Vol 200 ◽  
pp. 163458
Author(s):  
Bingshe Xu ◽  
Kai Qu ◽  
Zhiyong Wang ◽  
Shufang Ma ◽  
Jian Liang ◽  
...  
Keyword(s):  
Layer Thickness ◽  
Laser Diode ◽  
Waveguide Layer ◽  
Photoelectric Performance
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