On-chip signal processing configurations for focal plane arrays

1999 ◽  
Author(s):  
Christopher R. Baxter ◽  
Mark A. Massie
2006 ◽  
Vol 970 ◽  
Author(s):  
Dorota Temple ◽  
Christopher A. Bower ◽  
Dean Malta ◽  
James E. Robinson ◽  
Phillip R. Coffman ◽  
...  

ABSTRACTThis paper describes a technology for three-dimensional (3-D) integration of multiple layers of silicon integrated circuits. The technology promises to dramatically enhance on-chip signal processing capabilities of a variety of detector devices hybridized with Si electronics. The focus of the paper is on high performance infrared focal plane arrays based on HgCdTe, which offer the ultimate in infrared sensitivity and find application in high performance military systems. Performance data from test FPA devices with integrated multilayer Si stacks are discussed in this paper.


1992 ◽  
Author(s):  
Lester J. Kozlowski ◽  
Scott A. Cabelli ◽  
Robert E. Kezer ◽  
William E. Kleinhans
Keyword(s):  
X 132 ◽  
On Chip ◽  

2018 ◽  
Vol 7 (1-2) ◽  
pp. 81-101 ◽  
Author(s):  
Yu Li ◽  
Jiachen Li ◽  
Hongchen Yu ◽  
Hai Yu ◽  
Hongwei Chen ◽  
...  

AbstractThe explosive growth of data centers, cloud computing and various smart devices is limited by the current state of microelectronics, both in terms of speed and heat generation. Benefiting from the large bandwidth, promising low power consumption and passive calculation capability, experts believe that the integrated photonics-based signal processing and transmission technologies can break the bottleneck of microelectronics technology. In recent years, integrated photonics has become increasingly reliable and access to the advanced fabrication process has been offered by various foundries. In this paper, we review our recent works on the integrated optical signal processing system. We study three different kinds of on-chip signal processors and use these devices to build microsystems for the fields of microwave photonics, optical communications and spectrum sensing. The microwave photonics front receiver was demonstrated with a signal processing range of a full-band (L-band to W-band). A fully integrated microwave photonics transceiver without the on-chip laser was realized on silicon photonics covering the signal frequency of up 10 GHz. An all-optical orthogonal frequency division multiplexing (OFDM) de-multiplier was also demonstrated and used for an OFDM communication system with the rate of 64 Gbps. Finally, we show our work on the monolithic integrated spectrometer with a high resolution of about 20 pm at the central wavelength of 1550 nm. These proposed on-chip signal processing systems potential applications in the fields of radar, 5G wireless communication, wearable devices and optical access networks.


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