Evaluation of package and technology effects on substrate-crosstalk isolation in CMOS RFIC
1999 ◽
Vol 31
(2)
◽
pp. 235-245
◽
2019 ◽
Vol 73
(4_Supplement_1)
◽
pp. 7311515310p1
2014 ◽
Vol 2
(1)
◽
pp. 66-70