Low-cost uncooled infrared detector arrays in standard CMOS

Author(s):  
Selim Eminoglu ◽  
M. Y. Tanrikulu ◽  
Tayfun Akin
1994 ◽  
Vol 299 ◽  
Author(s):  
Gregory T. Stauf ◽  
Peter C. VanBuskirk ◽  
Peter S. Kirlin ◽  
Walter P. Kosar

AbstractFerroelectrics such as PbTiO3 and BaSrTiO3 are promising candidates for pyroelectric infrared detector materials. Integration of ferroelectric thin films on Si will permit fabrication of low-cost infrared detector arrays, but a buffer layer will be required to reduce interactions with the substrate. For this reason we have investigated MOCVD of MgAl2O4 and yttria-stabilized zirconia (YSZ) buffer layers on both Si and MgO. A single source molecule, magnesium dialuminum isopropoxide (Mg[Al(OCH(CH3)2)4]2), was used for deposition of the MgAl2O4, the first time to our knowledge that well characterized multi-metal oxide films have been deposited by CVD from a single-source compound. Both EDAX and RBS showed film stoichiometries consistent with the elemental ratio in the source. A novel liquid solution-based flash vaporization technique was used to transport the organometallic sources into the reactor, providing both excellent reproducibility and ease of stoichiometry control and deposition rate. Highly oriented [100] MgAl2O4 was grown on MgO, and [100] YSZ was grown on MgO and Si. Degree of preferred orientation of the YSZ was found to be dependent on oxygen partial pressure, both for the MgO and Si substrates.


Sensor Review ◽  
2001 ◽  
Vol 21 (4) ◽  
pp. 283-287 ◽  
Author(s):  
Stephen Porter ◽  
Mike Mansi ◽  
Neil Sumpter ◽  
Lindsay Galloway

Proceedings ◽  
2020 ◽  
Vol 56 (1) ◽  
pp. 10
Author(s):  
Ying Dai ◽  
Syed Zeeshan Ali ◽  
Richard Hopper ◽  
Claudio Falco ◽  
Daniel Popa ◽  
...  

Low-cost infrared (IR) thermal cameras are powering a rising market of industrial and consumer applications. Complementary metal-oxide-semiconductor (CMOS)-based thermopile arrays are proven thermal imagers that can be monolithically integrated into low-cost and low-power-consumption formats for high-volume manufacturability. Here we present a simple method to evaluate the cross-talk of these arrays and propose a numerical model for device optimization.


2009 ◽  
Author(s):  
Yongfu Li ◽  
Hengjing Tang ◽  
Kefeng Zhang ◽  
Tao Li ◽  
Jinhua Ning ◽  
...  

New Astronomy ◽  
1996 ◽  
Vol 1 (2) ◽  
pp. 177-196 ◽  
Author(s):  
K.-W. Hodapp ◽  
J.L. Hora ◽  
D.N.B. Hall ◽  
L.L. Cowie ◽  
M. Metzger ◽  
...  

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