Vibration measurement of microcomponents by fringe projection method

2003 ◽  
Author(s):  
Tao Wu ◽  
ChoJui Tay ◽  
Chenggen Quan ◽  
Shihua Wang ◽  
HuaiMin Shang
Keyword(s):  
Projection Method ◽  
Vibration Measurement ◽  
Fringe Projection

scholarly journals Adaptive Binocular Fringe Dynamic Projection Method for High Dynamic Range Measurement

Sensors ◽  
2019 ◽  
Vol 19 (18) ◽  
pp. 4023 ◽  
Author(s):  
Changzhi Yu ◽  
Fang Ji ◽  
Junpeng Xue ◽  
Yajun Wang
Keyword(s):  
Projection Method ◽  
Dynamic Range ◽  
Three Dimensional ◽  
High Dynamic Range ◽  
Fringe Projection ◽  
Range Measurement ◽  
Optimal Projection ◽  
Three Dimensional Measurement ◽  
High Dynamic ◽  
Adaptively Adjusting

Three-dimensional measurement with fringe projection sensor has been commonly researched. However, the measurement accuracy and efficiency of most fringe projection sensors are still seriously affected by image saturation and the non-linear effects of the projector. In order to solve the challenge, in conjunction with the advantages of stereo vision technology and fringe projection technology, an adaptive binocular fringe dynamic projection method is proposed. The proposed method can avoid image saturation by adaptively adjusting the projection intensity. Firstly, the flowchart of the proposed method is explained. Then, an adaptive optimal projection intensity method based on multi-threshold segmentation is introduced to adjust the projection illumination. Finally, the mapping relationship of binocular saturation point and projection point is established by binocular transformation and left camera–projector mapping. Experiments demonstrate that the proposed method can achieve higher accuracy for high dynamic range measurement.

The Membrane Thickness Prediction of Solder Paste Process by Phase-Shifting Projection

2013 ◽  
Vol 284-287 ◽  
pp. 550-556 ◽  
Author(s):  
Yu Fang Chung ◽  
Kun Lin Tsai ◽  
Tzer Long Chen ◽  
Yen Chu Hsu ◽  
Yi Hsuan Yu
Keyword(s):  
Projection Method ◽  
Phase Shifting ◽  
Fringe Projection ◽  
Membrane Thickness ◽  
Solder Paste ◽  
3D Image ◽  
Electronic Products ◽  
Optical Grating ◽  
Surface Image ◽  
Thickness Prediction

Electronic products have become lighter and thinner nowadays. SMT includes three basic steps, namely solder paste print, electronic component adhesion and reflow[1]. This research tends to capture the image of fringe projection based on CCD with optical grating and reconstruct the 3D surface image of solder paste use triangulation measurement. The main ideal is using fringe projection method to observe the distortion of the fringe phenomenon caused by different heights of the surface. Last, the depth of the surface is computed under test variation and the 3D image is reconstructed.

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