Ultrafast optical devices for high-speed optical data links

In this paper we review the state-of-the-art performance of producible, 850 nm, current-guided GaAs/AlGaAs , top-emitting vertical cavity surface emitting lasers (VCSELs). We discuss the motivation and desired characteristics for pursuing VCSELs, particularly in the area of high speed optical data links. We demonstrate that this structure is indeed producible and reproducible using MOVPE, where exceptional uniformity across wafers and arrays is obtained from commercial chambers. Record performance is also reported using MOVPE-grown GaAs VCSELs. These records include submilliamp (0.68 mA) CW room temperature threshold currents, <1.6 V threshold voltages, over 28% total wall-plug efficiency, over 59 mW of (unbonded) power, 200° C lasing, operation over a 100 nm wavelength regime, and other records that rival or exceed those obtained even from strained-layer InGaAs VCSELs of any structure. We also present novel extensions of this base VCSEL platform for lateral mode control, illustrating the flexibility and extendibility of this technology. Finally application of these arrays as 32-channel-wide Opto-Electronic Technology Consortium (OETC) parallel links are shown with error free operations up to 700 Mbits/s (Manchester coded) through 100 m of fiber.

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Development of a visible VCSEL-to-plastic optical fibre module for use in high-speed optical data links

Materials Science in Semiconductor Processing ◽

10.1016/s1369-8001(00)00089-5 ◽

2000 ◽

Vol 3 (5-6) ◽

pp. 467-473

Author(s):

J.D Lambkin ◽

T Calvert ◽

J Woodhead ◽

S.M Pinches ◽

J Frost ◽

...

Keyword(s):

Optical Fibre ◽

High Speed ◽

Optical Data ◽

Data Links

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Optical Data Links for L1 and Mars Missions

10.2514/6.iac-05-b3.6.01 ◽

2005 ◽

Author(s):

M. Wittig ◽

T. Dreischer ◽

T. Weigl

Keyword(s):

Optical Data ◽

Data Links ◽

Mars Missions

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Large Aperture Quantum Well Shutters for Fast Retroreflected Optical Data Links in Free Space

10.21236/ada461753 ◽

1999 ◽

Author(s):

G. C. Gilbreath ◽

W. S. Rabinovich ◽

Rita Mahon ◽

Michael R. Corson ◽

Mena Ferraro ◽

...

Keyword(s):

Quantum Well ◽

Free Space ◽

Optical Data ◽

Large Aperture ◽

Data Links

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Silicon-based nonlinear optical devices for high-speed optical communications

10.1117/12.762523 ◽

2008 ◽

Author(s):

Haisheng Rong ◽

Simon Ayotte ◽

Shengbo Xu ◽

Oded Cohen ◽

Mario Paniccia

Keyword(s):

Optical Communications ◽

High Speed ◽

Nonlinear Optical ◽

Optical Devices ◽

Nonlinear Optical Devices ◽

Silicon Based

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Optical Waveguides Embedded in PCBs - A Real World Application of 3D Structures Written by TPA

MRS Proceedings ◽

10.1557/proc-1054-ff01-04 ◽

2007 ◽

Vol 1054 ◽

Cited By ~ 3

Author(s):

Ruth Houbertz ◽

Herbert Wolter ◽

Volker Schmidt ◽

Ladislav Kuna ◽

Valentin Satzinger ◽

...

Keyword(s):

Optical Fibers ◽

Optical Waveguides ◽

High Speed ◽

Printed Circuit Boards ◽

Data Transfer ◽

Laser Pulses ◽

Photon Absorption ◽

Optical Data ◽

Direct Laser ◽

High Speed Data

ABSTRACTThe integration of optical interconnects in printed circuit boards (PCB) is a rapidly growing field worldwide due to a continuously increasing need for high-speed data transfer. There are any concepts discussed, among which are the integration of optical fibers or the generation of waveguides by UV lithography, embossing, or direct laser writing. The devices presented so far require many different materials and process steps, but particularly also highly-sophisticated assembly steps in order to couple the optoelectronic elements to the generated waveguides. In order to overcome these restrictions, an innovative approach is presented which allows the embedding of optoelectronic components and the generation of optical waveguides in only one optical material. This material is an inorganic-organic hybrid polymer, in which the waveguides are processed by two-photon absorption (TPA) processes, initiated by ultra-short laser pulses. In particular, due to this integration and the possibility ofin situpositioning the optical waveguides with respect to the optoelectronic components by the TPA process, no complex packaging or assembly is necessary. Thus, the number of necessary processing steps is significantly reduced, which also contributes to the saving of resources such as energy or solvents. The material properties and the underlying processes will be discussed with respect to optical data transfer in PCBs.

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