Recent advances in PLC hybrid integration technology

2003 ◽  
Author(s):  
Ikuo Ogawa ◽  
Takeshi Kitagawa
Keyword(s):  
Hybrid Integration ◽  
Integration Technology ◽  
Recent Advances

scholarly journals Functional integrated modulators and receivers utilizing PLC hybrid integration technology for coherent transmission

2011 ◽  
Vol 8 (20) ◽  
pp. 1663-1677 ◽  
Author(s):  
Shinji Mino ◽  
Hiroshi Yamazaki ◽  
Takashi Goh ◽  
Ken Tsuzuki ◽  
Takashi Saida ◽  
...  
Keyword(s):  
Hybrid Integration ◽  
Integration Technology ◽  
Coherent Transmission

scholarly journals Recent Advances in 3D Integration at IMEC

2006 ◽  
Vol 970 ◽  
Author(s):  
Piet De Moor ◽  
Wouter Ruythooren ◽  
Philippe Soussan ◽  
Bart Swinnen ◽  
Kris Baert ◽  
...  
Keyword(s):  
Wafer Level ◽  
3D Integration ◽  
Integration Technology ◽  
Wafer Level Packaging ◽  
Recent Advances

ABSTRACTIMEC is focusing its 3D-integration technology developments in 3 distinct directions: 3D-System-in-a-Package (3D-SiP), 3D-Wafer-Level-Packaging (3D-WLP) and 3D-Stacked-IC (3D-SiC). First, the background of these separate approaches will be given. Next the materials and technologies involved, the typical characteristics and the ongoing developments will be discussed. Finally, the roadmap for the 3D-integration in IMEC will be presented.

Fabrication of a TFF-Attached WDM-Type Triplex Transceiver Module Using Silica PLC Hybrid Integration Technology

2006 ◽  
Vol 24 (12) ◽  
pp. 5031-5038 ◽  
Author(s):  
Young-Tak Han ◽  
Yoon-Jung Park ◽  
Sang-Ho Park ◽  
Jang-Uk Shin ◽  
Chul-Wook Lee ◽  
...  
Keyword(s):  
Hybrid Integration ◽  
Integration Technology ◽  
Transceiver Module
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