High-density packaging and interconnect of massively parallel image processors

1991 ◽  
Author(s):  
John C. Carson ◽  
Ronald Indin
Keyword(s):  
High Density ◽  
Massively Parallel ◽  
Parallel Image ◽  
Image Processors ◽  
High Density Packaging

Diagram of Electromigration Pattern in Eutectic Pb-Sn and Pb-Free Solders

2005 ◽  
Vol 297-300 ◽  
pp. 837-843
Author(s):  
Takashi Hasegawa ◽  
Masumi Saka
Keyword(s):  
Current Density ◽  
Solder Bump ◽  
High Density ◽  
Solder Bumps ◽  
Multi Phase ◽  
High Density Packaging

Solder is the most frequently used alloy, which serves as the bonding metal for electronics components. Recently, the interconnected bump is distinctly downsizing its bulk along with the integration of high-density packaging. The evaluation of electromigration damage for solder bumps is indispensable. Hence, it is fairly urgent to understand the mechanism of the electromigration damage to be capable of securing reliability of the solder bump and ultimately predicting its failure lifetime. Electromigration pattern in multi-phase material is determined by the combination of current density, temperature and current-applying time. In this paper, diagram of electromigration pattern (DEP) in solders is presented, where both of eutectic Pb-Sn and Pb-free solders are treated. DEP gives the basis for discussing and predicting the electromigration damage in solders.

Photosensitive Dielectric Film Developed Using a Polymer Blend

1992 ◽  
Vol 264 ◽  
Author(s):  
M. Tani ◽  
S. Miyahara ◽  
E. Horikoshi ◽  
K. Natori ◽  
T. Sato
Keyword(s):  
Polymer Blend ◽  
Dielectric Film ◽  
High Density ◽  
Passivation Layer ◽  
New Materials ◽  
Photosensitive Film ◽  
High Density Packaging

AbstractWe developed a photosensitive film using a polymer blend for use in applications that require a high density of interconnects. Our film can be used as a dielectric or a passivation layer in high density packaging technologies. We formed vias about 20 μm in diameter using our new materials.

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