Measured performance of a low-cost thermal infrared pushbroom camera based on uncooled microbolometer FPA for space applications

2001 ◽  
Author(s):  
Herve Geoffray ◽  
Francois Guerin
Keyword(s):  
Low Cost ◽  
Thermal Infrared ◽  
Space Applications ◽  
Uncooled Microbolometer

Robust Test Method of TSOP PEMs for Space Application

2019 ◽  
Author(s):  
Yasunobu Iwai ◽  
Koichi Shinozaki ◽  
Daiki Tanaka
Keyword(s):  
Evaluation Method ◽  
Low Cost ◽  
Reliability Evaluation ◽  
Test Method ◽  
Thermal Shock Test ◽  
Space Application ◽  
Space Applications ◽  
Limit Test ◽  
Long Time ◽  
Short Time

Abstract Compared with space parts, consumer parts are highly functional, low cost, compact and lightweight. Therefore, their increased usage in space applications is expected. Prior testing and evaluation on space applicability are necessary because consumer parts do not have quality guarantees for space application [1]. However, in the conventional reliability evaluation method, the test takes a long time, and the problem is that the robustness of the target sample can’t be evaluated in a short time. In this report, we apply to the latest TSOP PEM (Thin Small Outline Package Plastic Encapsulated Microcircuit) an evaluation method that combines preconditioning and HALT (Highly Accelerated Limit Test), which is a test method that causes failures in a short time under very severe environmental conditions. We show that this method can evaluate the robustness of TSOP PEMs including solder connections in a short time. In addition, the validity of this evaluation method for TSOP PEM is shown by comparing with the evaluation results of thermal shock test and life test, which are conventional reliability evaluation methods.

scholarly journals Total Ionizing Dose Effects on a Delay-Based Physical Unclonable Function Implemented in FPGAs

Electronics ◽  
2018 ◽  
Vol 7 (9) ◽  
pp. 163 ◽  
Author(s):  
Honorio Martin ◽  
Pedro Martin-Holgado ◽  
Yolanda Morilla ◽  
Luis Entrena ◽  
Enrique San-Millan
Keyword(s):  
Low Cost ◽  
Ring Oscillator ◽  
Radiation Environment ◽  
Key Generation ◽  
Total Ionizing Dose ◽  
Space Applications ◽  
Physical Unclonable Functions ◽  
Dose Effects ◽  
Total Ionizing Dose Effects

Physical Unclonable Functions (PUFs) are hardware security primitives that are increasingly being used for authentication and key generation in ICs and FPGAs. For space systems, they are a promising approach to meet the needs for secure communications at low cost. To this purpose, it is essential to determine if they are reliable in the space radiation environment. In this work we evaluate the Total Ionizing Dose effects on a delay-based PUF implemented in SRAM-FPGA, namely a Ring Oscillator PUF. Several major quality metrics have been used to analyze the evolution of the PUF response with the total ionizing dose. Experimental results demonstrate that total ionizing dose has a perceptible effect on the quality of the PUF response, but it could still be used for space applications by making some appropriate corrections.

Stress Hysteresis and Thermal-Mechanical Behavior of PECVD Silicon Nitride and Ebeam Aluminum Films for Microbolometer Applications

2004 ◽  
Vol 854 ◽  
Author(s):  
Shusen Huang ◽  
Xin Zhang
Keyword(s):  
Silicon Nitride ◽  
Mechanical Behavior ◽  
Measurement System ◽  
Low Cost ◽  
High Sensitivity ◽  
Central Idea ◽  
Aluminum Films ◽  
Uncooled Microbolometer ◽  
Curvature Measurement ◽  
Stress Hysteresis

ABSTRACTUncooled cantilever-based microbolometer arrays received more attention recently due to high sensitivity and low cost. The central idea is built on the deflection of a bilayer SiNx/Al material upon the temperature change. The thermal-mechanical behavior of the bilayer is significant for the performance of the microbolometers. In this paper, we perform thermal cyclings to aluminum and SiNx films. The CTEs and the stress evolutions were measured using a curvature measurement system. The curvature profile of a SiNx/Al/Si component was predicted using an extension of Stoney's formula, well agreeing with the experimental results. This work demonstrates fundamental mechanics issues in bilayer SiNx/Al components, which have a great potential for the use in uncooled microbolometer applications.

