scholarly journals Surface-contamination-initiated laser damage

1997 ◽  
Author(s):  
Michael D. Feit ◽  
Alexander M. Rubenchik ◽  
Douglas R. Faux ◽  
Robert A. Riddle ◽  
Arthur B. Shapiro ◽  
...  
Keyword(s):  
Surface Contamination ◽  
Laser Damage

Study of surface contamination layer in silica thanks to laser damage investigation

2004 ◽  
Author(s):  
Bertrand Bertussi ◽  
Jean-Yves Natoli ◽  
Mireille Commandre ◽  
Claude Amra
Keyword(s):  
Surface Contamination ◽  
Laser Damage ◽  
Damage Investigation

scholarly journals Modeling of laser damage initiated by surface contamination

1997 ◽  
Author(s):  
Michael D. Feit ◽  
Alexander M. Rubenchik ◽  
Douglas R. Faux ◽  
Robert A. Riddle ◽  
Arthur B. Shapiro ◽  
...  
Keyword(s):  
Surface Contamination ◽  
Laser Damage

Rear-surface laser damage on 355-nm silica optics owing to Fresnel diffraction on front-surface contamination particles

2000 ◽  
Vol 39 (21) ◽  
pp. 3654 ◽  
Author(s):  
François Y. Génin ◽  
Michael D. Feit ◽  
Mark R. Kozlowski ◽  
Alexander M. Rubenchik ◽  
Alberto Salleo ◽  
...  
Keyword(s):  
Rear Surface ◽  
Front Surface ◽  
Fresnel Diffraction ◽  
Surface Contamination ◽  
Laser Damage ◽  
Surface Laser

scholarly journals Impact of the Polishing Suspension Concentration on Laser Damage of Classically Manufactured and Plasma Post-Processed Zinc Crown Glass Surfaces

2018 ◽  
Vol 8 (9) ◽  
pp. 1556 ◽  
Author(s):  
Christoph Gerhard ◽  
Marco Stappenbeck
Keyword(s):  
Damage Threshold ◽  
Surface Contamination ◽  
Laser Damage ◽  
Surface Finishing ◽  
Process Conditions ◽  
Post Processing ◽  
Suspension Concentration ◽  
Laser Induced Damage ◽  
Glass Surfaces ◽  
The Impact

The laser-induced damage threshold of optics is an issue of essential importance in high-power laser applications. However, the complex and partially interacting mechanisms as well as the underlying reasons for laser damage of glass surfaces are not yet fully understood. The aim of the present work is to contribute to a better understanding of such damage mechanisms by providing original results on the impact of classical glass surface machining on the laser-induced damage threshold. For this purpose, glass samples were prepared with well-defined process conditions in terms of the used lapping and polishing agents and suspensions. Further, the samples were post-processed by atmospheric pressure plasma for precision cleaning. The laser-induced damage threshold and surface contamination by residues from the manufacturing process were determined before and after plasma post-processing. It is shown that the polishing suspension concentration has a certain impact on the laser-induced damage threshold and surface contamination by residues from used working materials. The highest damage threshold of 15.2 J/cm² is found for the lowest surface contamination by carbon which occurs in the case of the highest polishing suspension concentration. After plasma treatment for merely 60 s, this value was increased to 20.3 J/cm² due to the removal of surface-adherent carbon. The results thus imply that the laser-induced damage threshold can notably be increased by first choosing appropriate process parameters during classical manufacturing and second plasma post-processing for surface finishing.

383. Field Evaluation of a Libs Sampler for Determining Surface Contamination Due to Beryllium

2002 ◽  
Author(s):  
M. Hoover ◽  
M. McCawley ◽  
D. Yereb ◽  
S. Tinkle ◽  
S. Beaton ◽  
...  
Keyword(s):  
Field Evaluation ◽  
Surface Contamination

Studies on a Failure Analysis Flow of Surface Contamination, Corrosion, and Underetch on Microchip Al Bondpads in Wafer Fabrication

2005 ◽  
Author(s):  
Hua Younan
Keyword(s):  
Failure Analysis ◽  
Galvanic Corrosion ◽  
Surface Contamination ◽  
Wafer Fabrication ◽  
Tof Sims ◽  
Corrosion Passivation

Abstract A failure analysis flow is developed for surface contamination, corrosion and underetch on microchip Al bondpads and it is applied in wafer fabrication. SEM, EDX, Auger, FTIR, XPS and TOF-SIMS are used to identify the root causes. The results from carbon related contamination, galvanic corrosion, fluorine-induced corrosion, passivation underetch and Auger bondpad monitoring will be presented. The failure analysis flow will definitely help us to select suitable methods and tools for failure analysis of Al bondpad-related issues, identify rapidly possible root causes of the failures and find the eliminating solutions at both wafer fabrication and assembly houses.

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