<title>Moire interferometry/termovision method for electronic package testing</title>

Integrated holographic interferometry and moire interferometry for deformation measurement in electronic package

10.1117/12.468847 ◽

2002 ◽

Author(s):

Y. P. Yang ◽

W. N. Wang ◽

L. Liu

Keyword(s):

Holographic Interferometry ◽

Moiré Interferometry ◽

Deformation Measurement ◽

Moire Interferometry ◽

Electronic Package

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Evaluation of Thermal Deformation Behavior in Electronic Package using UV moire interferometry

2005 International Symposium on Electronics Materials and Packaging ◽

10.1109/emap.2005.1598263 ◽

2006 ◽

Author(s):

Jin-Hyoung Park ◽

Soon-Bok Lee

Keyword(s):

Deformation Behavior ◽

Thermal Deformation ◽

Moiré Interferometry ◽

Moire Interferometry ◽

Electronic Package

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Health Monitoring for Electronic Package Using a Simple Moiré Interferometry

Journal of Solid Mechanics and Materials Engineering ◽

10.1299/jmmp.2.822 ◽

2008 ◽

Vol 2 (6) ◽

pp. 822-830 ◽

Cited By ~ 1

Author(s):

Jin-Hyoung PARK ◽

Soon-Bok LEE

Keyword(s):

Health Monitoring ◽

Moiré Interferometry ◽

Moire Interferometry ◽

Electronic Package

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OS4-8-1 Health monitoring for electronic package using a simple Moire interferometry

The Abstracts of ATEM International Conference on Advanced Technology in Experimental Mechanics Asian Conference on Experimental Mechanics ◽

10.1299/jsmeatem.2007.6._os4-8-1-1 ◽

2007 ◽

Vol 2007.6 (0) ◽

pp. _OS4-8-1-1-_OS4-8-1-6

Author(s):

Jin-Hyoung Park ◽

Soon-Bok Lee

Keyword(s):

Health Monitoring ◽

Moiré Interferometry ◽

Moire Interferometry ◽

Electronic Package

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Experimental analysis of thermal displacement and strain distributions in a small outline J-leaded electronic package by using wedged-glass phase-shifting moiré interferometry

Optics and Lasers in Engineering ◽

10.1016/j.optlaseng.2007.08.007 ◽

2008 ◽

Vol 46 (1) ◽

pp. 18-26 ◽

Cited By ~ 9

Author(s):

Yasuyuki Morita ◽

Kazuo Arakawa ◽

Mitsugu Todo

Keyword(s):

Experimental Analysis ◽

Glass Phase ◽

Moiré Interferometry ◽

Phase Shifting ◽

Moire Interferometry ◽

Thermal Displacement ◽

Electronic Package

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OS01W0152 Application of phase-shifting moire interferometry to thermal strain analysis of electronic package

The Abstracts of ATEM International Conference on Advanced Technology in Experimental Mechanics Asian Conference on Experimental Mechanics ◽

10.1299/jsmeatem.2003.2._os01w0152 ◽

2003 ◽

Vol 2003.2 (0) ◽

pp. _OS01W0152-_OS01W0152

Author(s):

Yasuyuki Morita ◽

Kazuo Arakawa ◽

Mitsugu Todo

Keyword(s):

Thermal Strain ◽

Strain Analysis ◽

Moiré Interferometry ◽

Phase Shifting ◽

Moire Interferometry ◽

Electronic Package

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OS1(4)-15(OS01W0152) Application of Phase-Shifting Moire Interferometry to Thermal Strain Analysis of Electronic Package

The Abstracts of ATEM International Conference on Advanced Technology in Experimental Mechanics Asian Conference on Experimental Mechanics ◽

10.1299/jsmeatem.2003.145 ◽

2003 ◽

Vol 2003 (0) ◽

pp. 145 ◽

Cited By ~ 1

Author(s):

Yasuyuki Morita ◽

Kazuo Arakawa ◽

Mitsugu Todo

Keyword(s):

Thermal Strain ◽

Strain Analysis ◽

Moiré Interferometry ◽

Phase Shifting ◽

Moire Interferometry ◽

Electronic Package

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Moire Interferometry Studies of PBX 9501

10.1063/1.1483664 ◽

2002 ◽

Cited By ~ 2

Author(s):

Philip J. Rae

Keyword(s):

Moiré Interferometry ◽

Moire Interferometry

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Developments In Moire Interferometry

Optical Engineering ◽

10.1117/12.7972930 ◽

1982 ◽

Vol 21 (3) ◽

Cited By ~ 74

Author(s):

Daniel Post

Keyword(s):

Moiré Interferometry ◽

Moire Interferometry

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Measuring corrosion using field-shifting moire interferometry

10.1117/12.230403 ◽

1996 ◽

Author(s):

Mark A. Michniewicz

Keyword(s):

Moiré Interferometry ◽

Moire Interferometry

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