scholarly journals Low Cost Circularly Polarized Antenna for IoT Space Applications

Electronics ◽  
2020 ◽  
Vol 9 (10) ◽  
pp. 1564
Author(s):  
Le Huy Trinh ◽  
Nguyen Vu Truong ◽  
Fabien Ferrero
Keyword(s):  
Circular Polarization ◽  
Radiation Pattern ◽  
Insertion Loss ◽  
Low Cost ◽  
Total Efficiency ◽  
Area Network ◽  
Wide Area Network ◽  
Space Applications ◽  
Circularly Polarized ◽  
Compact Size

This work presents the use of a three-element radiating structure for circularly polarized Low-Power Wide Area Network (LP-WAN) communication with space. The proposed structure has a 72 mm × 72 mm × 12 mm compact size with Right-Handed Circular Polarization (RHCP) and a 120∘ wide beamwidth radiation pattern. Printed on low-cost FR4 Epoxy substrate, a feeding network circuit based on Quasi Lumped Quadrature Coupler (QLQC), it achieves a −0.6 dB insertion loss and a very compact size. The final structure has a 69% total efficiency and a 3.14 dBic realized gain.

Integrated vacuum packaging for low-cost lightweight uncooled microbolometer arrays

2001 ◽  
Author(s):  
Barry E. Cole ◽  
Robert E. Higashi ◽  
Jeff A. Ridley ◽  
R. Andrew Wood
Keyword(s):  
Low Cost ◽  
Vacuum Packaging ◽  
Uncooled Microbolometer

Performance analysis of low-cost uncooled microbolometer infrared detectors

2006 ◽  
Author(s):  
Junju Zhang ◽  
Lianjun Sun ◽  
Shiyun Wang ◽  
Benkang Chang ◽  
Yunsheng Qian ◽  
...  
Keyword(s):  
Performance Analysis ◽  
Infrared Detectors ◽  
Low Cost ◽  
Uncooled Microbolometer

High Reliability Flip Chip Using Low CTE Laminate Substrates

2005 ◽  
Author(s):  
D. Scott Copeland ◽  
M. Kaysar Rahim ◽  
Jeffrey C. Suhling ◽  
Guoyun Tian ◽  
Pradeep Lall ◽  
...  
Keyword(s):  
Carbon Fiber ◽  
Thermal Cycling ◽  
Flip Chip ◽  
Experimental Testing ◽  
High Reliability ◽  
Low Cost ◽  
Substrate Material ◽  
Space Applications ◽  
Sandwich Construction ◽  
Test Chips

In this work, we report on our efforts to develop high reliability flip chip on laminate assemblies for deployment in harsh thermal cycling environments characteristic of ground and aerospace vehicles (e.g. −55 to 150 °C). Reliability enhancement has been achieved through the use of a novel low expansion, high stiffness, and relatively low cost laminate substrate material that virtually eliminates CTE mismatches between the silicon die and top layer PCB interconnect. The utilized laminate features a sandwich construction that contains standard FR-406 outer layers surrounding a low expansion high thermal conductivity carbon fiber-reinforced composite core (STABLCOR®). Through both experimental testing and modeling, we have demonstrated that robust flip chip assemblies can be produced that illustrate ultra-high solder joint reliability during thermal cycling and extremely low die stresses. Liquid to liquid thermal shock testing has been performed on test assemblies incorporating daisy chain test die, and piezoresistive test chips have been used to characterize temperature dependent die stresses. In both sets of experiments, results obtained using the hybrid PCB laminate with FR-406 outer layers and carbon fiber core have been compared to those obtained with more traditional glass-epoxy laminate substrates including FR-406 and NELCO 4000-13. Nonlinear finite element modeling results for the low expansion flip chip on laminate assemblies have been correlated with the experimental data. Unconstrained thermal expansion measurements have also been performed on the hybrid laminate materials using strain gages to demonstrate their low CTE characteristics. Other experimental testing has demonstrated that the new laminate successfully passes toxicity, flammability, and vacuum stability testing as required for pressurized and un-pressurized space applications.

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