Modeling and simulation methodology for reconnaissance in VSW minefields with multiple autonomous vehicles

1999 ◽  
Author(s):  
A. J. Healey ◽  
J. Kim
Keyword(s):  
Modeling And Simulation ◽  
Autonomous Vehicles ◽  
Simulation Methodology

A Novel Collision-Free Path Planning Modeling and Simulation Methodology for Robotical Arms Using Resistive Grids

Robotica ◽  
2019 ◽  
Vol 38 (7) ◽  
pp. 1176-1190
Author(s):  
Carlos Hernández-Mejía ◽  
Héctor Vázquez-Leal ◽  
Delia Torres-Muñoz
Keyword(s):  
Path Planning ◽  
Modeling And Simulation ◽  
Free Path ◽  
Configuration Space ◽  
Robotic Arms ◽  
Simulation Methodology ◽  
Time Modeling ◽  
Starting Point ◽  
Resistive Grids ◽  
Planning Methodology

SUMMARYPath planning represents planning collision-free strategies to move from starting point to ending point. These strategies can be carried out for known and unknown environments. Recently, a novel and reduced CPU-time modeling and simulation methodology for path planning in known environment based on resistive grids (RGs) has been introduced. In this work, a novel modified version of Resistive Grid Path Planning Methodology (RGPPM) methodology is presented with the purpose of exploring collision-free path planning for robotic arms. This extension of the methodology allows to numerically relate positions in the RG with angular values of the robotic systems. In addition, it is possible to include obstacles in the configuration space, and therefore collision detection can be established for RGs. Finally, the variation of links for robotic arms and obstacles for configuration space is explored by simulating different scenarios.

System Co-Design Modeling Methodology of a High Speed (25Gbps) Multi-Rate 4-Channel Retimer: Simulation to Measurement Correlation

2018 ◽  
Vol 2018 (1) ◽  
pp. 000180-000185
Author(s):  
Tony Tang ◽  
Bridger Wray ◽  
Rajen Murugan
Keyword(s):  
Modeling And Simulation ◽  
Insertion Loss ◽  
Power Supply ◽  
High Speed ◽  
Return Loss ◽  
Electrical Performance ◽  
Laboratory Measurements ◽  
Simulation Methodology ◽  
Modeling Methodology ◽  
Bga Package

Abstract In this paper we detail the system (viz. silicon-package-pcb) electrical co-design of a 130nm BiCMOS high-speed (25Gbps) 4-channel multi-rate retimer, packaged in a small 6-mm × 6-mm FC BGA package, with integrated advanced signal conditioning circuitries. Electrical optimization of the silicon-package-pcb over the high speed channels, to achieve desired performance, was achieved through a coupled circuit-to-electromagnetic co-design modeling and simulation methodology. Key figure of merits for system electrical performance (viz. insertion loss, return loss, crosstalk/isolation, jitter, and power supply inductance and resistance parasitics, among others) are modeled and analyzed. Laboratory measurements on a retimer are presented that validate the integrity of the modeling methodology. Good correlation between modeling methodology and laboratory measurements is achieved.

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