Researching on the factors influencing the critical undeformed chip thickness of single crystal germanium

2021 ◽  
Author(s):  
Shanyi Ma ◽  
Hui Yang ◽  
Qian Chen ◽  
Haitao Yang
Keyword(s):  
Single Crystal ◽  
Chip Thickness ◽  
Undeformed Chip Thickness ◽  
Factors Influencing

Study on Influence Laws of Surface Roughness of Micro-Groove in Single Crystal Silicon under Diamond Fly-Cutting

2015 ◽  
Vol 667 ◽  
pp. 142-148 ◽  
Author(s):  
Yan Yan Yan ◽  
Run Xing Wang ◽  
Bo Zhao
Keyword(s):  
Surface Roughness ◽  
Single Crystal ◽  
Chip Thickness ◽  
Single Crystal Silicon ◽  
Spindle Speed ◽  
Cutting Depth ◽  
Crystal Silicon ◽  
Groove Surface ◽  
Undeformed Chip Thickness ◽  
Fly Cutting

Single crystal silicon has both important application value in the fields of micro-optics and MEMS, and it has been considered as one of the most difficult-to-cut materials because of its hardness and brittleness. Removal mechanism of the silicon was discussed, and the model of undeformed chip thickness was established in this article. According to the data of micro-groove surface roughness from the diamond fly-cutting experiment, the nonlinear relationship curve, between the largest undeformed chip thicknesshmaxand microgroove surface roughnessRa,were obtained using Gaussian-fitting principle, and the regression equation of the fitting curve was also got. Thus the prediction mathematical model of microgroove surface roughness was derived. The influence laws of the main working parameters on theRawere obtained based on the result of this experiment and the response surface of the prediction model, and some conclusions were summarized: the surface roughnessRaof microgroove in the single crystal silicon decreases with the decrease of the cutting depthap, the feed f and the increase of the spindle speednunder the diamond fly-cutting; the experimental results also showed that feedfaffects the value ofRavery much, cutting depthapless, and spindle speednthe least.

scholarly journals Geometric Analysis of Undeformed Chip Thickness in Ball-Nosed End Milling

2004 ◽  
Vol 47 (1) ◽  
pp. 2-7 ◽  
Author(s):  
Hisanobu TERAI ◽  
Minghui HAO ◽  
Koichi KIKKAWA ◽  
Yoshio MIZUGAKI
Keyword(s):  
End Milling ◽  
Geometric Analysis ◽  
Chip Thickness ◽  
Undeformed Chip Thickness

Investigation of effect of uncut chip thickness to edge radius ratio on nanoscale cutting behavior of single crystal copper: MD simulation approach

2020 ◽  
pp. 251659842093763
Author(s):  
A. Sharma ◽  
P. Ranjan ◽  
R. Balasubramaniam
Keyword(s):  
Molecular Dynamics ◽  
Single Crystal ◽  
Material Removal ◽  
Chip Thickness ◽  
Cutting Process ◽  
Uncut Chip Thickness ◽  
Edge Radius ◽  
Nanoscale Cutting ◽  
Cutting Behavior ◽  
Subsurface Defects

Extremely small cutting depths in nanoscale cutting makes it very difficult to measure the thermodynamic properties and understand the underlying mechanism and behavior of workpiece material. Highly precise single-crystal Cu is popularly employed in optical and electronics industries. This study, therefore, implements the molecular dynamics technique to analyze the cutting behavior and surface and subsurface phenomenon in the nanoscale cutting of copper workpieces with a diamond tool. Molecular dynamics simulation is carried out for different ratios of uncut chip thickness ( a) to cutting edge radius ( r) to investigate material removal mechanism, cutting forces, surface and subsurface defects, material removal rate (MRR), and stresses involved during the nanoscale cutting process. Calculation of forces and amount of plowing indicate that a/ r = 0.5 is the critical ratio for which the average values of both increase to maximum. Material deformation mechanism changes from shear slip to shear zone deformation and then to plowing and elastic rubbing as the cutting depth/uncut chip thickness is reduced. The deformation during nano-cutting in terms of dislocation density changes with respect to cutting time. During the cutting process, it is observed that various subsurface defects like point defects, dislocations and dislocation loops, stacking faults, and stair-rod dislocation take place.

The Role of Grain Tip Radius in Fine Grinding

1975 ◽  
Vol 97 (3) ◽  
pp. 1119-1125 ◽  
Author(s):  
G. K. Lal ◽  
M. C. Shaw
Keyword(s):  
Grain Size ◽  
Surface Finish ◽  
Chip Thickness ◽  
Radius Of Curvature ◽  
Undeformed Chip Thickness ◽  
Fine Grinding ◽  
Abrasive Grains ◽  
Grinding Conditions ◽  
Tip Radius

The scratches produced by single abrasive grains in overcut fly milling show that the transverse shape of a grain is closely approximated by an arc of a circle. This radius of curvature is found to be independent of grain type and grinding conditions but varies with the grain size. The equation for undeformed chip thickness for surface grinding is rederived in terms of this radius. The important role that the transverse curvature of the grain plays relative to surface finish is also discussed.

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