Printed circuit board visual inspection performance: a comparative analysis of mono- and stereovision macroscopic views

1997 ◽  
Author(s):  
Steven F. Wiker ◽  
Ken Stewart ◽  
Tommey Meyers ◽  
Peregrin Spielholz
Keyword(s):  
Comparative Analysis ◽  
Visual Inspection ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Inspection Performance

scholarly journals Implementasi Adaptive Neural Fuzzy Inference System (ANFIS) Untuk Menguji Kualitas Printed Circuit Board (PCB)

2021 ◽  
Vol 5 (2) ◽  
pp. 79-90
Author(s):  
Tatang Rohana Cucu
Keyword(s):  
Visual Inspection ◽  
Printed Circuit Board ◽  
Fuzzy Inference ◽  
Circuit Board ◽  
Inspection System ◽  
Automated Visual Inspection ◽  
Inference System ◽  
Printed Circuit ◽  
Bahasa Indonesia ◽  
Neural Fuzzy

Pengujian kualitas menggunakan teknik pengolahan citra dan kecerdasan tiruan banyak diterapkan dalam berbagai industri, misalnya industri tekstil, perakitan kendaraan, makanan, minuman, perakitan elektronik, dan lain – lain. Pengujian model ini sering disebut dengan istilah Automated Visual Inspection System (AVIS) atau dalam bahasa Indonesia Sistem Inspeksi Visual Otomatis (SIVO). Penelitian ini mengacu pada model sistem inspeksi, di mana objek pengujiannya adalah keping Printed Circuit Board (PCB). Banyak penelitian tentang pengujian PCB yang sudah dilakukan, tetapi masih banyak yang belum memberikan hasil yang optimum, diantaranya waktu akses yang masih lambat, keakuratan data masih rendah, dan tingkat kesalahan yang masih tinggi. Berdasarkan hasil penelitian dan pengujian yang sudah dilakukan, model ANFIS sangat layak dijadikan sebagai model inferensi kecerdasan buatan dalam sistem yang berbasis inspeksi otomatis khususnya menguji kualitas keping PCB, karena terbukti model ANFIS dengan model hybrid trapesium mf memiliki tingkat kesalahan yang sangat kecil yaitu 4.0186e-007 dan untuk tingkat akurasi pengujian datanya mencapai 99%. 

Analysis of Fractures of Printed Circuit Board Traces

2012 ◽  
Author(s):  
Carl Nail ◽  
Larry Rice
Keyword(s):  
Crack Initiation ◽  
Fatigue Failure ◽  
Visual Inspection ◽  
Printed Circuit Board ◽  
Fracture Analysis ◽  
Circuit Board ◽  
Printed Circuit ◽  
Solder Mask ◽  
Cracking Mechanism

Abstract A PCB trace was repeatedly cracking in the same location. Visual inspection showed cracking there and at structurally similar locations, with solder mask missing from one side of the trace of interest. Fracture analysis suggested that these issues and etch pitting caused crack initiation, followed by fatigue failure that ultimately led to full fracture. A FIB section of a second failure reinforced the finding that the fundamental cracking mechanism was fatigue.

TRANSREFLECTOR ANTENNA DESIGN BASED ON FLAT MULTILAYER TRANSREFLECTOR

2019 ◽  
pp. 26-30 ◽  
Author(s):  
M. S. Batutina ◽  
A. A. Kuzmin ◽  
A. N. Mikhailov
Keyword(s):  
Comparative Analysis ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Antenna Design ◽  
Circuit Boards ◽  
Radiation Characteristics ◽  
Flat Structure ◽  
Printed Circuit ◽  
Electrodynamic Model

The paper considers an embodiment of the antenna design based on a flat non‑axis‑symmetrical transreflector made by using multilayer printed circuit board technology. The construction principle of a flat non‑axis‑symmetrical transreflector by cutting it from the flat polarizing structure is given. The form of the flat multi‑layer non‑axisymmetric transreflector board is determined by the projection of the non‑axisymmetric parabolic transflector onto a plane perpendicular to the focal axis. An electrodynamic model of the antenna with a flat non‑axis‑symmetrical reflector to study the radiation characteristics in the UHF range was constructed. A comparative analysis of the radiation characteristics of antennas on the basis of planar multilayer axisymmetric and flat multilayer non‑axis‑symmetrical transreflectors was performed. A number of technological advantages of the developed flat structure over a non‑axis‑symmetrical parabolic transreflector due to use of the known technology of multilayer printed circuit boards is also described.

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