On-chip signal processing configurations for focal plane arrays

1999 ◽  
Author(s):  
Christopher R. Baxter ◽  
Mark A. Massie
Keyword(s):  
Signal Processing ◽  
Focal Plane ◽  
Focal Plane Arrays ◽  
On Chip ◽  
Chip Signal

3-D Integration Technology for High Performance Detector Arrays

2006 ◽  
Vol 970 ◽  
Author(s):  
Dorota Temple ◽  
Christopher A. Bower ◽  
Dean Malta ◽  
James E. Robinson ◽  
Phillip R. Coffman ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Focal Plane ◽  
High Performance ◽  
Three Dimensional ◽  
Focal Plane Arrays ◽  
Detector Arrays ◽  
Silicon Integrated Circuits ◽  
Military Systems ◽  
On Chip ◽  
Chip Signal

ABSTRACTThis paper describes a technology for three-dimensional (3-D) integration of multiple layers of silicon integrated circuits. The technology promises to dramatically enhance on-chip signal processing capabilities of a variety of detector devices hybridized with Si electronics. The focus of the paper is on high performance infrared focal plane arrays based on HgCdTe, which offer the ultimate in infrared sensitivity and find application in high performance military systems. Performance data from test FPA devices with integrated multilayer Si stacks are discussed in this paper.

10 x 132 CMOS/CCD readout with 25 μm pitch and on-chip signal processing including CDS and TDI

1992 ◽  
Author(s):  
Lester J. Kozlowski ◽  
Scott A. Cabelli ◽  
Robert E. Kezer ◽  
William E. Kleinhans
Keyword(s):  
Signal Processing ◽  
X 132 ◽  
On Chip ◽  
Chip Signal

On-chip photonic microsystem for optical signal processing based on silicon and silicon nitride platforms

2018 ◽  
Vol 7 (1-2) ◽  
pp. 81-101 ◽  
Author(s):  
Yu Li ◽  
Jiachen Li ◽  
Hongchen Yu ◽  
Hai Yu ◽  
Hongwei Chen ◽  
...  
Keyword(s):  
Signal Processing ◽  
Orthogonal Frequency Division Multiplexing ◽  
Optical Signal Processing ◽  
Microwave Photonics ◽  
Optical Signal ◽  
Smart Devices ◽  
Integrated Photonics ◽  
Central Wavelength ◽  
On Chip ◽  
Chip Signal

AbstractThe explosive growth of data centers, cloud computing and various smart devices is limited by the current state of microelectronics, both in terms of speed and heat generation. Benefiting from the large bandwidth, promising low power consumption and passive calculation capability, experts believe that the integrated photonics-based signal processing and transmission technologies can break the bottleneck of microelectronics technology. In recent years, integrated photonics has become increasingly reliable and access to the advanced fabrication process has been offered by various foundries. In this paper, we review our recent works on the integrated optical signal processing system. We study three different kinds of on-chip signal processors and use these devices to build microsystems for the fields of microwave photonics, optical communications and spectrum sensing. The microwave photonics front receiver was demonstrated with a signal processing range of a full-band (L-band to W-band). A fully integrated microwave photonics transceiver without the on-chip laser was realized on silicon photonics covering the signal frequency of up 10 GHz. An all-optical orthogonal frequency division multiplexing (OFDM) de-multiplier was also demonstrated and used for an OFDM communication system with the rate of 64 Gbps. Finally, we show our work on the monolithic integrated spectrometer with a high resolution of about 20 pm at the central wavelength of 1550 nm. These proposed on-chip signal processing systems potential applications in the fields of radar, 5G wireless communication, wearable devices and optical access networks.

Sign in / Sign up

Export Citation Format

Share Document